公开(公告)号：US11916003B2

公开(公告)日：2024-02-27

申请号：US16575307

申请日：2019-09-18

Applicant: Intel Corporation

Inventor： Xiao Lu ,  Jiongxin Lu ,  Christopher Combs ,  Alexander Huettis ,  John Harper ,  Jieping Zhang ,  Nachiket R. Raravikar ,  Pramod Malatkar ,  Steven A. Klein ,  Carl Deppisch ,  Mohit Sood

IPC: H01L23/48 ,  B23K3/06 ,  H01L23/498 ,  H01L23/538

CPC classification number: H01L23/49833 ,  B23K3/0623 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/5387

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.

公开(公告)号：US20230415253A1

公开(公告)日：2023-12-28

申请号：US17851968

申请日：2022-06-28

Applicant: Intel Corporation

Inventor： Sangeon Lee ,  Tingting Gao ,  Xiao Lu ,  Matthew T. Magnavita ,  Jiaqi Wu

IPC: B23K3/06

CPC classification number: B23K3/0638 ,  B23K2101/40

Abstract: A liquid metal (LM) dispensing apparatus and method for design and fabrication thereof. Components of the LM dispensing apparatus are designed and tooled based on a target pinout (e.g., a number of, arrangement of, and dimensions of, holes in a substrate to have LM injected therein) and desired LM material. Embodiments employ detachably attached needles using a locking means to provide leak-free interchangeability of the needles. The flexibility with needles makes replacing damaged needles more perfunctory. Embodiments contour the LM reservoir to enhance uniform LM flow to the needles and dispense or inject LM from multiple detachably attached needles concurrently.

公开(公告)号：US10278318B2

公开(公告)日：2019-04-30

申请号：US14974113

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Pramod Malatkar ,  Xiao Lu ,  Daniel Chavez-Clemente

IPC: H05K13/04 ,  H05K3/30

Abstract: A method of assembly comprising providing an assembly probe, the assembly probe having an end coupling face; providing a droplet of fluid on the end coupling face of the assembly probe; coupling an electronic component to the end coupling face of the assembly probe with the fluid droplet, the electronic component having a peripheral dimension equal to or less than 2 mm in each of length, width and height; placing the electronic component on a substrate with the assembly probe; decoupling the electronic component from the end coupling face of the assembly probe; and assembling the electronic component to the substrate.

公开(公告)号：US20230317619A1

公开(公告)日：2023-10-05

申请号：US17711978

申请日：2022-04-01

Applicant: Intel Corporation

Inventor： Ravindranath V. Mahajan ,  Srikant Nekkanty ,  Srinivas V. Pietambaram ,  Veronica Strong ,  Xiao Lu ,  Tarek A. Ibrahim ,  Karumbu Nathan Meyyappan ,  Dingying Xu ,  Kristof Darmawikarta

IPC: H01L23/538 ,  H01L21/48

CPC classification number: H01L23/5381 ,  H01L21/486 ,  H01L23/5384

Abstract: A microelectronic structure, a semiconductor package including the same, and a method of forming same. The microelectronic structures includes: a substrate defining a cavity therein; a bridge die within the cavity, the bridge die to electrically couple a pair of dies to be provided on a surface of the substrate; an electrical coupling layer between a top surface of the cavity and a bottom surface of the bridge die. The electrical coupling layer includes: a non-conductive component including a die bonding film and defining holes therein; and electrically conductive structures in the holes, the electrically conductive structures electrically coupling the substrate with the bridge die.

公开(公告)号：US20230299024A1

公开(公告)日：2023-09-21

申请号：US17696162

申请日：2022-03-16

Applicant: Intel Corporation

Inventor： Jiaqi Wu ,  Xiao Lu ,  Bohan Shan ,  Valery Ouvarov-Bancalero

IPC: H01L23/00 ,  B23K1/00 ,  B23K35/26

CPC classification number: H01L24/05 ,  B23K1/0008 ,  H01L24/14 ,  B23K35/26 ,  B23K2101/40

Abstract: In one embodiment, an integrated circuit apparatus comprises a substrate that includes electrical contacts on a first side of the substrate to couple the substrate to an integrated circuit die, a passivation layer on a second side of the substrate opposite the first side, metal pads on the second side of the substrate and within openings defined by the passivation layer, and solder bumps on the metal pads. The solder bumps are a material that is resistant to Gallium-based liquid metal embrittlement.

