公开(公告)号：US20220264226A1

公开(公告)日：2022-08-18

申请号：US17662521

申请日：2022-05-09

Applicant: KURARAY CO., LTD.

Inventor： Tatsuya SUNAMOTO ,  Xianwen ZHANG

IPC: H04R7/12 ,  H04R7/18 ,  H04R31/00

Abstract: Provided is an acoustic diaphragm with required properties for a vibrating part and an edge part thereof. The acoustic diaphragm comprises a vibrating part 11 and an edge part 12 located at an outer periphery of the vibrating part, wherein the vibrating part comprises a thermoplastic liquid crystal polymer (TLCP) having a certain composition; the edge part comprises a TLCP having a same composition as the TLCP of the vibrating part; and the vibrating part 11 and the edge part 12 have elastic moduli Ed and Ee measured by nanoindentation technique, respectively, which satisfy the following formula: Ed>Ee. For example, a ratio Ed/Ee of the elastic modulus Ed of the vibrating part 11 to the elastic modulus Ee of the edge part 12 may fall within a range of from 1.05 to 5.0.

公开(公告)号：US20210289618A1

公开(公告)日：2021-09-16

申请号：US17336436

申请日：2021-06-02

Applicant: KURARAY CO., LTD.

Inventor： Tatsuya SUNAMOTO ,  Minoru ONODERA

IPC: H05K1/02 ,  H01L23/14 ,  H01L23/498

Abstract: Provided are a circuit board including an insulating layer including a thermoplastic liquid crystal polymer and having excellent insulation reliability under a high voltage; and a high voltage device using the same. The circuit board (30) is a high voltage circuit board including an insulating layer (31) and a high voltage circuit layer (34), wherein the insulating layer includes a thermoplastic liquid crystal polymer. It is preferable that the circuit board includes a heat dissipation part (39) for dissipating heat from the insulating layer (31).

公开(公告)号：US20210251074A1

公开(公告)日：2021-08-12

申请号：US17245542

申请日：2021-04-30

Applicant: KURARAY CO., LTD.

Inventor： Minoru ONODERA ,  Tatsuya SUNAMOTO ,  Takeshi TAKAHASHI ,  Takahiro NAKASHIMA

IPC: H05K1/03 ,  H05K1/02

Abstract: Provided is a thermoplastic liquid crystal polymer film (TLCP film) having a dielectric constant in a thickness direction of the film, which is suitable for a millimeter-wave radar substrate. The TLCP film is a film comprising a thermoplastic polymer capable of forming an optically anisotropic melt phase, wherein the TLCP film has a dielectric constant of from 2.5 to 3.2 in the thickness direction of the film at a temperature of 23° C. and a frequency of 20 GHz, and a heat deformation temperature of from 180 to 320° C. The TLCP film has, on a film plane, dielectric constants of from 2.6 to 3.7 at a temperature of 23° C. and a frequency of 15 GHz both in one direction of the film and in a direction perpendicular to the one direction of the film.

公开(公告)号：US20200290315A1

公开(公告)日：2020-09-17

申请号：US16082087

申请日：2017-03-02

Applicant: KURARAY CO., LTD.

Inventor： Shinji HIRAMATSU ,  Takahito NAKASHIMA ,  Tatsuya SUNAMOTO ,  Shigeaki SUZUKI

IPC: B32B15/08 ,  B32B15/20 ,  C23C14/28 ,  C23C14/20 ,  C23C28/02 ,  C25D5/56 ,  C25D3/38 ,  H05K1/03 ,  H05K3/46

Abstract: A metal-clad laminate (1) includes a thermoplastic liquid crystal polymer film (2), a metal deposition layer (4) formed on one surface of the thermoplastic liquid crystal polymer film (2), and metal foil (6) laminated to the other surface of the thermoplastic liquid crystal polymer film (2).

公开(公告)号：US20160255715A1

公开(公告)日：2016-09-01

申请号：US15140097

申请日：2016-04-27

Applicant: KURARAY CO., LTD.

Inventor： Kazuyuki OHMORI ,  Tatsuya SUNAMOTO

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/28

CPC classification number: H05K1/0245 ,  B29C37/0075 ,  B29C43/18 ,  B29C43/203 ,  H05K1/0237 ,  H05K1/0242 ,  H05K1/0296 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/281 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2203/068 ,  Y10T156/10

Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.

公开(公告)号：US20250096452A1

公开(公告)日：2025-03-20

申请号：US18729637

申请日：2023-01-17

Applicant: KURARAY CO., LTD.

Inventor： Keisuke IKEDA ,  Tatsuya SUNAMOTO ,  Minoru ONODERA

IPC: H01Q1/12

Abstract: An antenna system includes: a laminate including a plurality of high-frequency permeable layers; and an antenna circuit board including a high-frequency insulating layer. n-th layer of the plurality of high-frequency permeable layers has a thickness Ln within a range of Lnmin ±λ(10√εn). The n-th layer is at least one high-frequency permeable layer of the laminate. εn denotes a relative dielectric constant of the n-th layer; λ denotes a wavelength of the high-frequency wave that is incident on the laminate; and Lnmin denotes a thickness of the n-th layer where an intensity of a reflected wave from the laminate is minimized, the intensity being determined as an intensity of a composite wave of reflected waves from a front surface, a back surface, and joint interfaces of the laminate.

公开(公告)号：US20140231123A1

公开(公告)日：2014-08-21

申请号：US14259544

申请日：2014-04-23

Applicant: KURARAY CO., LTD.

