公开(公告)号：US07888604B2

公开(公告)日：2011-02-15

申请号：US11910685

申请日：2006-04-11

Applicant: Kohichiro Kawate ,  Andrew C. Lottes ,  James G. Vana, Jr. ,  Barbara L. Birrell ,  Alexander W. Barr

Inventor： Kohichiro Kawate ,  Andrew C. Lottes ,  James G. Vana, Jr. ,  Barbara L. Birrell ,  Alexander W. Barr

IPC: H05K1/00 ,  B32B7/12

CPC classification number: H05K3/361 ,  H01L2224/81 ,  H05K1/117 ,  H05K1/148 ,  H05K3/244 ,  H05K3/323 ,  H05K2201/09745 ,  Y10T156/10 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/287

Abstract: Provided is a method of connecting conductive traces on one substrate to conductive traces on another substrate using an adhesive containing conductive particles and the resulting article.

Abstract translation: 提供了使用包含导电颗粒和所得制品的粘合剂将一个衬底上的导电迹线连接到另一衬底上的导电迹线的方法。

公开(公告)号：US20110000700A1

公开(公告)日：2011-01-06

申请号：US12446518

申请日：2007-10-11

Applicant: Yoshiaki Sato ,  Kohichiro Kawate ,  Tomihiro Hara ,  Noriko Kikuchi

Inventor： Yoshiaki Sato ,  Kohichiro Kawate ,  Tomihiro Hara ,  Noriko Kikuchi

IPC: H05K1/00 ,  H05K3/36

CPC classification number: H01R4/04 ,  H01R12/52 ,  H01R12/61 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y10T29/49126

Abstract: A method of connecting circuit boards capable of easily accomplishing the connection maintaining reliability. A method of connection comprising the steps of obtaining a laminated body of a first circuit board, an adhesive sheet and a second circuit board, and accomplishing electric conduction between the first circuit and the second circuit by applying heat and pressure to the laminated body of the first circuit board, the adhesive sheet and the second circuit board, wherein an end of the circuit formed on at least either the first circuit board or the second circuit board is terminated at a position separated away from an end of the substrate, and the adhesive of the adhesive sheet is partly arranged between the end of the substrate of the circuit board and the end of the circuit so as to be adhered to the opposing circuit board.

Abstract translation: 一种连接电路板的方法，能够容易地实现连接维护的可靠性。 一种连接方法，包括以下步骤：获得第一电路板，粘合片和第二电路板的层压体，并且通过向第一电路和第二电路的叠层体施加热和压力来实现第一电路和第二电路之间的导电 第一电路板，粘合片和第二电路板，其中形成在至少第一电路板或第二电路板的电路的端部终止于远离衬底的端部分离的位置，并且粘合剂 粘合片部分地布置在电路板的基板的端部和电路的端部之间，以便粘附到相对的电路板。

公开(公告)号：US20080090085A1

公开(公告)日：2008-04-17

申请号：US11933787

申请日：2007-11-01

Applicant: Kohichiro Kawate ,  Shoji Takeuchi ,  Makoto Sakakibara

Inventor： Kohichiro Kawate ,  Shoji Takeuchi ,  Makoto Sakakibara

IPC: B32B27/38

CPC classification number: H01L21/6836 ,  C09J7/22 ,  C09J7/35 ,  C09J2203/326 ,  C09J2463/00 ,  H01L23/3128 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06582 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided are a heat curable adhesive composition and an adhesive article suited for dicing of a semiconductor and die-bonding of the diced semiconductor chip, and a semiconductor apparatus and a process for preparing a semiconductor apparatus using the adhesive composition and article. In one embodiment, the present invention provides a heat curable adhesive composition comprising a caprolactone-modified epoxy resin and a tack reducing component. Another embodiment of the present invention provides an adhesive article comprising a heat curable adhesive layer of a heat curable adhesive composition comprising a caprolactone-modified epoxy resin, a tack reducing component, and a backing layer carrying said adhesive layer on at least a portion of the backing layer.

