公开(公告)号：US20120292087A1

公开(公告)日：2012-11-22

申请号：US13519217

申请日：2010-12-22

Applicant: Minoru Ueshima ,  Minoru Toyoda

Inventor： Minoru Ueshima ,  Minoru Toyoda

IPC: B23K1/20 ,  H05K1/16

CPC classification number: H01L23/49582 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/08501 ,  H01L2224/29026 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29447 ,  H01L2224/32245 ,  H01L2224/32501 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K3/3421 ,  H05K3/3463 ,  H05K2203/047 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/32145 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: The melting of die-bonding solder material is prevented even when soldering a surface-mount component formed using the die-bonding solder material on a printed circuit board using a mounting solder material.The surface-mount component formed using (Sn—Sb)-based solder material having high melting point as the solder material for die pad, the (Sn—Sb)-based solder material containing Cu not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn—Ag—Cu—Bi)-based solder material as the mounting solder material with the solder material being applied on the terminal portion. Since solidus temperature of the die-bonding solder material is 243 degrees C. and liquidus temperature of the mounting solder material is about 215 through 220 degrees C., the melting of die-bonding solder material is prevented even at the heating temperature (240 degrees C. or less) of a reflow furnace.

Abstract translation: 即使使用安装焊料将使用芯片焊接焊料形成的表面安装部件焊接在印刷电路板上也可防止芯片焊接焊料的熔化。 使用具有高熔点的（Sn-Sb）基焊料作为芯片焊盘的焊料形成的表面安装部件，（Sn-Sb）基焊料，其含有不超过规定量的Cu成分的Cu， 其主要成分为Sn，使用（Sn-Ag-Cu-Bi）基焊料作为安装焊料材料焊接在电路板的基板端子部分上，焊料材料被施加在端子部分上。 由于芯片焊接材料的固相线温度为243℃，并且安装焊料的液相线温度为约215〜220℃，因此即使在加热温度（240度）下也能够防止芯片焊接材料的熔融 C.或更小）的回流炉。

公开(公告)号：US07628308B2

公开(公告)日：2009-12-08

申请号：US10500802

申请日：2003-01-08

Applicant: Masayuki Ojima ,  Haruo Suzuki ,  Hirofumi Nogami ,  Norihisa Eguchi ,  Osamu Munekata ,  Minoru Ueshima

Inventor： Masayuki Ojima ,  Haruo Suzuki ,  Hirofumi Nogami ,  Norihisa Eguchi ,  Osamu Munekata ,  Minoru Ueshima

IPC: B23K20/00 ,  B23K31/12 ,  B23K13/08 ,  B23K15/00 ,  C21C1/04 ,  C22C13/00 ,  B23K31/02

CPC classification number: B23K3/0646 ,  B23K1/08 ,  B23K35/262 ,  B23K2101/42 ,  H05K3/3463 ,  H05K3/3468

Abstract: The rate of decrease of an oxidation suppressing element in a solder bath is measured during a soldering operation. Soldering is then carried out while replenishing the solder bath is then replenished during soldering so as to maintain the surface level of molten solder in the bath with a replenishment solder alloy which supplies the oxidation suppressing element to the solder bath at at least the rate at which the oxidation suppressing element is consumed during soldering. When the oxidation suppressing element is P, the concentration of P in the replenishment solder alloy is preferably 60-100 ppm.

Abstract translation: 在焊接操作期间测量焊料浴中的氧化抑制元素的降低速率。 然后在焊接期间进行焊接，同时在焊接期间补充焊料浴，以便通过补充焊料合金来保持熔融焊料的表面水平，该补充焊料合金以至少以下的速率将氧化抑制元素供应到焊料槽 氧化抑制元件在焊接时被消耗。 当氧化抑制元素为P时，补充焊料合金中的P浓度优选为60〜100ppm。

公开(公告)号：US20090014092A1

公开(公告)日：2009-01-15

申请号：US11628746

申请日：2005-05-09

Applicant: Minoru Ueshima ,  Takashi Ishii

Inventor： Minoru Ueshima ,  Takashi Ishii

IPC: B23K35/14 ,  B22D19/14 ,  B23K35/00

CPC classification number: B23K35/40 ,  B23K35/0222 ,  B23K35/025 ,  B23K35/22 ,  C22C2001/1052 ,  Y10T428/1216

