公开(公告)号：US20240069581A1

公开(公告)日：2024-02-29

申请号：US18235169

申请日：2023-08-17

Applicant: Micron Technology, Inc.

Inventor： Suresh Reddy Yarragunta ,  Deepu Narasimiah Subhash ,  Ramesh Nallavelli

IPC: G05D23/19 ,  G06F1/20 ,  G06F12/02

CPC classification number: G05D23/19 ,  G06F1/20 ,  G06F12/0246 ,  G06F2212/7201

Abstract: Some memory sub-systems are operated in high temperature and low airflow environments. As a safeguard, thermal throttling may limit throughput on a memory sub-system when a predetermined temperature is reached or exceeded. Improving heat dissipation increases the amount of time a memory sub-system can operate without initiating thermal throttling. Adding a phase-change material (PCM) with a melting temperature above the ambient temperature but below the thermal throttling temperature to a memory sub-system increases the amount of heat the memory sub-system can generate before the temperature reaches the thermal throttling temperature. Thermally coupling components with a heat spreading sheet causes the temperature of the components to vary less than when the components transfer heat by air. Thus, a component that generates less heat may be used to absorb heat generated by another component, increasing the amount of time before any component reaches the thermal throttling temperature.

公开(公告)号：US20230397372A1

公开(公告)日：2023-12-07

申请号：US18236146

申请日：2023-08-21

Applicant: Micron Technology, Inc.

Inventor： Suresh Reddy Yarragunta ,  Deepu Narasimiah Subhash

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20409 ,  H05K7/20509 ,  G06F1/20 ,  H05K7/20436 ,  H05K7/20009

Abstract: An apparatus including a heat sink having two or more sections of parallel fins that define colinear channels is disclosed herein. The colinear channels are configured to direct flow of air or coolant across the heat sink and have wider channel widths closer to an inlet for the air or coolant and narrower widths closer to an outlet for the air or coolant.

公开(公告)号：US11751357B2

公开(公告)日：2023-09-05

申请号：US17231994

申请日：2021-04-15

Applicant: Micron Technology, Inc.

Inventor： Suresh Reddy Yarragunta ,  Deepu Narasimiah Subhash

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20409 ,  G06F1/20 ,  H05K7/20009 ,  H05K7/20436 ,  H05K7/20509

Abstract: An apparatus including a heat sink having two or more sections of parallel fins that define colinear channels is disclosed herein. The colinear channels are configured to direct flow of air or coolant across the heat sink and have wider channel widths closer to an inlet for the air or coolant and narrower widths closer to an outlet for the air or coolant.

公开(公告)号：US20220338378A1

公开(公告)日：2022-10-20

申请号：US17231994

申请日：2021-04-15

Applicant: Micron Technology, Inc.

Inventor： Suresh Reddy Yarragunta ,  Deepu Narasimiah Subhash

IPC: H05K7/20 ,  G06F1/20

Abstract: An apparatus including a heat sink having two or more sections of parallel fins that define colinear channels is disclosed herein. The colinear channels are configured to direct flow of air or coolant across the heat sink and have wider channel widths closer to an inlet for the air or coolant and narrower widths closer to an outlet for the air or coolant.