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公开(公告)号：US20200303852A1
公开(公告)日：2020-09-24
申请号：US16361537
申请日：2019-03-22
Applicant: Intel Corporation
Inventor： Zhimin Wan , Steven A. Klein , Chia-Pin Chiu , Shankar Devasenathipathy
Abstract: An integrated circuit (IC) socket comprising a housing with a land side, an opposing die side, and sidewalls around a perimeter of the housing. The housing comprises a first dielectric. A plurality of socket pins extends from the land side of the housing through socket pin holes in the housing over the die side of the housing. A second dielectric is within the interstitial regions between the socket pins and sidewalls of the socket pin holes. A frame structure extends around at least a portion of the perimeter of the housing, and a mesh structure is embedded within the first dielectric. The mesh structure has plurality of mesh filaments extending between the plurality of socket pin holes and coupled to the frame structure.
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公开(公告)号：US10455685B1
公开(公告)日：2019-10-22
申请号：US16159840
申请日：2018-10-15
Applicant: Intel Corporation
Inventor： Steven A. Klein , Kuang Liu , Thomas A. Boyd , Luis Gil Rangel , Muffadal Mukadem , Shelby A. Ferguson , Francis Toth, Jr. , Eric Buddrius , Ralph V. Miele , Sriram Srinivasan , Jeffory L. Smalley
IPC: H01L23/522 , H01L23/485 , H01L23/32 , H05K1/02 , H05K3/30 , H01R12/70 , H05K7/10 , H01L23/367 , H05K3/36
Abstract: An electronic device may include a circuit board, and the circuit board may include a dielectric material. A socket may be coupled to a first side of the circuit board, and the socket may be configured to receive a semiconductor package. A backing plate may be positioned on a second side of the circuit board. A spacer may be positioned between the backing plate and the circuit board. The spacer may alter the profile of the socket to provide a curved profile to the socket. The spacer may displace a portion of the socket in a first direction, for instance when the spacer is coupled between the backing plate and the circuit board.
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