Abstract: [Problems] A conventional process for producing a solder preform in which a predetermined amount of high-melting metal particles are directly put into molten solder and stirred, requires a long time for dispersing the high-melting metal particles by stirring. Therefore, in the conventional method for producing a solder preform, dissolution of the high-melting metal particles into the molten solder occurred during stirring, and their particle diameters became small. If a semiconductor chip and a substrate are soldered with a solder preform containing metal particles having such decreased diameters, the space between portions being soldered becomes narrow, and a sufficient bonding strength is not obtained.[Means for Solving the Problems] In the present invention, a premixed master alloy having a higher proportion of the high-melting metal particles in solder is first prepared, then the premixed master alloy is put into molten solder to disperse the high-melting metal particles. Aa a result, the high-melting metal particles can be uniformly dispersed in solder in a short length of time. Accordingly, a solder preform which is obtained by the process for producing a solder preform according to the present invention can maintain a predetermined clearance between portions being soldered, and a sufficient bonding strength is obtained.

Abstract translation: [问题]将预定量的高熔点金属颗粒直接投入熔融焊料并搅拌的用于生产焊料预制件的常规方法需要长时间以通过搅拌分散高熔点金属颗粒。 因此，在以往的焊料预制体的制造方法中，在熔融焊料中溶解高熔点金属粒子发生搅拌，粒径变小。 如果半导体芯片和基板与含有直径减小的金属粒子的焊料预制体焊接，则被焊接的部分之间的间隔变窄，并且不能获得充分的接合强度。 解决问题的手段在本发明中，首先准备焊料中高熔点金属颗粒比例较高的预混合母合金，然后将预混合的母合金放入熔融焊料中以分散高熔点金属 粒子。 结果，高熔点金属颗粒可以在短时间内均匀地分散在焊料中。 因此，通过本发明的焊料预成型体的制造方法获得的焊料预成型体可以在被焊接的部分之间保持规定的间隙，并且获得充分的接合强度。

公开(公告)号：US20080246164A1

公开(公告)日：2008-10-09

申请号：US11628297

申请日：2005-05-26

Applicant: Minoru Ueshima

Inventor： Minoru Ueshima

IPC: H01L23/488 ,  B23K35/36 ,  B23K1/00

CPC classification number: B23K35/262 ,  B23K35/0244 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29298 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A pellet for use in die bonding of an electronic chip and a substrate in an electronic component generates minimized voids in spite of the pellet being made of a lead-free solder. The pellet forms a colorless transparent protective film comprising Sn-(30-50 at % 0)-(5-15 at % P) or Sn-(10-30 at % In)-(40-60 at % O)-(5-15 at % P) when heated for soldering, has a thickness of 0.05-1 mm, and has generally the same shape as the semiconductor chip to be bonded to the substrate.

Abstract translation: 用于电子部件中的电子芯片和基板的芯片接合的芯片尽管由无铅焊料制成，但也产生尽可能小的空隙。 颗粒形成无色透明的保护膜，其包含Sn-（30-50at％0） - （5-15at％P）或Sn-（10-30at％In） - （40-60at％O） - （ 5-15at％P）当加热用于焊接时，具有0.05-1mm的厚度，并且具有与要结合到基板的半导体芯片大体上相同的形状。

公开(公告)号：US20060011709A1

公开(公告)日：2006-01-19

申请号：US10500802

申请日：2003-01-08

Applicant: Masayuki Ojima ,  Haruo Suzuki ,  Hirofumi Nogami ,  Norihisa Equchi ,  Osamu Munekata ,  Minoru Ueshima

Inventor： Masayuki Ojima ,  Haruo Suzuki ,  Hirofumi Nogami ,  Norihisa Equchi ,  Osamu Munekata ,  Minoru Ueshima

IPC: B23K35/14

CPC classification number: B23K3/0646 ,  B23K1/08 ,  B23K35/262 ,  B23K2101/42 ,  H05K3/3463 ,  H05K3/3468

Abstract: In this invention, the rate of decrease of an oxidation suppressing element in a solder bath during use is measured, and a solder alloy including the oxidation suppressing element in the same or greater proportion than the rate of decrease in the amount is suitably added in accordance with the decrease in the solder bath. As a simple method, in flow soldering of an Sn—Ag based or Sn—Ag—Cu based solder alloy, to compensate for a decrease in the P content of the solder bath which is observed during operation, a solder alloy containing 60-100 ppm by mass of P in an Sn—Ag based or Sn—Ag—Cu based solder alloy for replenishing a solder bath is supplied to maintain not only the P content but also the surface level of molder solder bath.

