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    Noise mitigating microphone system
    1.
    发明授权
    Noise mitigating microphone system 有权
    减噪麦克风系统

    公开(公告)号：US09173024B2

    公开(公告)日：2015-10-27

    申请号：US13755795

    申请日：2013-01-31

    Applicant: Invensense, Inc.

    Inventor： David Bolognia ,  Brian Moss

    IPC: H04R25/00 ,  H04R9/08 ,  H04R11/04 ,  H04R17/02 ,  H04R19/04 ,  H04R21/02 ,  H04R3/00 ,  H04R5/027

    CPC classification number: H04R19/04 ,  H04R1/04 ,  H04R1/10 ,  H04R3/002 ,  H04R3/005 ,  H04R5/027 ,  H04R19/005 ,  H04R25/00 ,  H04R2201/003 ,  H04R2410/05

    Abstract: A microphone system has a package with a top, a bottom, and four sides that at least in part form an interior chamber. One of the sides forms an inlet aperture for communicating the inlet chamber with the exterior environment. The system also has first and second microphone dies, in a stacked relationship, respectively having a first and second diaphragms. A circuit die, positioned in electrical communication with the first and second microphone dies, is configured to mitigate vibrational noise from the first microphone die using a signal produced by the second microphone die or vice versa. The first and second microphone dies are positioned so that the first and second diaphragms are substantially the same distance from the inlet aperture in the side.

    Abstract translation: 麦克风系统具有包括顶部，底部以及至少部分地形成内部腔室的四个侧面的包装。 一个侧面形成用于将入口室与外部环境连通的入口孔。 该系统还具有分别具有第一和第二隔膜的堆叠关系的第一和第二麦克风管芯。 定位成与第一和第二麦克风管芯电连通的电路管芯被配置为使用由第二麦克风管芯产生的信号来减轻来自第一麦克风管芯的振动噪声，反之亦然。 第一和第二麦克风模具被定位成使得第一和第二隔膜与侧面中的入口孔基本相同。

    Microphone module with sound pipe
    2.
    发明授权
    Microphone module with sound pipe 有权

    公开(公告)号：US10257610B2

    公开(公告)日：2019-04-09

    申请号：US15482637

    申请日：2017-04-07

    Applicant: Invensense, Inc.

    Inventor： Kieran P. Harney ,  Dipak Sengupta ,  Brian Moss ,  Alain V. Guery

    IPC: H04R1/34 ,  H04R19/00 ,  H04R19/04 ,  H04R1/08 ,  H04R1/04

    Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.

    NOISE MITIGATING MICROPHONE SYSTEM
    4.
    发明申请
    NOISE MITIGATING MICROPHONE SYSTEM 有权
    噪音减弱麦克风系统

    公开(公告)号：US20160050499A1

    公开(公告)日：2016-02-18

    申请号：US14922073

    申请日：2015-10-23

    Applicant: Invensense, Inc.

    Inventor： David Bolognia ,  Brian Moss

    IPC: H04R19/04

    CPC classification number: H04R19/04 ,  H04R1/04 ,  H04R1/10 ,  H04R3/002 ,  H04R3/005 ,  H04R5/027 ,  H04R19/005 ,  H04R25/00 ,  H04R2201/003 ,  H04R2410/05

    Abstract: A microphone system has a package with a top, a bottom, and four sides that at least in part form an interior chamber. One of the sides forms an inlet aperture for communicating the inlet chamber with the exterior environment. The system also has first and second microphone dies, in a stacked relationship, respectively having a first and second diaphragms. A circuit die, positioned in electrical communication with the first and second microphone dies, is configured to mitigate vibrational noise from the first microphone die using a signal produced by the second microphone die or vice versa. The first and second microphone dies are positioned so that the first and second diaphragms are substantially the same distance from the inlet aperture in the side.

    Abstract translation: 麦克风系统具有包括顶部，底部以及至少部分地形成内部腔室的四个侧面的包装。 一个侧面形成用于将入口室与外部环境连通的入口孔。 该系统还具有分别具有第一和第二隔膜的堆叠关系的第一和第二麦克风管芯。 定位成与第一和第二麦克风管芯电连通的电路管芯被配置为使用由第二麦克风管芯产生的信号来减轻来自第一麦克风管芯的振动噪声，反之亦然。 第一和第二麦克风模具被定位成使得第一和第二隔膜与侧面中的入口孔基本相同。

    MICROPHONE MODULE WITH SOUND PIPE
    8.
    发明申请
    MICROPHONE MODULE WITH SOUND PIPE 审中-公开
    麦克风模块与声管

    公开(公告)号：US20160044409A1

    公开(公告)日：2016-02-11

    申请号：US14920849

    申请日：2015-10-22

    Applicant: Invensense, Inc.

    Inventor： Kieran P. Harney ,  Dipak Sengupta ,  Brian Moss ,  Alain V. Guery

    IPC: H04R1/34 ,  H04R19/04 ,  H04R19/00 ,  H04R1/04

    CPC classification number: H04R1/342 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R1/04 ,  H04R1/08 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11 ,  H01L2924/00014

    Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.

    Abstract translation: 麦克风模块具有带孔的基板，以允许声波通过基板，安装到基板上以限定第一内部空间的盖，安装到第一内部空间内的基板的麦克风以及耦合到该基板的壳体 衬底并覆盖孔径。 壳体形成第二内部容积并且包括被配置为允许声音进入第二内部容积的声学端口。 模块还包括从壳体中的声学接口延伸的管道，以及在第二内部容积体外部的至少一个外部接口焊盘。 管道具有接收声波的开口端，并将它们引导到壳体中的声学端口。 此外，至少一个外部接口垫电连接到麦克风。

    Micro-electro-mechanical system microphone with dual backplates
    10.
    发明授权
    Micro-electro-mechanical system microphone with dual backplates 有权

    公开(公告)号：US10206047B2

    公开(公告)日：2019-02-12

    申请号：US15141335

    申请日：2016-04-28

    Applicant: INVENSENSE, INC.

    Inventor： Kieran Harney ,  Adrianus Maria Lafort ,  Brian Moss ,  Dion Ivo De Roo

    IPC: H04R19/04 ,  H04R1/04 ,  B81B3/00 ,  H04R7/06 ,  H04R19/01

    Abstract: Improving noise rejection of a micro-electro-mechanical system (MEMS) microphone by utilizing a membrane sandwiched between oppositely biased backplates is presented herein. The MEMS microphone can comprise a diaphragm that converts an acoustic pressure into an electrical signal; a first backplate capacitively coupled to a first side of the diaphragm—the first backplate biased at a first direct current (DC) voltage; a second backplate capacitively coupled to a second side of the diaphragm—the second backplate biased at a second DC voltage; and an electronic amplifier that buffers the electrical signal to generate a buffered output signal representing the acoustic pressure.

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