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公开(公告)号：US11920036B2
公开(公告)日：2024-03-05
申请号：US17740278
申请日：2022-05-09
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao Liao , Hung-Yi Chang , Chien-Kai Wei , Chia-Lin Liu
CPC classification number: C08L9/06 , B32B15/06 , B32B25/02 , B32B2307/204
Abstract: A rubber resin material with high dielectric constant and a metal substrate with high dielectric constant are provided. The rubber resin material with high dielectric constant includes a rubber resin composition with high dielectric constant and inorganic fillers. The rubber resin composition with high dielectric constant includes: 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. A dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0.
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公开(公告)号：US20230279226A1
公开(公告)日：2023-09-07
申请号：US17740375
申请日：2022-05-10
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao Liao , Wei-Ru Huang , Hung-Yi Chang , Chia-Lin Liu , Chien Kai Wei
CPC classification number: C08L79/08 , C08G73/1032 , C08G73/105 , C08G73/1082 , C08G73/1042 , C08L2201/08 , C08L2201/10 , C08L2203/16
Abstract: A polyimide resin is obtained by polymerizing a modified polyphenylene ether resin with terminal amine groups and tetracarboxylic dianhydride. The polyimide has the following characteristics: the dissipation factor under 10 GHz electromagnetic wave is less than 0.0040; the water absorption rate is less than 0.3%; or, the temperature of glass transition is greater than 250° C.
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公开(公告)号：US20250011548A1
公开(公告)日：2025-01-09
申请号：US18448977
申请日：2023-08-14
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao Liao , HungFan Lee , Hng-Yi Chang , Wei-Ru Huang , Chia-Lin Liu
Abstract: A manufacturing method of a resin composition includes the following steps. An inorganic filler, a first solvent, and a dispersant are mixed, wherein a material of the dispersant is silane and/or polysiloxane including an organic-philic end and an inorganic-philic end, and the dispersant and the inorganic filler undergo a dealcoholization condensation reaction reaction to form a dispersion including a modified inorganic filler. The organic-philic end includes a carbonyl group, an epoxy group, and/or an amine group. Epoxy resin is dissolved into the dispersion.
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公开(公告)号：US20240417557A1
公开(公告)日：2024-12-19
申请号：US18357167
申请日：2023-07-24
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao Liao , Wei-Ru Huang , Hung-Yi Chang , Chia-Lin Liu
Abstract: The invention provides a resin composition that may effectively increase glass transition temperature while maintaining low-k electrical specification. The resin composition includes a first resin polymerized by a monomer mixture including styrene, divinylbenzene, and ethylene, a second resin including a bismaleimide-modified polyphenylene ether resin, a divinylbenzene crosslinking agent, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent.
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公开(公告)号：US20240166874A1
公开(公告)日：2024-05-23
申请号：US18300383
申请日：2023-04-13
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao Liao , Yu-Ting Liu , Hung-Yi Chang , Chia-Lin Liu , Wei-Ru Huang
IPC: C08L79/08 , C08K3/36 , C08K5/5415
CPC classification number: C08L79/08 , C08K3/36 , C08K5/5415 , C08L2205/025 , C08L2205/035
Abstract: A resin composition including a modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.
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Patent Agency Ranking
公开(公告)号：US20240166859A1
公开(公告)日：2024-05-23
申请号：US18087757
申请日：2022-12-22
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao Liao , Wei-Ru Huang , Hung-Yi Chang , Chia-Lin Liu
Abstract: A resin composition is provided. The resin composition includes a resin mixture, a flame retardant, spherical silica and a siloxane coupling agent. The resin mixture includes a first resin polymerized by a monomer mixture comprising styrene, divinylbenzene and ethylene, a second resin polymerized by modified dicyclopentadiene diamine and maleic anhydride, and a SBS resin. The resin composition of the disclosure may have a high glass transition temperature and a low dielectric constant and a low dissipation factor after curing.
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公开(公告)号：US11890832B2
公开(公告)日：2024-02-06
申请号：US17316677
申请日：2021-05-10
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao Liao , Hao-Sheng Chen , Hung-Yi Chang , Chih-Kai Chang , Chia-Lin Liu
CPC classification number: B32B15/16 , B32B5/16 , B32B15/08 , B32B15/14 , B32B2250/02 , B32B2250/03 , B32B2264/1021 , B32B2264/1023 , B32B2264/12 , B32B2264/201 , B32B2264/202 , B32B2307/204 , B32B2307/302
Abstract: A prepreg and a metallic clad laminate are provided. The prepreg includes a reinforcing material and a thermosetting resin layer. The thermosetting resin layer is formed by immersing the reinforcing material in a thermosetting resin composition. The thermosetting resin composition includes a polyphenylene ether resin, a liquid polybutadiene resin, a crosslinker, and fillers. Based on a total weight of the thermosetting resin composition being 100 phr, an amount of the fillers ranges from 50 phr to 70 phr. The fillers include a granular dielectric filler and a flaky thermal conductive filler. The metallic clad laminate is formed by disposing at least one metal layer onto the prepreg.
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公开(公告)号：US10023707B2
公开(公告)日：2018-07-17
申请号：US14973809
申请日：2015-12-18
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao Liao , Dein-Run Fung , Ying-Te Huang , Hao-Sheng Chen , Hung-Yi Chang , Chia-Lin Liu
Abstract: A thermosetting resin composition due to containing a modified PPE resin as a main ingredient is suited for use in making a pregreg or a copper foil substrate, when hardened, featuring a small dielectric constant (Dk), a low dielectric dissipation factor (Df) and a high Tg as well as a high resistance to heat and flame, this outstanding result is because the modified PPE resin is formed with a novel two-dimensional hardenable structure prepared to have side-chain reactive functional groups being provided in addition to those at the terminal ends of the main chain of the PPE resin thereof.
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公开(公告)号：US20250075067A1
公开(公告)日：2025-03-06
申请号：US18481241
申请日：2023-10-05
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao Liao , Wei-Ru Huang , Hung-Yi Chang , Chia-Lin Liu
Abstract: Disclosed is a resin composition including a resin. The resin includes a benzoxazine resin, an epoxy resin, and a modified maleimide resin. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by performing a nitration and a hydrogenation to a dicyclopentadiene phenolic resin.
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公开(公告)号：US20240228767A1
公开(公告)日：2024-07-11
申请号：US18170561
申请日：2023-02-17
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao Liao , Wei-Ru Huang , Hung-Yi Chang , Chia-Lin Liu
IPC: C08L63/00
CPC classification number: C08L63/00 , C08L2201/02 , C08L2205/025 , C08L2205/035
Abstract: A resin composition includes an epoxy resin, a benzoxazine resin, a BMI resin, and a modified polyphenylene ether resin has a structure represented by the following formula:
wherein R represents a chemical group of a bisphenol compound located between two hydroxyphenyl functional groups, and n is an integer ranging from 3 to 25.
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