公开(公告)号：US09872112B2

公开(公告)日：2018-01-16

申请号：US14922073

申请日：2015-10-23

Applicant: Invensense, Inc.

Inventor： David Bolognia ,  Brian Moss

IPC: H04R9/08 ,  H04R11/04 ,  H04R17/02 ,  H04R19/04 ,  H04R21/02 ,  H04R25/00 ,  H04R3/00 ,  H04R5/027 ,  H04R19/00 ,  H04R1/04 ,  H04R1/10

CPC classification number: H04R19/04 ,  H04R1/04 ,  H04R1/10 ,  H04R3/002 ,  H04R3/005 ,  H04R5/027 ,  H04R19/005 ,  H04R25/00 ,  H04R2201/003 ,  H04R2410/05

Abstract: A microphone system has a package with a top, a bottom, and four sides that at least in part form an interior chamber. One of the sides forms an inlet aperture for communicating the inlet chamber with the exterior environment. The system also has first and second microphone dies, in a stacked relationship, respectively having a first and second diaphragms. A circuit die, positioned in electrical communication with the first and second microphone dies, is configured to mitigate vibrational noise from the first microphone die using a signal produced by the second microphone die or vice versa. The first and second microphone dies are positioned so that the first and second diaphragms are substantially the same distance from the inlet aperture in the side.

公开(公告)号：US20170318385A1

公开(公告)日：2017-11-02

申请号：US15142696

申请日：2016-04-29

Applicant: INVENSENSE, INC.

Inventor： Kieran Harney ,  Adrianus Maria Lafort ,  Brian Moss ,  Dion Ivo De Roo

IPC: H04R3/00 ,  H03F3/183 ,  H02M3/07 ,  H03F3/45 ,  H04R19/04 ,  H04R19/00

CPC classification number: H04R3/00 ,  B81B7/008 ,  H02M3/07 ,  H03F3/183 ,  H03F3/45071 ,  H03F2200/03 ,  H04R3/04 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

Abstract: Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.

公开(公告)号：US20140211957A1

公开(公告)日：2014-07-31

申请号：US13755795

申请日：2013-01-31

Applicant: Invensense, Inc.

Inventor： David Bolognia ,  Brian Moss

IPC: H04R3/00

CPC classification number: H04R19/04 ,  H04R1/04 ,  H04R1/10 ,  H04R3/002 ,  H04R3/005 ,  H04R5/027 ,  H04R19/005 ,  H04R25/00 ,  H04R2201/003 ,  H04R2410/05

Abstract: A microphone system has a package with a top, a bottom, and four sides that at least in part form an interior chamber. One of the sides forms an inlet aperture for communicating the inlet chamber with the exterior environment. The system also has first and second microphone dies, in a stacked relationship, respectively having a first and second diaphragms. A circuit die, positioned in electrical communication with the first and second microphone dies, is configured to mitigate vibrational noise from the first microphone die using a signal produced by the second microphone die or vice versa. The first and second microphone dies are positioned so that the first and second diaphragms are substantially the same distance from the inlet aperture in the side.

Abstract translation: 麦克风系统具有包括顶部，底部以及至少部分地形成内部腔室的四个侧面的包装。 一个侧面形成用于将入口室与外部环境连通的入口孔。 该系统还具有分别具有第一和第二隔膜的堆叠关系的第一和第二麦克风管芯。 定位成与第一和第二麦克风管芯电连通的电路管芯被配置为使用由第二麦克风管芯产生的信号来减轻来自第一麦克风管芯的振动噪声，反之亦然。 第一和第二麦克风模具被定位成使得第一和第二隔膜与侧面中的入口孔基本相同。