公开(公告)号：US12040135B2

公开(公告)日：2024-07-16

申请号：US18107154

申请日：2023-02-08

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Nathan A. Reed ,  Allen Templeton ,  James R. Magee ,  James Davis ,  Abhijit Gurav ,  Hunter Hayes ,  Hanzheng Guo

IPC: H01G4/12 ,  C04B35/465 ,  C04B35/495 ,  C04B35/50 ,  H01G4/30 ,  H01G4/40

CPC classification number: H01G4/1245 ,  C04B35/465 ,  C04B35/495 ,  C04B35/50 ,  H01G4/1227 ,  H01G4/30 ,  H01G4/306 ,  H01G4/40 ,  C04B2235/66

Abstract: Provided is an improved multilayered ceramic capacitor and an electronic device comprising the multilayered ceramic capacitor. The multilayer ceramic capacitor comprises first conductive plates electrically connected to first external terminations and second conductive plates electrically connected to second external terminations. The first conductive plates and second conductive plates form a capacitive couple. A ceramic portion is between the first conductive plates and said second conductive plates wherein the ceramic portion comprises paraelectric ceramic dielectric. The multilayer ceramic capacitor has a rated DC voltage and a rated AC VPP wherein the rated AC VPP is higher than the rated DC voltage.

公开(公告)号：US20210327646A1

公开(公告)日：2021-10-21

申请号：US17233796

申请日：2021-04-19

Applicant: KEMET Electronics Corporation

Inventor： Mark R. Laps ,  John Bultitude ,  Philip M. Lessner ,  Lonnie G. Jones ,  Allen Templeton ,  Nathan A. Reed

IPC: H01G4/258 ,  H01G4/30 ,  H01G4/38 ,  H01G4/012 ,  H01G4/232

Abstract: Provided is a heat dissipating capacitor comprising internal electrodes of opposing polarity forming a capacitive couple between external terminations. A dielectric is between the internal electrodes. The heat dissipating capacitor comprises at least one thermal dissipation layer and at least one thermal conductive termination wherein the thermal dissipation layer is in thermally conductive contact with the thermal conductive termination.

公开(公告)号：US20200273791A1

公开(公告)日：2020-08-27

申请号：US16553395

申请日：2019-08-28

Applicant: KEMET Electronics Corporation

Inventor： Allen Templeton ,  John Bultitude ,  Lonnie G. Jones ,  Philip M. Lessner

IPC: H01L23/498 ,  H01L23/522 ,  H01L23/367 ,  H01L29/778

Abstract: An improved electronic assembly is provided. The electronic assembly comprises a ceramic interposer comprising multiple layers. The active layers of the multiple layers form an embedded capacitor comprising parallel electrodes with a dielectric between adjacent electrodes wherein adjacent electrodes have opposite polarity. A wide band gap device is also on the multilayered ceramic interposer.