公开(公告)号：US20240364291A1

公开(公告)日：2024-10-31

申请号：US18641783

申请日：2024-04-22

Applicant: TDK Corporation

Inventor： Toshiyuki ABE ,  Ichiro YAGINUMA ,  Kazutoshi TSUYUTANI ,  Takuya SHIMAMURA

IPC: H03H7/01 ,  H01R12/58 ,  H01R12/75 ,  H01R13/66 ,  H01R13/7197 ,  H05K1/11 ,  H05K1/16 ,  H05K1/18

CPC classification number: H03H7/01 ,  H01R13/7197 ,  H05K1/117 ,  H05K1/165 ,  H05K1/185 ,  H01R12/58 ,  H01R12/75 ,  H01R13/6666 ,  H05K2201/09181 ,  H05K2201/10174 ,  H05K2201/10189

Abstract: Disclosed herein is a circuit board that includes: a plurality of insulating layers, a common mode filter and an electronic component embedded in the insulating layers, and first to fifth outer electrodes. The first coil pattern of the common mode filter is connected between the first and second outer electrodes. The second coil pattern of the common mode filter is connected between the third and fourth outer electrodes. The electronic component is connected between the first and second outer electrodes and the fifth outer electrode. The electronic component is arranged so as not to overlap the first coil pattern and the second coil pattern.

公开(公告)号：US12127595B2

公开(公告)日：2024-10-29

申请号：US17593135

申请日：2020-03-09

Applicant: Nicoventures Trading Limited

Inventor： Thomas Paul Blandino ,  Ashley John Sayed ,  Mitchel Thorsen ,  Luke James Warren

IPC: A24F40/57 ,  A24F40/465 ,  H05B6/10 ,  H05K1/02 ,  H05K1/18

CPC classification number: A24F40/465 ,  A24F40/57 ,  H05B6/105 ,  H05K1/0278 ,  H05K1/189 ,  H05K2201/1003 ,  H05K2201/10189

Abstract: Aerosol provision devices having printed circuit boards are described. One such aerosol provision device defines a longitudinal axis and comprises an electrical connector, a heater assembly configured to heat aerosol generating material received within the device and a printed circuit board (PCB). The PCB comprises a first portion arranged substantially parallel to the longitudinal axis and a second portion arranged substantially perpendicular to the longitudinal axis. The heater assembly is electrically coupled to the first portion. The second portion is electrically coupled to the first portion and the electrical connector is electrically coupled to the second portion. Another such aerosol provision device comprises a first coil for heating a heater component and a PCB arranged adjacent to the first coil. The PCB comprises: a first through hole connected to a first end of the first coil; and a second through hole connected to a second end of the first coil.

公开(公告)号：US20240357744A1

公开(公告)日：2024-10-24

申请号：US18756949

申请日：2024-06-27

Applicant: Intel Corporation

Inventor： Rick Canham ,  Jeffory L. Smalley ,  Steven Adam Klein ,  Shelby Ann Ferguson

IPC: H05K1/11 ,  H05K1/02 ,  H05K5/00

CPC classification number: H05K1/117 ,  H05K1/0203 ,  H05K1/111 ,  H05K5/0034 ,  H05K2201/10189

Abstract: Integrated circuit packages including carriers with incorporated substrates and interfaces are disclosed herein. An integrated circuit package carrier disclosed herein includes a frame including an opening to receive an integrated circuit package and at least one of (1) a circuitry component on a substrate on a surface of the frame or (2) a cable interface directly coupled to the frame.

公开(公告)号：US12127362B2

公开(公告)日：2024-10-22

申请号：US15627919

申请日：2017-06-20

Applicant: BLACK & DECKER INC.

Inventor： Michael Varipatis ,  Nathan J. Osborne ,  Alfred M. Irungu ,  Ryan Klee ,  Nicholas J. Garibaldi ,  William T. Lunsford, V ,  Nathan J. Cruise

IPC: H05K7/02 ,  G06F1/16 ,  H01M10/42 ,  H01M50/186 ,  H01M50/284 ,  B29L31/00 ,  H01M50/184 ,  H01M50/204 ,  H01M50/227 ,  H01M50/247 ,  H05K3/28

CPC classification number: H05K7/02 ,  G06F1/1635 ,  H01M10/425 ,  H01M50/186 ,  H01M50/284 ,  B29L2031/7146 ,  H01M50/184 ,  H01M50/204 ,  H01M50/227 ,  H01M50/247 ,  H01M2220/30 ,  H05K3/284 ,  H05K2201/10189

Abstract: The present disclosure is directed to an encapsulated printed circuit board populated with a variety of components and a method of encapsulating a printed circuit board. The printed circuit board is partially encapsulated with a low pressure molded material to form at least a portion of a potting boat. The potting boat is filled with an encapsulating material.