Abstract translation: 提供一种热固性粘合剂组合物和适于半导体的切割和切割的半导体芯片的芯片结合的粘合剂制品，以及半导体装置和使用该粘合剂组合物和制品的半导体装置的制备方法。 在一个实施方案中，本发明提供了包含己内酯改性的环氧树脂和降粘组分的热固性粘合剂组合物。 本发明的另一个实施方案提供了一种粘合剂制品，其包含热可固化粘合剂组合物的热固化粘合剂层，所述热固化粘合剂组合物包含己内酯改性的环氧树脂，降粘组分和在所述粘合剂层的至少一部分上承载所述粘合剂层的背衬层 背层。

公开(公告)号：US06908318B2

公开(公告)日：2005-06-21

申请号：US10484175

申请日：2002-08-06

Applicant: Kohichiro Kawate

Inventor： Kohichiro Kawate

IPC: H05K3/40 ,  H05K3/46 ,  H01R4/58 ,  C09J7/00

CPC classification number: H05K3/4046 ,  H05K3/4614 ,  H05K2201/10378 ,  H05K2201/10416 ,  H05K2203/1189 ,  Y10T156/1057 ,  Y10T428/24917

Abstract: A batch electrically connecting sheet makes it possible to form an electric connection with mechanical, thermal, and electrical stability at plural points of contact. A batch electrically connecting sheet comprises a heat-resistant sheet having plural perforations, conductive blocks, inserted in the perforations, having ridges including indentations and projections; the projections are outstanding from the perforations, and the conductive blocks are thicker than the heat-resistant sheet, and the heat-resistant sheet has an adhesive layer composed of a heat curable adhesive agent applied on at least one surface thereof, covering the projections of the conductive blocks.

Abstract translation: 一批电连接片可以在多个接触点处形成机械，热和电稳定性的电连接。 批次电连接片包括具有多个穿孔的耐热片，插入穿孔中的导电块，具有包括凹陷和突起的脊; 突起从穿孔突出，并且导电块比耐热片厚，并且耐热片具有由施加在其至少一个表面上的可热固化粘合剂构成的粘合剂层，覆盖突起 导电块。

公开(公告)号：US09230873B2

公开(公告)日：2016-01-05

申请号：US14131827

申请日：2012-07-09

Applicant: Kohichiro Kawate ,  Hiroko Akiyama ,  Naota Sugiyama ,  Brant U. Kolb ,  Eric G. Larson

Inventor： Kohichiro Kawate ,  Hiroko Akiyama ,  Naota Sugiyama ,  Brant U. Kolb ,  Eric G. Larson

IPC: H01L21/60 ,  H01L23/29 ,  C08L63/00 ,  H01L23/10 ,  H01L21/56 ,  C08K3/36 ,  C08K9/06 ,  H01L33/56

CPC classification number: H01L23/296 ,  C08K3/36 ,  C08K9/06 ,  C08L63/00 ,  H01L21/563 ,  H01L23/10 ,  H01L23/293 ,  H01L23/295 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.

Abstract translation: 本发明的半导体封装树脂组合物包括环氧树脂，固化剂，无机颗粒，用含有光聚合官能团的硅烷表面处理的纳米颗粒和光聚合引发剂。

公开(公告)号：US20080013594A1

公开(公告)日：2008-01-17

申请号：US11814930

申请日：2006-02-02

Applicant: Kohichiro Kawate

Inventor： Kohichiro Kawate

IPC: G01N25/00

CPC classification number: G01R31/2812 ,  G01N25/72 ,  G01R31/2817 ,  G01R31/309 ,  H05K3/361

Abstract: It is an object of the present invention to provide a nondestructive inspection method which does not use X-ray or gamma radiation that may exert adverse effect on human body and which is capable of easily and reliably detecting inconvenient defects in junction. An apparatus comprises a stage capable of supporting the test specimen, a strobe light source for heating the surface of the junction of the test specimen, and an infrared thermograph capable of measuring temporal variation of the surface temperature of the junction of the test specimen. Preferably, the stage has a heat sink to which the test specimen can be mounted for promoting temperature variation, that is, cooling, of the heated test specimen.

