公开(公告)号：US20100252144A1

公开(公告)日：2010-10-07

申请号：US12744597

申请日：2008-11-25

Applicant: Shunsuke Ishikawa ,  Akira Shinozuka ,  Masami Aihara

Inventor： Shunsuke Ishikawa ,  Akira Shinozuka ,  Masami Aihara

IPC: B23K35/34 ,  B23K35/36

CPC classification number: B23K35/3613 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/362 ,  B23K2101/36 ,  H05K3/3489

Abstract: There is provided a soldering flux in which the volatilized amount in reflow is reduced to enable soldering with a smaller environmental load while suppressing the stickiness of the flux residue and ensuring a high reliability. A solder paste composition using the same is also provided. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an oil component having an iodine value of 120 to 170. Preferably, the content of the oil component is 22 to 80% by weight relative to the whole flux. Also, the oil component preferably contains at least one of drying oil and semidrying oil, and more preferably contains one or more kinds selected from tung oil, poppy-seed oil, walnut oil, safflower oil, sunflower oil, and soy bean oil. The solder paste composition comprises the soldering flux described above and a solder alloy powder.

Abstract translation: 提供了一种助焊剂，其中回流中的挥发量降低，能够以更小的环境负荷进行焊接，同时抑制助焊剂残留物的粘性并确保高可靠性。 还提供了使用其的焊膏组合物。 助焊剂包括基础树脂，活化剂和溶剂，其中溶剂包含碘值为120至170的油组分。优选地，油组分的含量相对于所述油分成分为22〜80重量％ 整体通量。 此外，油成分优选含有干油和半干油中的至少一种，更优选含有选自桐油，罂粟籽油，胡桃油，红花油，向日葵油，大豆油中的一种或多种。 焊膏组合物包含上述助焊剂和焊料合金粉末。

公开(公告)号：US20100064203A1

公开(公告)日：2010-03-11

申请号：US12498532

申请日：2009-07-07

Applicant: Masami Aihara

Inventor： Masami Aihara

IPC: G06F11/00

CPC classification number: G06F11/0775 ,  G06F11/0727

Abstract: A method for managing a storage apparatus includes acquiring error information for each of physical addresses assigned to a logical address, and managing the error information for each of the physical addresses.

Abstract translation: 用于管理存储装置的方法包括获取分配给逻辑地址的每个物理地址的错误信息，以及管理每个物理地址的错误信息。

公开(公告)号：US07567402B2

公开(公告)日：2009-07-28

申请号：US11325669

申请日：2006-01-04

Applicant: Masami Aihara

Inventor： Masami Aihara

IPC: G11B21/02

CPC classification number: G11B21/12

Abstract: The storage device of the invention has a ramp mechanism which shakes out the head onto the disk medium, and causes the head to evacuate from the medium to hold it. The command queuing processing unit stores input/output commands into the command queue in the order of issuance by the host, and then, executes the commands in arrangement in the increasing order of the medium access time. Completion of commands is responded to the host in the order of completion of execution. The end of command is responded to the host in the order of end of execution. The emergency evacuation processing unit interrupts, upon receipt of an emergency evacuation command from the host during operation of the command queuing processing unit, operation of the command queuing processing unit and protects the head by causing the head to evacuate from the medium to the ramp mechanism.

Abstract translation: 本发明的存储装置具有将头部摇动到盘介质上的斜坡机构，并使头从介质中排出以保持其。 命令排队处理单元按照主机发布的顺序将输入/输出命令存储到命令队列中，然后按照媒体访问时间的增加顺序执行命令。 按照完成执行的顺序对主机完成命令的响应。 命令结束按照执行结束的顺序对主机进行响应。 紧急疏散处理单元在命令排队处理单元的动作期间接收到来自主机的紧急撤离命令时，中断命令排队处理单元的动作，并通过使头部从介质排出到斜坡机构来保护头部 。

公开(公告)号：US20080053572A1

公开(公告)日：2008-03-06

申请号：US11896691

申请日：2007-09-05

Applicant: Masaki Sanji ,  Masayasu Yamamoto ,  Kensuke Nakanishi ,  Masami Aihara

Inventor： Masaki Sanji ,  Masayasu Yamamoto ,  Kensuke Nakanishi ,  Masami Aihara

IPC: B23K35/363

CPC classification number: B23K35/362 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3613

Abstract: A soldering flux contains a base resin and an activating agent. The base resin contains a thermoplastic acrylic resin having a glass transition temperature of below −50° C. This enables to sufficiently suppress the occurrence of cracks in the flux residue after soldering, under the severe environment where the temperature difference is extremely large. The soldering flux has high reliability and excellent solderability, and is conventional with respect to the load against manufacturing cost and environment.