Inventor： Minoru ONODERA ,  Tatsuya SUNAMOTO ,  Shuji MATSUNAGA ,  Takafumi KONNO

IPC: H05K1/03 ,  B32B37/18 ,  B32B15/09

CPC classification number: H05K1/0313 ,  B32B15/08 ,  B32B15/09 ,  B32B15/20 ,  B32B27/20 ,  B32B27/286 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B37/06 ,  B32B37/10 ,  B32B37/182 ,  B32B2250/42 ,  B32B2305/55 ,  B32B2307/202 ,  B32B2309/02 ,  B32B2309/105 ,  B32B2457/00 ,  C08J5/18 ,  C08J2300/12 ,  C08J2367/03 ,  C09K19/3809 ,  H05K1/024 ,  H05K1/032 ,  H05K1/0326 ,  H05K3/022 ,  H05K3/4626 ,  H05K2201/0141 ,  H05K2203/068 ,  Y10T428/31678

Abstract: To provide a thermoplastic liquid crystal polymer film capable of suppressing change in relative dielectric constant before and after heating, and a laminated and a circuit board using the same. In this film, a change ratio of a dielectric constant (∈r2) of the film after heating to a dielectric constant (∈r1) of the film before the heating satisfies the following formula (I) where the film is heated for 1 hour at a temperature in a range from a temperature being 30° C. lower than a melting point of the film to a temperature being 10° C. higher than the melting point, |∈r2−∈r1|/∈r1×100≦5  (I) where ∈r1 denotes the relative dielectric constant before the heating, ∈r2 denotes the relative dielectric constant after the heating. These relative dielectric constants are measured at the same frequency in a range of 1 to 100 GHz.

Abstract translation: 提供能够抑制加热前后相对介电常数的变化的热塑性液晶聚合物膜，以及使用该热塑性液晶聚合物膜的层叠电路板。 在该膜中，加热后的膜的介电常数（εr2）与加热前的膜的介电常数（εr1）的变化率满足下式（I），其中将膜加热1小时 | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | I）其中∈r1表示加热前的相对介电常数，∈r2表示加热后的相对介电常数。 这些相对介电常数在1至100GHz的范围内以相同的频率进行测量。

公开(公告)号：US20220105689A1

公开(公告)日：2022-04-07

申请号：US17349008

申请日：2021-06-16

Applicant: KURARAY CO., LTD.

Inventor： Takahiro NAKASHIMA ,  Minoru ONODERA ,  Tatsuya SUNAMOTO

IPC: B29C65/02 ,  H05K1/03 ,  B32B27/08 ,  B32B7/12 ,  B32B7/02 ,  C08J5/12 ,  C09J5/06 ,  B29C65/00 ,  H05K3/46

Abstract: Provided are a method for producing a thermoplastic liquid crystal polymer (TLCP) film having an improved thermo-adhesive property, a circuit board, and a method for producing the same. The production method of the TLCP film includes preparing a TLCP film as the adherend film and a TLCP film as the adhesive film;
examining each of the prepared TLCP films for a relative intensity calculated as a ratio in percentage of a sum of peak areas of C—O bond peak and COO bond peak based on the total area of C1s peaks in the XPS spectral profile so as to calculate a relative intensity X (%) as for the prepared adherend film and a relative intensity Y (%) as for the prepared adhesive film; and
controlling the TLCP film as the adhesive film to have a relative intensity Y by selection or activation treatment of the adhesive film so that the relative intensity X of the adherend film and the relative intensity Y of the controlled adhesive film satisfy the following formulae (1) and (2): 38

公开(公告)号：US20210197527A1

公开(公告)日：2021-07-01

申请号：US17059775

申请日：2019-05-27

Applicant: KURARAY CO., LTD.

Inventor： Tatsuya SUNAMOTO ,  Shinji HIRAMATSU ,  Minoru ONODERA

IPC: B32B15/08 ,  B32B7/12 ,  B32B38/00 ,  C08J5/12 ,  C09J5/02

Abstract: A thermoplastic liquid crystal polymer (TLCP) molded body including a thermoplastic polymer capable of forming an optically anisotropic melt phase. The TLCP molded body includes an adherend portion in at least a part of the TLCP molded body. The adherend portion has a surface satisfying: a ratio / of 1.5 or greater in which the represents a proportion of a peak area of [C—O bond] to a C(1s) peak area, and the represents a proportion of a peak area of [COO bond] based on the C(1s) peak area; and a ratio / of 0.10 or higher in which the represents a proportion of a peak area of [C═O bond] based on the C(1s) peak area, and the represents the proportion of the peak area of the [COO bond] based on the C(1s) peak area in a result of X-ray photoelectron spectroscopy analysis.

公开(公告)号：US20200017769A1

公开(公告)日：2020-01-16

申请号：US16577105

申请日：2019-09-20

Applicant: Kuraray Co., Ltd.

Inventor： Takafumi KONNO ,  Tatsuya SUNAMOTO ,  Michiyuki NANBA ,  Tetsuya HARA

IPC: C09K19/38 ,  C09K19/32 ,  H05K1/05 ,  C08G63/60

Abstract: Provided are a thermoplastic polymer capable of reducing a dielectric dissipation factor in high frequency bands and a film thereof. The thermoplastic liquid crystal polymer includes repeating units represented by the following formulae (I), (II), (III) and (IV), in which a molar ratio of a total amount of the repeating units represented by formulae (I) and (II) to a total amount of all the repeating units in the thermoplastic liquid crystal polymer is 50 to 90 mol %, and a molar ratio of the repeating unit represented by formula (III) to the repeating unit represented by formula (IV) is the former/the latter=23/77 to 77/23.