Abstract translation: 本发明的目的是提供一种不使用可能对人体产生不良影响的X射线或γ射线的非破坏性检查方法，其能够容易且可靠地检测结合处的不方便的缺陷。 一种装置包括能够支撑测试样本的阶段，用于加热测试样本的接合表面的闪光灯光源和能够测量测试样品的接合部的表面温度的时间变化的红外热像仪。 优选地，该台具有散热器，待测试样可安装在该散热器上以促进加热的试样的温度变化，即冷却。

公开(公告)号：US20050233161A1

公开(公告)日：2005-10-20

申请号：US10508736

申请日：2003-04-01

Applicant: Masaaki Takeda ,  Akihiko Mitsui ,  Kohichiro Kawate ,  Shigeyoshi Ishii

Inventor： Masaaki Takeda ,  Akihiko Mitsui ,  Kohichiro Kawate ,  Shigeyoshi Ishii

IPC: B32B27/00

CPC classification number: C09J9/02 ,  C08L2666/26 ,  C09J163/00 ,  Y10T428/31855

Abstract: A thermosetting adhesive sheet with electroconductive and thermoconductive properties, which comprises a thermosetting adhesive sheet composed of a thermosetting adhesive composition comprising an ethylene-glycidyl(meth)acrylate copolymer and a carboxyl group-containing rosin, where crosslinking is formed between the ethylene of the copolymer by electron beam radiation, and having at least one through-opening region formed at a prescribed location, and further including a low melting point solder placed within said through-opening region(s) formed at the prescribed location(s).

Abstract translation: 一种具有导电和导热特性的热固性粘合片，其包含由包含乙烯 - （甲基）丙烯酸缩水甘油酯共聚物和含羧基的松香的热固性粘合剂组合物组成的热固性粘合片，其中在共聚物的乙烯之间形成交联 通过电子束辐射，并且具有形成在规定位置的至少一个通孔区域，并且还包括放置在形成在规定位置的所述通孔区域内的低熔点焊料。

公开(公告)号：US20050224978A1

公开(公告)日：2005-10-13

申请号：US10517670

申请日：2003-06-23

Applicant: Kohichiro Kawate ,  Shoji Takeuchi ,  Makoto Sakakibara

Inventor： Kohichiro Kawate ,  Shoji Takeuchi ,  Makoto Sakakibara

IPC: C09J7/02 ,  H01L21/58 ,  H01L21/68 ,  H01L23/31 ,  H01L23/48

CPC classification number: H01L21/6836 ,  C09J7/22 ,  C09J7/35 ,  C09J2203/326 ,  C09J2463/00 ,  H01L23/3128 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06582 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided are a heat curable adhesive composition and an adhesive article suited for dicing of a semiconductor and die bonding of the diced semiconductor chip, and a semiconductor apparatus and a process for preparing a semiconductor apparatus using the adhesive composition and article. In one embodiment, the present invention provides a heat curable adhesive composition comprising a caprolactone-modified epoxy resin and a tack reducing component. Another embodiment of the present invention provides an adhesive article comprising a heat curable adhesive layer of a heat curable adhesive composition comprising a caprolactone-modified epoxy resin, a tack reducing component, and a backing layer carrying said adhesive layer on at least a portion of the backing layer.