公开(公告)号：US12108785B2

公开(公告)日：2024-10-08

申请号：US18306118

申请日：2023-04-24

Applicant: Pax Labs, Inc.

Inventor： Joshua Fu ,  Christopher Loental ,  Marko Markovic ,  Alexander Weiss ,  Alexander Ringrose ,  David Carlberg ,  Robyn Nariyoshi ,  Devin Spratt ,  Nicholas J. Hatton ,  Yen Jen Chang ,  Chen Yu Li ,  Barry Tseng ,  Prince Wang ,  Thomas Germann ,  Andreas Schaefer

IPC: A24D1/14 ,  A24F7/00 ,  A24F40/40 ,  A61M11/04 ,  A61M15/00 ,  G01N35/00 ,  G08B6/00 ,  H01R13/52 ,  H02J7/00 ,  H05B1/02 ,  H05B3/00 ,  H05K1/14 ,  H05K1/18 ,  A24F15/015 ,  A24F40/10 ,  F16J15/02 ,  F17C9/02 ,  G01L13/00 ,  G01P15/00 ,  H01Q1/22

CPC classification number: A24D1/14 ,  A24F7/00 ,  A24F40/40 ,  A61M11/042 ,  A61M15/0028 ,  G01N35/00732 ,  G08B6/00 ,  H01R13/521 ,  H02J7/00 ,  H05B1/0244 ,  H05B3/0014 ,  H05B3/0019 ,  H05K1/147 ,  H05K1/189 ,  A24F15/015 ,  A24F40/10 ,  A61M2205/8206 ,  F16J15/02 ,  F17C9/02 ,  G01L13/00 ,  G01P15/00 ,  H01Q1/2283 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10318

Abstract: Features relating to a vaporizer body are provided. The vaporizer body may include an outer shell that includes an inner region defined by an outer shell sidewall. A support structure is configured to fit within the inner region of the outer shell. The support structure includes a storage region defined by a top support structure, a bottom support structure, a bottom cap, and a gasket. An integrated board assembly is configured to fit within the storage region of the support structure. The integrated board assembly may include a printed circuit board assembly formed of multiple layers that form a rigid structure and that include an inner, flexible layer. A first antenna is integrated at a proximal end of the flexible layer, and a second antenna is integrated at a distal end of the flexible layer.

公开(公告)号：US20240334602A1

公开(公告)日：2024-10-03

申请号：US18616668

申请日：2024-03-26

Applicant: Airbus Operations GmbH

Inventor： Klaus-Udo FREITAG ,  Yener PALIT

IPC: H05K1/11 ,  H01R12/59 ,  H01R12/71 ,  H05K1/14

CPC classification number: H05K1/118 ,  H01R12/592 ,  H01R12/716 ,  H05K1/147 ,  H05K2201/10189

Abstract: A connection interface for connecting a flexible printed circuit to an electrical equipment and a printed circuit board, comprising a first contact area configured to receive signals from the flexible printed circuit, a second contact area configured to transmit the signals from the first contact area to the printed circuit board, and a connector cap configured to transmit the signals from the first contact area to the second contact area. The first contact area and the second contact area are arranged in neighbored areas at the connector cap.

公开(公告)号：US12092950B2

公开(公告)日：2024-09-17

申请号：US17855665

申请日：2022-06-30

Applicant: NIDEC SANKYO CORPORATION

Inventor： Tsutomu Arai ,  Takeshi Sue

IPC: G03B5/06 ,  H05K1/18

CPC classification number: G03B5/06 ,  H05K1/189 ,  G03B2205/0069 ,  H05K2201/10189

Abstract: A case includes a movable body to which an optical module having a first flexible wiring board is to be attached, a fixed body, and a second flexible wiring board with which the first flexible wiring board is to be connected. The movable body is swingably held by the fixed body, and the second flexible wiring board is structured to be resiliently bent easier than the first flexible wiring board.

公开(公告)号：US12089357B2

公开(公告)日：2024-09-10

申请号：US17958540

申请日：2022-10-03

Applicant: TE Connectivity Solutions GmbH

Inventor： Christopher William Blackburn ,  Jeffery Walter Mason ,  Nathan Lincoln Tracy ,  Clarence Leon Yu ,  Michael David Herring

IPC: H05K7/10 ,  H01R12/70 ,  H01R12/71

CPC classification number: H05K7/1084 ,  H01R12/7076 ,  H01R12/714 ,  H05K7/1069 ,  H05K7/1092 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/2018

Abstract: An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.

