公开(公告)号：US09659848B1

公开(公告)日：2017-05-23

申请号：US15086899

申请日：2016-03-31

Applicant: Invensas Corporation

Inventor： Grant Villavicencio ,  Sangil Lee ,  Roseann Alatorre ,  Javier A. Delacruz ,  Scott McGrath

IPC: H01L23/48 ,  H01L21/00 ,  H01L23/498 ,  H01L23/31 ,  H01L23/495 ,  H01L23/043 ,  H01L23/053 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49811 ,  H01L21/4825 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/043 ,  H01L23/053 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/4952 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/81805 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/15313 ,  H01L2924/15333 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/014 ,  H01L2924/00012

Abstract: A component can include a generally planar element, a reinforcing dielectric layer overlying the generally planar element, an encapsulation overlying the reinforcing dielectric layer, and a plurality of wire bonds. Each wire bond can have a tip at a major surface of the encapsulation. The wire bonds can have first portions extending within the reinforcing dielectric layer. The first portions of at least some of the wire bonds can have bends that change an extension direction of the respective wire bond. The reinforcing dielectric layer can have protruding regions surrounding respective ones of the wire bonds, the protruding regions extending to greater peak heights from the first surface of the generally planar element than portions of the reinforcing dielectric layer between adjacent ones of the protruding regions. The peak heights of the protruding regions can coincide with points of contact between the reinforcing dielectric layer and individual wire bonds.

公开(公告)号：US20160104689A1

公开(公告)日：2016-04-14

申请号：US14969779

申请日：2015-12-15

Applicant: Invensas Corporation

Inventor： Scott Jay Crane ,  Simon J. S. McElrea ,  Scott McGrath ,  Weiping Pan ,  De Ann Eileen Melcher ,  Marc E. Robinson

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/3185 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2224/27452 ,  H01L2224/29005 ,  H01L2224/29006 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.

公开(公告)号：US20140213020A1

公开(公告)日：2014-07-31

申请号：US14242206

申请日：2014-04-01

Applicant: Invensas Corporation

Inventor： Scott Jay Crane ,  Simon J. S. McElrea ,  Scott McGrath ,  Weiping Pan ,  De Ann Eileen Melcher ,  Marc E. Robinson

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/3185 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2224/27452 ,  H01L2224/29005 ,  H01L2224/29006 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.

Abstract translation: 半导体管芯上的保形涂层提供了管芯和支撑件之间的粘附。 不需要额外的粘合剂将模具固定在支撑件上。 共形涂层在组装期间保护模具，并且用于使模具与模具可接触的导电部件电绝缘。 保形涂层可以是有机聚合物，例如聚对二甲苯。 此外，将模具粘附到可任选地是另一个模具的支撑件上的方法包括在模具和支撑件之间提供共形的涂层，以及加热模具和支撑件之间的涂层。 保形涂层可以设置在模具的表面的芯片附着区域上，或在支撑体的表面的模具安装区域上，或者在模具的表面的芯片附着区域上以及模具安装区域 的支撑体的表面; 并且可以在将模具放置在支撑件上之后提供保形涂层。