Abstract translation: 在本发明中，测定使用时的焊料槽中的氧化抑制元素的降低率，并且按照与该量的减少量相同或更大的比例包含氧化抑制元素的焊料合金， 随着焊锡槽的减少。 作为简单的方法，在Sn-Ag系或Sn-Ag-Cu类焊料合金的流焊中，为了补偿在操作中观察到的焊料槽的P含量的降低，含有60-100 提供用于补充焊料槽的Sn-Ag系或Sn-Ag-Cu系焊料合金中的P质量ppm，不仅保持了P含量，而且还保持了成型焊料槽的表面水平。

公开(公告)号：US08865062B2

公开(公告)日：2014-10-21

申请号：US13261682

申请日：2012-08-08

Applicant: Minoru Ueshima ,  Rei Fujimaki

Inventor： Minoru Ueshima ,  Rei Fujimaki

IPC: C22C30/04

CPC classification number: B23K35/262 ,  B23K35/025 ,  B23K35/24 ,  B23K35/28 ,  C22C12/00 ,  C22C13/02 ,  C22C30/02 ,  C22C30/04 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2912 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/351 ,  Y10T403/479 ,  H01L2224/45099 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/013 ,  H01L2924/01028 ,  H01L2924/20107 ,  H01L2924/20106 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A Sn—Sb—Ag—Cu based high-temperature lead-free solder alloy which has excellent connection reliability and which does not form a low melting point phase even when solidified by slow cooling is provided. It has an alloy composition consisting essentially of, in mass percent, Sb: 35-40%, Ag: 13-18%, Cu: 6-8%, and a remainder of Sn.

Abstract translation: 提供了具有优异的连接可靠性并且即使在通过缓慢冷却固化时也不形成低熔点相的Sn-Sb-Ag-Cu基高温无铅焊料合金。 其具有以质量％计含有Sb：35-40％，Ag：13-18％，Cu：6-8％，余量为Sn的合金组成。

公开(公告)号：US08845826B2

公开(公告)日：2014-09-30

申请号：US12452610

申请日：2008-07-14

Applicant: Yuji Kawamata ,  Minoru Ueshima ,  Tomu Tamura ,  Kazuhiro Matsushita ,  Masashi Sakamoto

Inventor： Yuji Kawamata ,  Minoru Ueshima ,  Tomu Tamura ,  Kazuhiro Matsushita ,  Masashi Sakamoto

IPC: C22C13/02 ,  H05K3/34 ,  B23K35/26 ,  C22C13/00

CPC classification number: C22C13/00 ,  B23K35/262 ,  C22C13/02 ,  H05K3/3463

Abstract: A Sn—Ag—Cu—Bi lead-free solder which can be used for soldering of vehicle-mounted electronic circuits and which has excellent resistance to heat cycles and mechanical strength is provided. The solder contains Ag: 2.8-4 mass %, Bi: 1.5-6 mass %, Cu: 0.8-1.2 mass %, and a remainder of Sn.