Abstract translation: 助焊剂含有基础树脂和活化剂。 基础树脂含有玻璃化转变温度低于-50℃的热塑性丙烯酸树脂。这样能够在温度差非常大的恶劣环境下充分抑制焊接后的焊剂残留物中的裂纹的发生。 助焊剂具有高的可靠性和优异的可焊性，并且在制造成本和环境方面是常规的。

公开(公告)号：US20050259217A1

公开(公告)日：2005-11-24

申请号：US10850714

申请日：2004-05-20

Applicant: Jibing Lin ,  Suning Tang ,  Yuanji Tang ,  Masami Aihara

Inventor： Jibing Lin ,  Suning Tang ,  Yuanji Tang ,  Masami Aihara

IPC: G02F1/13 ,  G02F1/1334 ,  G02F1/13357 ,  G02F1/31

CPC classification number: G02F1/13342 ,  G02F1/133615 ,  G02F1/31 ,  G02F2203/06

Abstract: A thin holographic optical switch used in a liquid crystal display device contains opposing transparent substrates transparent electrodes between the substrates and a diffraction grating between the electrodes. The diffraction grating contains regions of transparent polymerized photopolymers and cholesteric liquid crystal micro-droplets. Refractive indexes of the photopolymers and liquid crystal are substantially the same when the electrodes have the same potential. The holographic optical switch transmits broadband LED light when the potential difference between the electrodes is zero and is polarization independent. The holographic optical switch diffracts broadband LED light when the potential difference between the electrodes is non-zero and is polarization independent.

公开(公告)号：US06339751B1

公开(公告)日：2002-01-15

申请号：US09153910

申请日：1998-09-16

Applicant: Naomi Takeda ,  Shozo Isobe ,  Yuichiro Matsuoka ,  Masami Aihara ,  Seiichi Nishio

Inventor： Naomi Takeda ,  Shozo Isobe ,  Yuichiro Matsuoka ,  Masami Aihara ,  Seiichi Nishio

IPC: G06F1750

CPC classification number: G06F17/5022

Abstract: A circuit design support apparatus partially converts a description of a circuit model to simulate the circuit operation. A register signal replacement section replaces a register signal with a variable in a process related with the register signal of the description and inserts a declaration of the variable in the process instead of a declaration of the register signal in the description. A clock signal simplification section replaces a clock signal with a variable in a clock signal reference process of the description and unifies a clock signal update process to the clock signal reference process in the description.

Abstract translation: 电路设计支持设备部分地转换电路模型的描述以模拟电路操作。 寄存器信号替换部分用与描述的寄存器信号相关的处理中的变量替换寄存器信号，并且在描述中插入变量的声明而不是寄存器信号的声明。 时钟信号简化部分用描述的时钟信号参考处理中的变量替换时钟信号，并将时钟信号更新处理与描述中的时钟信号参考处理相统一。

公开(公告)号：US08679263B2

公开(公告)日：2014-03-25

申请号：US12918169

申请日：2009-02-19

Applicant: Masami Aihara

Inventor： Masami Aihara

IPC: B23K35/34

CPC classification number: B23K1/0016 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  C21D2251/00 ,  H05K3/3442 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2201/068 ,  Y02P10/212

Abstract: Disclosed is a solder bonding structure which is capable of retaining sufficient solder bonding strength and ensuring high bonding reliability even in severe environments having an extremely large temperature difference. In the solder bonding structure, an electronic component 4 is mounted on a main surface 1a of a substrate having an electrode section 2 and an insulating film 3, and the electrode section 2 and the electronic component 4 are electrically bonded to each other through a solder section 5, and a flux residue 6 exuded from the solder section 5 is present between the electronic component 4 and the insulating film 3. The flux contains an acrylic resin, an activating agent, and a thixotropic agent having a hydroxyl group. The glass transition point of the acrylic resin is not higher than −40° C., or not lower than the softening temperature of the flux residue. The flux residue has a maximum value of 300×10−6/K or less of linear thermal expansion coefficient within a temperature range from −40° C. to the softening temperature of the flux residue.

Abstract translation: 公开了一种能够保持足够的焊接接合强度并且即使在具有非常大的温度差的恶劣环境中也确保高的接合可靠性的焊接接合结构。 在焊接结构中，电子部件4安装在具有电极部2和绝缘膜3的基板的主面1a上，电极部2和电子部件4通过焊料彼此电接合 并且在电子部件4和绝缘膜3之间存在从焊料部5渗出的焊剂残渣6。焊剂含有丙烯酸树脂，活化剂和具有羟基的触变剂。 丙烯酸树脂的玻璃化转变点不高于-40℃，或不低于焊剂残留物的软化温度。 焊剂残留物在-40℃至焊剂残留物的软化温度范围内的线性热膨胀系数的最大值为300×10 -6 / K以下。

