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公开(公告)号:US09171794B2
公开(公告)日:2015-10-27
申请号:US13844638
申请日:2013-03-15
Applicant: MC10, Inc.
Inventor: Conor Rafferty , Mitul Dalal
IPC: H01L23/02 , H01L23/498 , H01L23/538 , H01L23/31 , H01L23/16 , H01L21/56 , H01L23/00 , H01L21/683 , H05K1/02 , H05K1/18
CPC classification number: H01L23/4985 , H01L21/56 , H01L21/6836 , H01L23/16 , H01L23/3107 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/82 , H01L2221/68327 , H01L2221/68381 , H01L2224/02379 , H01L2224/03436 , H01L2224/036 , H01L2224/0401 , H01L2224/04105 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/05548 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/8203 , H01L2224/82039 , H01L2224/83132 , H01L2224/83192 , H01L2224/92244 , H01L2924/07802 , H01L2924/12042 , H01L2924/12043 , H01L2924/15153 , H05K1/0283 , H05K1/185 , H05K1/189 , H05K2203/1469 , H01L2924/00 , H01L2924/00014
Abstract: Systems and methods are provided for the embedding of thin chips. A well region is generated in a substrate that includes a conductive material disposed on a flexible polymer. The standoff well region can be generated by pattern the conductive material, where the thin chip is embedded in the standoff well region. A cavity can be generated in the polymer layer to form a polymer well region, where the thin chip is embedded in the polymer well region.
Abstract translation: 提供了用于嵌入薄芯片的系统和方法。 在包括设置在柔性聚合物上的导电材料的基板中产生阱区。 间隔阱区域可以通过导电材料的图案来生成,其中薄的芯片嵌入在隔离阱区域中。 可以在聚合物层中产生空腔以形成聚合物阱区域,其中薄的芯片嵌入在聚合物阱区域中。
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公开(公告)号:US20140097944A1
公开(公告)日:2014-04-10
申请号:US13844399
申请日:2013-03-15
Applicant: MC10, INC.
Inventor: Steven Fastert , Kevin J. Dowling , Benjamin Schlatka , Conor Rafferty
IPC: G06K7/10 , G06K19/073 , G06K19/07
CPC classification number: G06K19/025 , G01K1/022 , G06K7/10009 , G06K19/02 , G06K19/027 , G06K19/0708 , G06K19/0716 , G06K19/0717 , G06K19/0723 , G06K19/073 , G06K19/07749 , G06K19/07779 , G06K19/0779
Abstract: A system is provided for integrating conformal electronics devices into apparel. The system includes a flexible substrate onto which a flexible device is disposed. The flexible device can include a stretchable coil that can be used to receive and transmit near field communications. The flexible device also includes an integrated circuit component and a memory unit. In some examples, the device also includes a sensor that is configured to record measurement of the wearer of the apparel and/or the surrounding environment.
Abstract translation: 提供了一种将保形电子设备集成到服装中的系统。 该系统包括柔性基板,柔性装置设置在柔性基板上。 柔性装置可包括可用于接收和发射近场通信的可拉伸线圈。 柔性装置还包括集成电路部件和存储器单元。 在一些示例中,该装置还包括被配置为记录服装和/或周围环境的佩戴者的测量的传感器。
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公开(公告)号:US10467926B2
公开(公告)日:2019-11-05
申请号:US15023556
申请日:2014-10-07
Applicant: MC10, Inc.
Inventor: Roozbeh Ghaffari , Isaiah Kacyvenski , Conor Rafferty , Milan Raj , Melissa Ceruolo , Yung-Yu Hsu , Bryan Keen , Briana Morey , Brian Reilly , Ping-Hung Wei
IPC: G09B19/00 , A61B5/0488 , A61B5/11 , G01P7/00 , A61B5/00 , H04W4/38 , H04W4/80 , G16H50/20 , G16H20/30 , H04W80/00
Abstract: Conformal sensor systems and devices are used for sensing and analysis of data indicative of body motion, e.g., for such applications as training and/or clinical purposes. Flexible electronics technology can be implemented as conformal sensors for sensing or measuring motion (including body motion and/or muscle activity), heart rate, electrical activity, and/or body temperature for such applications as medical diagnosis, medical treatment, physical activity, physical therapy and/or clinical purposes. The conformal sensors can be used for detecting and quantifying impact, and can be used for central nervous system disease monitoring.
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公开(公告)号:US10296819B2
公开(公告)日:2019-05-21
申请号:US15812880
申请日:2017-11-14
Applicant: MC10, Inc.