Abstract translation: 提供了可用于车载电子电路的焊接并且具有优异的耐热循环性和机械强度的Sn-Ag-Cu-Bi无铅焊料。 焊料含有Ag：2.8〜4质量％，Bi：1.5〜6质量％，Cu：0.8〜1.2质量％，余量为Sn。

公开(公告)号：US20140186208A1

公开(公告)日：2014-07-03

申请号：US13996459

申请日：2012-05-10

Applicant: Ippei Akagi ,  Hideki Tokimoto ,  Seiki Suzuki ,  Masahumi Seino ,  Isamu Osawa ,  Minoru Ueshima

Inventor： Ippei Akagi ,  Hideki Tokimoto ,  Seiki Suzuki ,  Masahumi Seino ,  Isamu Osawa ,  Minoru Ueshima

IPC: B23K35/26

CPC classification number: B23K35/262 ,  B23K35/26 ,  C22C13/00

Abstract: To provide audio solder alloy which is senary solder alloy (Sn.Ag.Cu.In.Ni.Pb) and has their appropriate contained amounts to obtain excellent sound quality and high auditory assessment, as the joining solder for connecting various kinds of electronics parts used for electronic circuit such as a filter circuit NW for audio system. A preferably example of the contained amounts is as follows: Ag of 1.0 through 1.01% by mass, Cu of 0.71 through 0.72% by mass, In of 0.003 through 0.0037% by mass, Ni of 0.016 through 0.017% by mass, Pb of 0.0025 through 0.0035% by mass and the remainder of Sn.

Abstract translation: 为了提供作为合金焊料合金（Sn.Ag.Cu.In.Ni.Pb）的音频焊料合金，并且具有适当的含量以获得优良的声音质量和高的听觉评估，作为用于连接各种电子部件的接合焊料 用于电子电路，例如用于音频系统的滤波器电路NW。 所含量的优选实例如下：Ag为1.0〜1.01质量％，Cu为0.71〜0.72质量％，In为0.003〜0.0037质量％，Ni为0.016〜0.017质量％，Pb为0.0025 通过0.0035质量％，剩余的Sn。

公开(公告)号：US20130121874A1

公开(公告)日：2013-05-16

申请号：US13261554

申请日：2011-06-17

Applicant: Minoru Ueshima ,  Yoshimi Inagawa ,  Minoru Toyoda

Inventor： Minoru Ueshima ,  Yoshimi Inagawa ,  Minoru Toyoda

IPC: B23K35/26

CPC classification number: B23K35/264 ,  B23K1/0016 ,  B23K35/26 ,  B23K2101/42 ,  C22C12/00 ,  H05K3/3463 ,  H05K3/3494

Abstract: A high-temperature solder alloy is a Bi—Sn based solder alloy containing at least 90 mass % of Bi, further containing 1-5 mass % of Sn, at least one element selected from Sb and/or Ag each in an amount of 0.5-5 mass %, and preferably further containing 0.0004-0.01 mass % of P.

Abstract translation: 高温焊料合金是含有至少90质量％的Bi的Bi-Sn系焊料合金，进一步含有1-5质量％的Sn，至少一种选自Sb和/或Ag的元素的量为0.5 -5质量％，优选进一步含有0.0004〜0.01质量％的P.

公开(公告)号：US08303735B2

公开(公告)日：2012-11-06

申请号：US11990518

申请日：2006-08-18

Applicant: Minoru Ueshima

Inventor： Minoru Ueshima

IPC: B23K35/26

CPC classification number: C22C28/00 ,  B23K35/26 ,  B23K35/264 ,  C22C12/00 ,  H05K3/3463

Abstract: A conventional low-temperature solder containing Pb or Cd had problems with respect to environmental pollution. A conventional low-temperature lead-free solder had a liquidus temperature which was too high for low heat resistance parts having a heat resistance temperature of 130° C., or it was brittle or had low mechanical strength. A lead-free low-temperature solder according to the present invention comprises 48-52.5 mass % of In and a balance of Bi, and most of the structure is constituted by a BiIn2 intermetallic compound which is not brittle. Zn or La can be added in order to further improve solderability, and a small amount of P can be added to prevent corrosion at high temperatures and high humidities.

Abstract translation: 含有Pb或Cd的常规低温焊料在环境污染方面存在问题。 常规的低温无铅焊料的液相线温度对于耐热温度为130℃的低耐热部件而言太高，或者是脆性或机械强度低的。 根据本发明的无铅低温焊料包含48-52.5质量％的In和余量的Bi，并且大部分结构由不脆的BiIn2金属间化合物构成。 可以添加Zn或La以进一步提高可焊性，并且可以加入少量的P以防止在高温和高湿度下的腐蚀。