公开(公告)号：US20240297459A1

公开(公告)日：2024-09-05

申请号：US18176495

申请日：2023-03-01

Applicant: Na Li

Inventor： Na Li

IPC: H01R13/627 ,  H05K1/18

CPC classification number: H01R13/6275 ,  H05K1/18 ,  H01R12/73 ,  H05K2201/09063 ,  H05K2201/10189

Abstract: A circuit board connecting mechanism comprises a connector fixed to the circuit board, a fastener, a rotary latch, and an elastic element, when the rotary latch rotates against the fastener, it can be reset by the elastic element; one end of the electronic device is connected to the connector, the other end of the electronic device is pressed down to make the other end of the electronic device press the guiding slope of the buckle, forcing the rotary latch to rotate against the fastener and compress the elastic element, when the other end of the electronic device is pressed over the buckle, the rotary latch is reset by the torsion of the elastic element, making the buckle press the upper end face of the other end of the electronic device to lock the other end of the electronic device.

公开(公告)号：US12081323B2

公开(公告)日：2024-09-03

申请号：US18116957

申请日：2023-03-03

Applicant: Intel Corporation

Inventor： Murugasamy K. Nachimuthu ,  Mohan J. Kumar ,  Vasudevan Srinivasan

IPC: G06F8/65 ,  G02B6/38 ,  G02B6/42 ,  G02B6/44 ,  G06F1/18 ,  G06F1/20 ,  G06F3/06 ,  G06F9/30 ,  G06F9/4401 ,  G06F9/54 ,  G06F12/109 ,  G06F12/14 ,  G06F13/16 ,  G06F13/40 ,  G06F15/16 ,  G06F16/901 ,  G08C17/02 ,  G11C5/02 ,  G11C7/10 ,  G11C11/56 ,  G11C14/00 ,  H03M7/30 ,  H03M7/40 ,  H04B10/25 ,  H04L41/14 ,  H04L43/08 ,  H04L43/0817 ,  H04L43/0876 ,  H04L43/0894 ,  H04L49/00 ,  H04L49/25 ,  H04L49/356 ,  H04L49/45 ,  H04L67/02 ,  H04L67/12 ,  H04L67/306 ,  H04L69/04 ,  H04L69/329 ,  H04Q11/00 ,  H05K7/14 ,  B25J15/00 ,  B65G1/04 ,  G05D23/19 ,  G05D23/20 ,  G06F9/38 ,  G06F9/50 ,  G06F11/14 ,  G06F11/34 ,  G06F12/0862 ,  G06F12/0893 ,  G06F12/10 ,  G06F13/42 ,  G06F15/80 ,  G06Q10/06 ,  G06Q10/0631 ,  G06Q10/087 ,  G06Q10/20 ,  G06Q50/04 ,  G07C5/00 ,  G11C5/06 ,  H04J14/00 ,  H04L9/06 ,  H04L9/14 ,  H04L9/32 ,  H04L12/28 ,  H04L41/02 ,  H04L41/046 ,  H04L41/0813 ,  H04L41/082 ,  H04L41/0896 ,  H04L41/12 ,  H04L41/147 ,  H04L41/5019 ,  H04L43/065 ,  H04L43/16 ,  H04L45/02 ,  H04L45/52 ,  H04L47/24 ,  H04L47/38 ,  H04L47/70 ,  H04L47/765 ,  H04L47/78 ,  H04L47/80 ,  H04L49/15 ,  H04L49/55 ,  H04L61/00 ,  H04L67/00 ,  H04L67/10 ,  H04L67/1004 ,  H04L67/1008 ,  H04L67/1012 ,  H04L67/1014 ,  H04L67/1029 ,  H04L67/1034 ,  H04L67/1097 ,  H04L67/51 ,  H04Q1/04 ,  H04W4/02 ,  H04W4/80 ,  H05K1/02 ,  H05K1/18 ,  H05K5/02 ,  H05K7/20 ,  H05K13/04

