公开(公告)号：US20230278235A1

公开(公告)日：2023-09-07

申请号：US18117716

申请日：2023-03-06

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: B25J15/00 ,  B25J11/00 ,  H01L21/687

CPC classification number: B25J15/0014 ,  B25J11/0095 ,  H01L21/68707 ,  B25J19/025

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US11059183B2

公开(公告)日：2021-07-13

申请号：US16806373

申请日：2020-03-02

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: H01L21/687 ,  B25J15/00 ,  B25J11/00 ,  B25J19/02

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US20200306990A1

公开(公告)日：2020-10-01

申请号：US16806373

申请日：2020-03-02

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: B25J15/00 ,  B25J11/00 ,  H01L21/687

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.