公开(公告)号：US20220416393A1

公开(公告)日：2022-12-29

申请号：US17359138

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Johanna Swan ,  Adel Elsherbini ,  Shawna Liff ,  Beomseok Choi ,  Qiang Yu

IPC: H01P3/16 ,  H01L25/065 ,  H01P1/208 ,  H01L23/538 ,  H01P5/107 ,  H01L23/66

Abstract: Waveguide interconnects for semiconductor packages are disclosed. An example semiconductor package includes a first semiconductor die, a second semiconductor die, and a substrate positioned between the first and second dies. The substrate includes a waveguide interconnect to provide a communication channel to carry an electromagnetic signal. The waveguide interconnect is defined by a plurality of through substrate vias (TSVs). The TSVs in a pattern around the at least the portion of the substrate to define a boundary of the communication channel.