CPC classification number: H04L43/08 ,  G02B6/3882 ,  G02B6/3893 ,  G02B6/3897 ,  G02B6/4292 ,  G02B6/4452 ,  G06F1/183 ,  G06F1/20 ,  G06F3/0613 ,  G06F3/0625 ,  G06F3/064 ,  G06F3/0653 ,  G06F3/0655 ,  G06F3/0664 ,  G06F3/0665 ,  G06F3/0673 ,  G06F3/0679 ,  G06F3/0683 ,  G06F3/0688 ,  G06F3/0689 ,  G06F8/65 ,  G06F9/30036 ,  G06F9/4401 ,  G06F9/544 ,  G06F12/109 ,  G06F12/1408 ,  G06F13/1668 ,  G06F13/4022 ,  G06F13/4068 ,  G06F13/409 ,  G06F15/161 ,  G06F16/9014 ,  G08C17/02 ,  G11C5/02 ,  G11C7/1072 ,  G11C11/56 ,  G11C14/0009 ,  H03M7/3086 ,  H03M7/4056 ,  H03M7/4081 ,  H04B10/25891 ,  H04L41/145 ,  H04L43/0817 ,  H04L43/0876 ,  H04L43/0894 ,  H04L49/00 ,  H04L49/25 ,  H04L49/357 ,  H04L49/45 ,  H04L67/02 ,  H04L67/306 ,  H04L69/04 ,  H04L69/329 ,  H04Q11/0003 ,  H05K7/1442 ,  B25J15/0014 ,  B65G1/0492 ,  G05D23/1921 ,  G05D23/2039 ,  G06F3/061 ,  G06F3/0611 ,  G06F3/0616 ,  G06F3/0619 ,  G06F3/0631 ,  G06F3/0638 ,  G06F3/0647 ,  G06F3/0658 ,  G06F3/0659 ,  G06F3/067 ,  G06F9/3887 ,  G06F9/5016 ,  G06F9/5044 ,  G06F9/505 ,  G06F9/5072 ,  G06F9/5077 ,  G06F11/141 ,  G06F11/3414 ,  G06F12/0862 ,  G06F12/0893 ,  G06F12/10 ,  G06F13/161 ,  G06F13/1694 ,  G06F13/42 ,  G06F13/4282 ,  G06F15/8061 ,  G06F2209/5019 ,  G06F2209/5022 ,  G06F2212/1008 ,  G06F2212/1024 ,  G06F2212/1041 ,  G06F2212/1044 ,  G06F2212/152 ,  G06F2212/202 ,  G06F2212/401 ,  G06F2212/402 ,  G06F2212/7207 ,  G06Q10/06 ,  G06Q10/06314 ,  G06Q10/087 ,  G06Q10/20 ,  G06Q50/04 ,  G07C5/008 ,  G08C2200/00 ,  G11C5/06 ,  H03M7/30 ,  H03M7/3084 ,  H03M7/40 ,  H03M7/4031 ,  H03M7/6005 ,  H03M7/6023 ,  H04B10/25 ,  H04J14/00 ,  H04L9/0643 ,  H04L9/14 ,  H04L9/3247 ,  H04L9/3263 ,  H04L12/2809 ,  H04L41/024 ,  H04L41/046 ,  H04L41/0813 ,  H04L41/082 ,  H04L41/0896 ,  H04L41/12 ,  H04L41/147 ,  H04L41/5019 ,  H04L43/065 ,  H04L43/16 ,  H04L45/02 ,  H04L45/52 ,  H04L47/24 ,  H04L47/38 ,  H04L47/765 ,  H04L47/782 ,  H04L47/805 ,  H04L47/82 ,  H04L47/823 ,  H04L49/15 ,  H04L49/555 ,  H04L61/00 ,  H04L67/10 ,  H04L67/1004 ,  H04L67/1008 ,  H04L67/1012 ,  H04L67/1014 ,  H04L67/1029 ,  H04L67/1034 ,  H04L67/1097 ,  H04L67/12 ,  H04L67/34 ,  H04L67/51 ,  H04Q1/04 ,  H04Q11/00 ,  H04Q11/0005 ,  H04Q2011/0037 ,  H04Q2011/0041 ,  H04Q2011/0052 ,  H04Q11/0062 ,  H04Q11/0071 ,  H04Q2011/0073 ,  H04Q2011/0079 ,  H04Q2011/0086 ,  H04Q2213/13523 ,  H04Q2213/13527 ,  H04W4/023 ,  H04W4/80 ,  H05K1/0203 ,  H05K1/181 ,  H05K5/0204 ,  H05K7/1418 ,  H05K7/1421 ,  H05K7/1422 ,  H05K7/1447 ,  H05K7/1461 ,  H05K7/1485 ,  H05K7/1487 ,  H05K7/1489 ,  H05K7/1491 ,  H05K7/1492 ,  H05K7/1498 ,  H05K7/2039 ,  H05K7/20709 ,  H05K7/20727 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20836 ,  H05K13/0486 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/10159 ,  H05K2201/10189 ,  Y02D10/00 ,  Y02P90/30 ,  Y04S10/50 ,  Y04S10/52 ,  Y10S901/01

Abstract: Embodiments are generally directed apparatuses, methods, techniques and so forth determine an access level of operation based on an indication received via one or more network links from a pod management controller, and enable or disable a firmware update capability for a firmware device based on the access level of operation, the firmware update capability to change firmware for the firmware device. Embodiments may also include determining one or more configuration settings of a plurality of configuration settings to enable for configuration based on the access level of operation, and enable configuration of the one or more configuration settings.