Abstract translation: 提供一种热固性粘合剂组合物和适于切割半导体的粘合剂制品和切割的半导体芯片的裸片接合，半导体装置和使用该粘合剂组合物和制品的半导体装置的制备方法。 在一个实施方案中，本发明提供了包含己内酯改性的环氧树脂和降粘组分的热固性粘合剂组合物。 本发明的另一个实施方案提供了一种粘合剂制品，其包含热可固化粘合剂组合物的热固化粘合剂层，所述热固化粘合剂组合物包含己内酯改性的环氧树脂，降粘组分和在所述粘合剂层的至少一部分上承载所述粘合剂层的背衬层 背层。

公开(公告)号：US5759090A

公开(公告)日：1998-06-02

申请号：US737698

申请日：1996-11-20

Applicant: Kohichiro Kawate ,  Hitoshi Furutani ,  Sadao Yoshizaki ,  Hiroshi Imai

Inventor： Kohichiro Kawate ,  Hitoshi Furutani ,  Sadao Yoshizaki ,  Hiroshi Imai

IPC: B24B19/26 ,  B24D11/02 ,  B24D15/04 ,  C08F290/06 ,  B24B1/00

CPC classification number: C08F290/067 ,  B24B19/26 ,  B24D11/02 ,  B24D15/04

Abstract: A sanding pad (102, 204) comprising a plate-shaped substrate (104, 201) and an abrasive (103, 203) fixed by the use of a fixing means (102, 202) onto a major surface of the substrate (104, 201), and the substrate (104, 201) having a heat distortable polymer which has a dimension-retaining first state within a normal use temperature range of said pad (102, 204) and a deformable state at a temperature above said normal use temperature range. The invention provides an inexpensive sanding pad capable of sanding a three-dimensional curved surface, uniformly and easily, which is superior in repeated usability.

Abstract translation: PCT No.PCT / US95 / 04916 Sec。 371日期1996年11月20日 102（e）日期1996年11月20日PCT 1995年4月21日PCT PCT。 第WO95 / 32840号公报 日期1995年12月7日一种砂光垫（102,204），包括板形基底（104,201）和通过使用固定装置（102,202）固定在主表面上的研磨剂（103,203） 衬底（104,201）和具有热变性聚合物的衬底（104,201），其具有在所述焊盘（102,204）的正常使用温度范围内的尺寸保持第一状态和在温度下的可变形状态 高于正常使用温度范围。 本发明提供了一种能够均匀且容易地打磨三维曲面的便宜的打磨垫，其重复使用性优异。

公开(公告)号：US5382641A

公开(公告)日：1995-01-17

申请号：US129949

申请日：1993-09-30

Applicant: Kohichiro Kawate

Inventor： Kohichiro Kawate

IPC: B41M5/28 ,  B41M5/36 ,  C08F220/06 ,  C08F220/36 ,  C08F26/02

CPC classification number: B41M5/36 ,  C08F220/06 ,  C08F220/36 ,  Y10S428/913 ,  Y10T428/24802 ,  Y10T428/3175 ,  Y10T428/31855

Abstract: The present invention provides a heat-sensitive layer prepared by radiation polymerizing a monomer composition comprising:(i) from about 30 to about 70 parts by weight of methacrylic acid, and(ii) correspondingly, from about 70 to about 30 parts by weight of a urethane (meth)acrylate compound having a urethane backbone and at least 2 (meth)acryloyl groups in a molecule, and(iii) up to about 40 parts of a viscosity controlling compound having at least one (meth)acryloyl groupwherein the percentage of the urethane (meth)acrylate and the viscosity controlling agent totals no more than 70 parts, then stretching said polymer from at least a yield point to a break point.

Abstract translation: 本发明提供一种通过辐射聚合单体组合物制备的热敏层，所述单体组合物包含：（i）约30至约70重量份的甲基丙烯酸，和（ii）相应地，约70至约30重量份的 分子中具有氨基甲酸酯主链和至少2个（甲基）丙烯酰基的氨基甲酸酯（甲基）丙烯酸酯化合物，和（iii）至多约40份具有至少一个（甲基）丙烯酰基的粘度控制化合物，其中百分比 的氨基甲酸酯（甲基）丙烯酸酯和粘度控制剂的总量不超过70份，然后将所述聚合物从至少屈服点拉伸至断裂点。