Inventor: Steven Fastert , Kevin J. Dowling , Benjamin Schlatka , Conor Rafferty
IPC: G06K19/077 , G06K19/02 , G06K7/10 , G06K19/07 , G06K19/073 , G01K1/02
Abstract: A system is provided for integrating conformal electronics devices into apparel. The system includes a flexible substrate onto which a flexible device is disposed. The flexible device can include a stretchable coil that can be used to receive and transmit near field communications. The flexible device also includes an integrated circuit component and a memory unit. In some examples, the device also includes a sensor that is configured to record measurement of the wearer of the apparel and/or the surrounding environment.
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公开(公告)号:US20170200670A1
公开(公告)日:2017-07-13
申请号:US15412993
申请日:2017-01-23
Applicant: MC10, Inc.
Inventor: Conor Rafferty , Mitul Dalal
IPC: H01L23/498 , H01L23/00 , H01L21/56 , H01L23/538 , H01L23/31 , H01L21/683
CPC classification number: H01L23/4985 , H01L21/56 , H01L21/6836 , H01L23/16 , H01L23/3107 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/82 , H01L2221/68327 , H01L2221/68381 , H01L2224/02379 , H01L2224/03436 , H01L2224/036 , H01L2224/0401 , H01L2224/04105 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/05548 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/8203 , H01L2224/82039 , H01L2224/83132 , H01L2224/83192 , H01L2224/92244 , H01L2924/07802 , H01L2924/12042 , H01L2924/12043 , H01L2924/15153 , H05K1/0283 , H05K1/185 , H05K1/189 , H05K2203/1469 , H01L2924/00 , H01L2924/00014
Abstract: Systems and methods are provided for the embedding of thin chips. A well region is generated in a substrate that includes a conductive material disposed on a flexible polymer. The standoff well region can be generated by pattern the conductive material, where the thin chip is embedded in the standoff well region. A cavity can be generated in the polymer layer to form a polymer well region, where the thin chip is embedded in the polymer well region.
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公开(公告)号:US20170164865A1
公开(公告)日:2017-06-15
申请号:US15405166
申请日:2017-01-12
Applicant: MC10, Inc.
Inventor: Conor Rafferty , Jeffrey D. Carbeck , Alexander Dickson , Kevin Dowling , Yung-Yu Hsu , Isaiah Kacyvenski , Benjamin Schlatka , Henry Wei
CPC classification number: A61B5/0537 , A61B5/0002 , A61B5/0024 , A61B5/01 , A61B5/024 , A61B5/0245 , A61B5/04 , A61B5/04012 , A61B5/0402 , A61B5/0476 , A61B5/0488 , A61B5/0531 , A61B5/0533 , A61B5/112 , A61B5/4266 , A61B5/441 , A61B5/442 , A61B5/443 , A61B5/6831 , A61B5/6833 , A61B5/68335 , A61B5/7282 , A61B8/4416 , A61B2562/16
Abstract: Apparatus are provided for monitoring a condition of a tissue based on a measurement of an electrical property of the tissue. In an example, the electrical property of the tissue is performed using an apparatus disposed above the tissue, where the apparatus includes at least two conductive structures, each having a non-linear configuration, where the at least two conductive structures are disposed substantially parallel to each other. In another example, the electrical property of the tissue is performed using an apparatus disposed above the tissue, where the apparatus includes at least one inductor structure.
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公开(公告)号:US20130200268A1
公开(公告)日:2013-08-08
申请号:US13631739
申请日:2012-09-28
Applicant: MC10, Inc.
Inventor: Conor Rafferty , Yung-Yu Hsu , Benjamin Schlatka , Gilman Callsen
IPC: A61B5/00
CPC classification number: A61B5/441 , A61B5/002 , A61B5/0531 , A61B5/443 , A61B5/6833 , A61B2560/0209 , A61B2560/0214 , A61B2560/0242 , A61B2562/0214 , A61B2562/125 , A61B2562/164 , A61B2562/187 , G01J1/429 , H04Q9/00 , H04Q2209/47 , H04Q2209/84
Abstract: Apparatus are provided for monitoring a condition of a surface based on a measurement of a property of the surface using a sensor. In an example, the property is performed using an apparatus disposed above the tissue, where the apparatus includes at least one coil structure formed from a conductive material, at least one other component, and at least one cross-link structure physically coupling a portion of the at least one coil structure to a portion of the at least one other component, the at least one cross-link structure being formed from a flexible material. The at least one other component can be a sensor component or a processor unit.
Abstract translation: 提供了用于基于使用传感器测量表面性质来监测表面状况的装置。 在一个示例中,使用设置在组织上方的装置执行该属性,其中该装置包括由导电材料形成的至少一个线圈结构,至少一个其它部件,以及至少一个交联结构, 所述至少一个线圈结构到所述至少一个其它部件的一部分,所述至少一个交联结构由柔性材料形成。 至少另一个组件可以是传感器组件或处理器单元。
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