公开(公告)号：US20170181339A1

公开(公告)日：2017-06-22

申请号：US14974113

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Pramod Malatkar ,  Xiao Lu ,  Daniel Chavez-Clemente

IPC: H05K13/04 ,  H05K3/30

CPC classification number: H05K13/0404 ,  H05K3/30 ,  H05K13/0408

Abstract: A method of assembly comprising providing an assembly probe, the assembly probe having an end coupling face; providing a droplet of fluid on the end coupling face of the assembly probe; coupling an electronic component to the end coupling face of the assembly probe with the fluid droplet, the electronic component having a peripheral dimension equal to or less than 2 mm in each of length, width and height; placing the electronic component on a substrate with the assembly probe; decoupling the electronic component from the end coupling face of the assembly probe; and assembling the electronic component to the substrate.