公开(公告)号：US20120291921A1

公开(公告)日：2012-11-22

申请号：US13513880

申请日：2010-12-06

Applicant: Eiji Iwamura ,  Kazushi Gotoh ,  Shinsuke Nagasaka ,  Takayasu Yoshioka ,  Masayoshi Utsuno ,  Atsuo Nakamura ,  Teruo Okochi ,  Masaki Sanji ,  Takuji Sukekawa ,  Kenshi Ikedo ,  Yoshiyuki Andoh ,  Takeshi Shirai ,  Kimiaki Mori ,  Rie Wada ,  Kensuke Nakanishi ,  Masami Aihara ,  Seishi Kumamoto

Inventor： Eiji Iwamura ,  Kazushi Gotoh ,  Shinsuke Nagasaka ,  Takayasu Yoshioka ,  Masayoshi Utsuno ,  Atsuo Nakamura ,  Teruo Okochi ,  Masaki Sanji ,  Takuji Sukekawa ,  Kenshi Ikedo ,  Yoshiyuki Andoh ,  Takeshi Shirai ,  Kimiaki Mori ,  Rie Wada ,  Kensuke Nakanishi ,  Masami Aihara ,  Seishi Kumamoto

IPC: B23K35/363

CPC classification number: B23K35/362 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3613 ,  C22C13/00 ,  H05K3/3489

Abstract: A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C6-C15 alkyl group and a (meth)acrylate other than the above-mentioned (meth)acrylate; and rosins. The weight ratio of the acrylic resin is 0.5 or greater and 1.2 or less when the weight of the rosins is taken as 1, and the flux for a solder paste is fluidized by application of a shear force of 10 Pa or greater and 150 Pa or less.

Abstract translation: 根据本发明的一个方面的用于焊膏的焊剂包括通过使具有C6-C15烷基的（甲基）丙烯酸酯和除上述（甲基）丙烯酸酯之外的（甲基）丙烯酸酯）自由基共聚得到的丙烯酸类树脂; 和松香。 当松香的重量为1时，丙烯酸树脂的重量比为0.5以上且1.2以下，通过施加10Pa以上且150Pa以下的剪切力使焊膏的焊剂流动，或 减。

公开(公告)号：US20090015135A1

公开(公告)日：2009-01-15

申请号：US12211362

申请日：2008-09-16

Applicant: Masami Aihara ,  Makio Naito ,  Hiroya Abe

Inventor： Masami Aihara ,  Makio Naito ,  Hiroya Abe

IPC: H01J1/62

CPC classification number: H01L33/502 ,  H01L33/501 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2924/181 ,  H05B33/22 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor light emitting element which is primarily composed of GaN and which emits blue light is provided with a fluorescent layer, and the fluorescent layer includes fluorescent particles formed of a YAG fluorescent substance. By synthesis between yellow light emitted from the fluorescent particles and the blue light, white light is obtained. Fine particles, such as silica, adhere to the peripheries of the fluorescent particles forming the fluorescent layer, and between the particles, air layers are formed. The air layers each function as a heat insulating layer and can suppress an increase in temperature of the fine particles when an environmental temperature is increased. Hence, luminous efficiency of the fluorescent particles is not likely to vary, and the change in luminescent color can be suppressed.

Abstract translation: 主要由GaN构成并发出蓝色光的半导体发光元件设置有荧光层，荧光层包括由YAG荧光物质形成的荧光粒子。 通过在从荧光颗粒发射的黄色光和蓝色光之间合成，获得白光。 诸如二氧化硅的细颗粒附着在形成荧光层的荧光颗粒的周围，并且在颗粒之间形成空气层。 空气层各自用作绝热层，并且可以抑制当环境温度升高时细颗粒的温度升高。 因此，荧光体的发光效率不可能变化，能够抑制发光色的变化。

公开(公告)号：US20080053571A1

公开(公告)日：2008-03-06

申请号：US11896690

申请日：2007-09-05

Applicant: Masayasu Yamamoto ,  Takumi Shiomi ,  Kensuke Nakanishi ,  Masahiro Watanabe ,  Masami Aihara

Inventor： Masayasu Yamamoto ,  Takumi Shiomi ,  Kensuke Nakanishi ,  Masahiro Watanabe ,  Masami Aihara

IPC: B23K35/363 ,  B23K35/34

CPC classification number: B23K35/362 ,  B23K35/0244 ,  B23K35/025 ,  C08K5/04 ,  C08K5/1535 ,  C08K5/16

Abstract: A soldering flux contains a base resin and an activating agent. The soldering flux contains, as the activating agent, an oxygen-containing heterocyclic compound having at least one carboxyl group in a molecule. A solder paste composition contains the abovementioned soldering flux and the solder alloy powder. These enable exhibition of excellent wettability to lead-free metals and plating, irrespective of the type of the metals.

Abstract translation: 助焊剂含有基础树脂和活化剂。 助焊剂含有分子中具有至少一个羧基的含氧杂环化合物作为活化剂。 焊膏组合物含有上述助焊剂和焊料合金粉末。 这些能够使无铅金属和电镀具有优异的润湿性，不管金属的种类如何。