公开(公告)号：US11602859B2

公开(公告)日：2023-03-14

申请号：US17374846

申请日：2021-07-13

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: H01L21/687 ,  B25J15/00 ,  B25J11/00 ,  B25J19/02

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US12042930B2

公开(公告)日：2024-07-23

申请号：US18117716

申请日：2023-03-06

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: H01L21/687 ,  B25J11/00 ,  B25J15/00 ,  B25J19/02

CPC classification number: B25J15/0014 ,  B25J11/0095 ,  H01L21/68707 ,  B25J19/025 ,  Y10S414/141

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US20220143843A1

公开(公告)日：2022-05-12

申请号：US17374846

申请日：2021-07-13

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: B25J15/00 ,  B25J11/00 ,  H01L21/687

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US11286984B2

公开(公告)日：2022-03-29

申请号：US16461094

申请日：2017-11-16

Applicant: Jabil Inc.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Payman Rahimi ,  Michael McKenney ,  Kwok Yu ,  George Kovatchev ,  Jeffrey Villegas ,  Ward Palmer ,  Jose Luna

IPC: F16C32/06 ,  B23P19/10 ,  B25J17/02

Abstract: The disclosure provides an apparatus, system and method for a moveable bearing stage that allows for highly refined alignment and placement, and particularly planar alignment and placement, of component or devices through the use of robotics. The apparatus, system and method of providing at least a planar alignment of at least one component or device in relation to a secondary reference plane may include at least: a frame and stator assembly, having, at an upper portion thereof, at least a semi-spherical receiving interface; a movable assembly that moves within the frame and stator assembly, and that is connectively associated therewith by at least a plurality of springs; a semi-spherical stage, suitable for reception by the semi-spherical receiving interface and capable of at least rotational movement therewithin; a chuck within the semi-spherical stage and capable of at least co-planar, post-planar, and ante-planar positioning in relation to a plane provided by a topmost portion of the semispherical stage, wherein the chuck is capable of receiving the component or device; and at least two gripper jaws suitable for receiving and holding, at an upper portion thereof, the component or device, wherein the two gripper jaws comprise, at a lower portion thereof, at least ramps capable of physically interacting with ones of the motion stops.

公开(公告)号：US20180161989A1

公开(公告)日：2018-06-14

申请号：US15889410

申请日：2018-02-06

Applicant: Jabil Inc.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: B25J15/00 ,  H01L21/687 ,  B25J11/00

CPC classification number: B25J15/0014 ,  B25J11/0095 ,  H01L21/68707 ,  Y10S414/141

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US20230278235A1

公开(公告)日：2023-09-07

申请号：US18117716

申请日：2023-03-06

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: B25J15/00 ,  B25J11/00 ,  H01L21/687

CPC classification number: B25J15/0014 ,  B25J11/0095 ,  H01L21/68707 ,  B25J19/025

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US11059183B2

公开(公告)日：2021-07-13

申请号：US16806373

申请日：2020-03-02

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: H01L21/687 ,  B25J15/00 ,  B25J11/00 ,  B25J19/02

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US20200306990A1

公开(公告)日：2020-10-01

申请号：US16806373

申请日：2020-03-02

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: B25J15/00 ,  B25J11/00 ,  H01L21/687

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US20200056658A1

公开(公告)日：2020-02-20

申请号：US16461094

申请日：2017-11-16

Applicant: Jabil Inc.

Inventor： Jeroen BOSBOOM ,  Babak Naderi ,  Payman Rahimi ,  Michael McKenney ,  Kwok Yu ,  George Kovatchev ,  Jeffrey Villegas ,  Ward Palmer ,  Jose Luna

IPC: F16C32/06 ,  B23P19/10

Abstract: The disclosure provides an apparatus, system and method for a moveable bearing stage that allows for highly refined alignment and placement, and particularly planar alignment and placement, of component or devices through the use of robotics. The apparatus, system and method of providing at least a planar alignment of at least one component or device in relation to a secondary reference plane may include at least: a frame and stator assembly, having, at an upper portion thereof, at least a semi-spherical receiving interface; a movable assembly that moves within the frame and stator assembly, and that is connectively associated therewith by at least a plurality of springs; a semi-spherical stage, suitable for reception by the semi-spherical receiving interface and capable of at least rotational movement therewithin; a chuck within the semi-spherical stage and capable of at least co-planar, post-planar, and ante-planar positioning in relation to a plane provided by a topmost portion of the semispherical stage, wherein the chuck is capable of receiving the component or device; and at least two gripper jaws suitable for receiving and holding, at an upper portion thereof, the component or device, wherein the two gripper jaws comprise, at a lower portion thereof, at least ramps capable of physically interacting with ones of the motion stops.

公开(公告)号：US20240424688A1

公开(公告)日：2024-12-26

申请号：US18753634

申请日：2024-06-25

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: B25J15/00 ,  B25J11/00 ,  B25J19/02 ,  H01L21/687

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.