公开(公告)号：US20200127171A1

公开(公告)日：2020-04-23

申请号：US16203568

申请日：2018-11-28

Applicant: Lextar Electronics Corporation

Inventor： Hung-Chun TONG ,  Chang-Zhi ZHONG ,  Fu-Hsin CHEN ,  Yu-Chun LEE

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/20 ,  H01L33/00

Abstract: A light emitting diode device includes a light emitting diode chip, a wavelength conversion layer including a bottom surface facing a top surface of the light emitting diode chip, and an interlayer having a first portion between the light emitting diode chip and a part of the bottom surface of the wavelength conversion layer, and a second portion extending from the first portion and connected between a remaining part of the bottom surface of the wavelength conversion layer and a side surface of the light emitting diode chip. The second portion has a side surface including a linear surface substantially aligning with a side surface of the wavelength conversion layer, and a curved surface having a first end connected to the linear surface and a second end connected to the side surface of the light emitting diode chip. The linear surface and the curved surface define a chamfer angle.