SCALABLE INFIELD SCAN COVERAGE FOR MULTI-CHIP MODULE FOR FUCTIONAL SAFETY MISSION APPLICATION

    公开(公告)号:US20190049513A1

    公开(公告)日:2019-02-14

    申请号:US16017764

    申请日:2018-06-25

    Abstract: An apparatus of a multi-chip package (MCP) of a functional safety system, comprises a processor to be configured as a master chip in a master-slave arrangement with a slave chip in the MCP, and a memory coupled to the processor to store one or more infield test scan patterns. The processor includes a bock to couple the master chip to the slave chip via a high-speed input/output (IO) interface to retrieve the one or more infield test scan patterns from the memory via the master chip, and to provide the one or more infield test scan patterns to the slave chip via the high-speed IO interface in response to the functional safety system entering an infield test mode.

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