公开(公告)号：US20190174622A1

公开(公告)日：2019-06-06

申请号：US16270081

申请日：2019-02-07

Applicant: KURARAY CO., LTD.

Inventor： Kazuyuki OHMORI ,  Tatsuya SUNAMOTO

IPC: H05K1/02 ,  H05K3/28 ,  H05K1/03 ,  H05K1/09 ,  B29C43/18 ,  B29C37/00

Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.