公开(公告)号：US20230197659A1

公开(公告)日：2023-06-22

申请号：US17556444

申请日：2021-12-20

Applicant: Intel Corporation

Inventor： Mukund Ayalasomayajula ,  Dinesh Padmanabhan Ramalekshmi Thanu ,  Rui Zhang ,  Xiao Lu ,  Robert Nickerson ,  Patrick Neel Stover

IPC: H01L23/00

CPC classification number: H01L24/16 ,  H01L24/03 ,  H01L24/81 ,  H01L2924/1432 ,  H01L2924/0105 ,  H01L2924/01029 ,  H01L2924/01047

Abstract: A die package comprises a substrate comprising a solder pad element, a semiconductor die coupled to the substrate, a solder layer comprising a first solder material deposited on the solder pad element, the first solder material having a first melting temperature, and an interconnect ball comprising a second solder material deposited on the solder layer, the second solder material having a second melting temperature that is less than the first melting temperature.

公开(公告)号：US20250128362A1

公开(公告)日：2025-04-24

申请号：US18492371

申请日：2023-10-23

Applicant: Intel Corporation

Inventor： Rui Zhang ,  Jiaqi Wu ,  Brian Franco ,  Xiao Lu ,  Mukul Renavikar

IPC: B23K35/26 ,  B23K35/02 ,  B23K103/08 ,  C22C13/02

Abstract: Solder materials and microelectronic devices and systems deploying the solder materials are discussed. The solder material includes a bulk material of tin and bismuth and particles interspersed in the tin and bismuth bulk material. The particles are a metal other than tin and bismuth, and an intermetallic compound is formed around the particles. The intermetallic compound includes the metal of the particles and tin or bismuth. The solder materials are deployed as interconnect structures to interconnect components, such as electrically coupling an integrated circuit package to a motherboard.

公开(公告)号：US20250112190A1

公开(公告)日：2025-04-03

申请号：US18477966

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Xiao Lu ,  Sangeon Lee ,  Jiaqi Wu ,  Tingting Gao ,  Matthew T. Magnavita ,  Ravindranath V. Mahajan

IPC: H01L23/00

Abstract: In one embodiment, an integrated circuit device includes a substrate and a component coupled to the substrate. The substrate includes first reservoirs comprising Gallium-based liquid metal (LM), second reservoirs, first channels between the first reservoirs, and second channels between the second reservoirs and respective first reservoirs. The component includes circuitry and conductive contacts connected to the circuitry. Each contact defines a cavity and a portion of each conductive contact is within a respective first reservoir of the substrate such that it is in contact with the LM in the first reservoir. The component further includes dielectric lines between the conductive contacts, and each dielectric line is at least partially within a respective first channel of the substrate.

公开(公告)号：US20250112106A1

公开(公告)日：2025-04-03

申请号：US18375337

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Tarek Gebrael ,  Darshan Ravoori ,  Matthew Magnavita ,  Aastha Uppal ,  Xiao Lu

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L25/00 ,  H01L25/10

Abstract: An integrated circuit (IC) device includes a device substrate with front- and backside IC dies and an integrated heat spreader over the backside die. The heat spreader and the backside die may be coupled to the backside of the device substrate within an array of contacts. The backside heat spreader may include a mask layer over a thermally conductive layer. The IC device may include or be coupled to second substrate (such as a motherboard). The backside heat spreader may be thermally coupled to a heat spreader or heat sink by vias through the second substrate. The backside heat spreader may enclose the backside IC die in an electrically conductive cage.

公开(公告)号：US20230317476A1

公开(公告)日：2023-10-05

申请号：US17712090

申请日：2022-04-02

Applicant: Intel Corporation

Inventor： Sangeon Lee ,  Tingting Gao ,  Xiao Lu ,  Jiaqi Wu ,  Matthew T. Magnavita ,  Andrew W. Carlson

IPC: H01L21/67 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L21/6715 ,  H01L23/49811 ,  H01L21/4853 ,  H01L21/4867

Abstract: In one embodiment, a direct injection device includes a head, a plunger, a reservoir, and multiple needles. The head controls extrusion of liquid stored in the reservoir of the direct injection device. For example, the head causes the plunger to compress the liquid in the reservoir, which causes the liquid to be extruded through the needles.