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    Multi-part flexible encapsulation housing for electronic devices and methods of making the same
    4.
    发明授权
    Multi-part flexible encapsulation housing for electronic devices and methods of making the same 有权

    公开(公告)号：US10485118B2

    公开(公告)日：2019-11-19

    申请号：US15119559

    申请日：2015-03-04

    Applicant: MC10, Inc.

    Inventor： Brian Elolampi ,  David G. Garlock ,  Harold Gaudette ,  Steven Fastert ,  Adam Standley ,  Yung-Yu Hsu

    IPC: H05K5/00 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32 ,  H05K5/06

    Abstract: Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate. Either housing component may include one or more projections that pass through holes in the substrate to engage complementary depressions in the other housing component to thereby align and interlock the encapsulation housing components with the flexible substrate and electronic circuitry.

    ENCAPSULATED WEARABLE DEVICE AND SYSTEM WITH INCREASED SURFACE ENERGY
    8.
    发明申请
    ENCAPSULATED WEARABLE DEVICE AND SYSTEM WITH INCREASED SURFACE ENERGY 审中-公开

    公开(公告)号：US20200060618A1

    公开(公告)日：2020-02-27

    申请号：US16461127

    申请日：2017-11-14

    Applicant: MC10, Inc.

    Inventor： Daniel Davis ,  David Garlock ,  Steven Fastert

    IPC: A61B5/00

    Abstract: Aspects of the present disclosure include a polymer matrix that is formed on a wearable device to increase the surface energy and reduce the tackiness of the surface of the wearable device. The present disclose includes a wearable device that can be worn on a user, such as one the user's skin. The device includes one or more electronic components and an encapsulation layer surrounding the one or more electronic components. The device further includes a polymer matrix at least partially covering a first side of the wearable device. The polymer matrix has a higher surface energy than the encapsulation layer so as to improve adhesion with an adhesive layer. The present disclosure also includes a wearable device system that further includes the adhesive layer.

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