公开(公告)号：US20150003108A1

公开(公告)日：2015-01-01

申请号：US14314967

申请日：2014-06-25

Applicant: LG INNOTEK CO., LTD.

Inventor： Hyun Gyu PARK ,  Min Jae KIM ,  Se Woong NA ,  In Hee CHO ,  Man Hue CHOI ,  Seung Kwon HONG

IPC: F21V21/00

CPC classification number: H05K1/148 ,  G02B6/0068 ,  G02B6/0083 ,  H05K1/0278 ,  H05K3/366 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2203/302

Abstract: Provided is a circuit board including: a supporting substrate including a first region to which light emitting elements are mounted and a second region extending to be bent from the first region, wherein the second region comprises: a connector mounting portion to which a connector for supplying an electric current to the light emitting elements is mounted; and a non-mounting portion of a connector separated and spaced apart from the connector mounting portion, wherein the connector mounting portion is formed lower than the non-mounting portion of the connector.

Abstract translation: 提供一种电路板，包括：支撑基板，包括安装发光元件的第一区域和从第一区域延伸以弯曲的第二区域，其中第二区域包括：连接器安装部分，用于供应的连接器 安装到发光元件的电流; 以及与所述连接器安装部分分离并间隔开的连接器的非安装部分，其中所述连接器安装部分形成为低于所述连接器的非安装部分。