中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

11 records (took 0.013 seconds)

    Picking Apparatus
    2.
    发明申请
    Picking Apparatus 有权

    公开(公告)号：US20210120711A1

    公开(公告)日：2021-04-22

    申请号：US16693399

    申请日：2019-11-25

    Applicant: Lextar Electronics Corporation

    Inventor： Chi-Wei LIU ,  Fu-Hsin CHEN ,  Yu-Chun LEE

    IPC: H05K13/04 ,  B25J15/00 ,  B25J15/04

    Abstract: A picking apparatus is configured to pick up a plurality of micro elements. The picking apparatus includes a main body and a plurality of picking portions. The picking portions connect with and protrude from the main body. Each of the picking portions has a first surface. The first surfaces are away from the main body and configured to pick up the micro elements. The main body has a second surface at least partially located between the picking portions. Each of the first surfaces has a first viscosity. The second surface has a second viscosity. The second viscosity is less than the first viscosity.

    LIGHT SOURCE MODULE AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    LIGHT SOURCE MODULE AND MANUFACTURING METHOD THEREOF 有权

    公开(公告)号：US20250160079A1

    公开(公告)日：2025-05-15

    申请号：US18939166

    申请日：2024-11-06

    Applicant: Lextar Electronics Corporation

    Inventor： Fu-Hsin CHEN ,  Chun-Min LIN

    IPC: H01L33/60 ,  H01L33/50

    Abstract: A light source module is provided. The light source module includes a substrate, a light source and a packaging material. The light source is disposed on the substrate, wherein the light source comprises a top surface and a lateral surface. The packaging material is disposed on the substrate and covers the light source, wherein a recess is formed on the packaging material, and the recess corresponds to the top surface.

    Light-Emitting Package Structure and Manufacturing Method Thereof
    5.
    发明申请
    Light-Emitting Package Structure and Manufacturing Method Thereof 有权

    公开(公告)号：US20210143133A1

    公开(公告)日：2021-05-13

    申请号：US16699091

    申请日：2019-11-28

    Applicant: Lextar Electronics Corporation

    Inventor： Hung-Chun TONG ,  Fu-Hsin CHEN ,  Wen-Wan TAI ,  Yu-Chun LEE ,  Tzong-Liang TSAI

    IPC: H01L25/075 ,  H01L33/58 ,  H01L33/52

    Abstract: A light-emitting package structure includes a light transmissive adhesive layer, a substrate, and at least one light-emitting diode chip. The light transmissive adhesive layer includes a first surface and a second surface facing away from the first surface. The substrate is on the first surface of the light transmissive adhesive layer. The light-emitting diode chip is on the second surface of the light transmissive adhesive layer. The light transmissive adhesive layer has a first portion and a second portion on the second surface, the first portion surrounds the second portion, a vertical projection area of the second portion on the substrate at least entirely covers a vertical projection area of the light-emitting diode chip on the substrate, and a thickness of the second portion is smaller than or equal to a thickness of the first portion.

    Picking Apparatus and the Method Using the Same
    6.
    发明申请
    Picking Apparatus and the Method Using the Same 有权

    公开(公告)号：US20210134625A1

    公开(公告)日：2021-05-06

    申请号：US16693400

    申请日：2019-11-25

    Applicant: Lextar Electronics Corporation

    Inventor： Fu-Hsin CHEN ,  Yu-Chun LEE

    IPC: H01L21/67

    Abstract: A picking apparatus is configured to pick up a plurality of micro elements. The picking apparatus includes an elastic plate, a substrate, a temperature-controlled adhesive layer, at least one heating element and a power source. The elastic plate has a first surface and a second surface opposite to each other. The substrate is disposed on the first surface. The temperature-controlled adhesive layer is disposed on the second surface and configured to adhere the micro elements. The heating element is disposed between the second surface and the temperature-controlled adhesive layer. The power source is electrically connected with the heating element. A viscosity of the temperature-controlled adhesive layer varies with a temperature of the temperature-controlled adhesive layer.

    DISPLAY DEVICE
    7.
    发明申请
    DISPLAY DEVICE 审中-公开

    公开(公告)号：US20200126955A1

    公开(公告)日：2020-04-23

    申请号：US16198790

    申请日：2018-11-22

    Applicant: Lextar Electronics Corporation

    Inventor： Fu-Hsin CHEN ,  Yu-Chun LEE

    IPC: H01L25/075 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60

    Abstract: A display device includes a driving substrate, multiple light-emitting elements, first and second transparent substrates, multiple pixels, and a patterned light-absorbing layer. The light-emitting elements are disposed on the driving substrate and used to emit a light. The first transparent substrate is disposed over the driving substrate and the light-emitting elements and includes at least one groove. The pixels are disposed in the groove and include a first sub-pixel, a second sub-pixel, and a third sub-pixel respectively aligned with one of the light-emitting elements. The second transparent substrate covers the first transparent substrate and the pixels. The patterned light-absorbing layer is disposed on the second transparent substrate and includes multiple first openings respectively aligned with the first, second, and third sub-pixels. The first, second, and third sub-pixels correspond to the light emitted by the light-emitting elements to respectively emit a red light, a green light, and a blue light.

    LIGHT-EMITTING DEVICE AND DISPLAY DEVICE INCLUDING THE SAME
    8.
    发明申请
    LIGHT-EMITTING DEVICE AND DISPLAY DEVICE INCLUDING THE SAME 有权

    公开(公告)号：US20250169249A1

    公开(公告)日：2025-05-22

    申请号：US18936706

    申请日：2024-11-04

    Applicant: Lextar Electronics Corporation

    Inventor： Fu-Hsin CHEN ,  Juei-Ho TANG ,  Chun Min LIN

    IPC: H01L33/50 ,  H01L25/075 ,  H01L33/54

    Abstract: A light-emitting device and a display device are provided. The light-emitting device includes a substrate, a light-emitting array, and a plurality of first color conversion points. The light-emitting array is disposed on the substrate and includes a plurality of light-emitting units. Each one of the plurality of light-emitting units includes a LED die and an encapsulating portion. The LED die is disposed on the substrate. The encapsulating portion is disposed on the substrate and covers the LED die. The plurality of first color conversion points is disposed on the substrate and surrounds the light-emitting array. The plurality of first color conversion points includes a first wavelength conversion material.

    Display Device and Manufacturing Method Thereof
    10.
    发明申请
    Display Device and Manufacturing Method Thereof 有权

    公开(公告)号：US20210135063A1

    公开(公告)日：2021-05-06

    申请号：US16698980

    申请日：2019-11-28

    Applicant: Lextar Electronics Corporation

    Inventor： Fu-Hsin CHEN ,  Yu-Chun Lee ,  Hung-Chun Tong ,  Tzong-Liang Tsai

    IPC: H01L33/50 ,  H01L33/06 ,  H01L33/00 ,  H01L25/075

    Abstract: A display device includes a substrate, a plurality of white light-emitting units, and a color filter layer. The white light-emitting units are arranged on the substrate at intervals, and the white light-emitting units are chip scale package (CSP). The color filter layer is above the white light-emitting units. Each of the white light-emitting units includes a light-emitting diode chip and a wavelength conversion film. The wavelength conversion film directly covers a top surface and side surfaces of the light-emitting diode chip, and the wavelength conversion film converts light emitted by the light-emitting diode chip into white light.

Patent Agency Ranking