公开(公告)号：US20220170619A1

公开(公告)日：2022-06-02

申请号：US17533922

申请日：2021-11-23

Applicant: NICHIA CORPORATION

Inventor： Shinichi DAIKOKU

IPC: F21V23/00

Abstract: A planar light source includes: a support member that defines a plurality of first holes extending from an upper surface to a lower surface of the support member, wherein the support member comprises a wiring layer disposed at a lower surface side; a light source disposed on the upper surface of the support member, the light source including: a light-emitting element, and a plurality of electrodes disposed on a lower surface of the light-emitting element; and a plurality of conductive members, each of which is disposed in a corresponding one of the first holes and electrically connects a corresponding one of the electrodes and the wiring layer. A lower surface of each of the electrodes is located in the corresponding first hole. Each of the conductive members is in contact with the lower surface and lateral surfaces of the corresponding electrode.

公开(公告)号：US20210296534A1

公开(公告)日：2021-09-23

申请号：US17303661

申请日：2021-06-03

Applicant: NICHIA CORPORATION

Inventor： Daisuke KASAI ,  Akira MIKI ,  Toru HASHIMOTO ,  Shinichi DAIKOKU

IPC: H01L33/24 ,  G02F1/13357 ,  H01L33/50 ,  H01L33/62

Abstract: In order to obtain a light emitting module with a less unevenness of luminance, provided is a method for manufacturing a light emitting module comprising: preparing a light emitter and a light-transmissive light guide plate, the light emitter comprising a light emitting element, the light guide plate having a first main surface serving as a light emitting surface from which light is emitted outside and a second main surface located opposite to the first main surface and having a concave portion, the concave portion comprising a side surface and a bottom surface that is smaller than an opening of the concave portion in a cross-sectional view; fixing the light emitter to the bottom surface of the concave portion via a bonding member; and forming a wiring at an electrode of the light emitting element.

公开(公告)号：US20190319065A1

公开(公告)日：2019-10-17

申请号：US16455549

申请日：2019-06-27

Applicant: NICHIA CORPORATION

Inventor： Shinichi DAIKOKU ,  Hirofumi NISHIYAMA

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/46 ,  H01L33/60

Abstract: A method of manufacturing a light emitting device includes: providing a wafer that comprises: a supporting substrate, and a plurality of light emitting structures arranged in a two-dimensional array on a first principal surface of the supporting substrate along a first direction and a second direction, each of the plurality of light emitting structures comprising a first semiconductor layer, which includes a first region and a second region, and a second semiconductor layer, which covers the second region of the first semiconductor layer, wherein the plurality of light emitting structures includes a first light emitting structure and a second light emitting structure; forming a recess in the first principal surface of the supporting substrate between the first light emitting structure and the second light emitting structure; forming a resin layer in the recess; and removing the supporting substrate so as to expose the first semiconductor layer.

公开(公告)号：US20180247973A1

公开(公告)日：2018-08-30

申请号：US15906912

申请日：2018-02-27

Applicant: NICHIA CORPORATION

Inventor： Shinichi DAIKOKU ,  Hirofumi NISHIYAMA

IPC: H01L27/15 ,  H01L33/00 ,  H01L33/62 ,  H01L33/46 ,  H01L33/60

CPC classification number: H01L27/156 ,  H01L33/0079 ,  H01L33/30 ,  H01L33/32 ,  H01L33/46 ,  H01L33/502 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A method of manufacturing a light emitting device includes: (a) providing a wafer that includes a plurality of light emitting structures, each including a first and second semiconductor layer; (b) forming a first insulating layer so as to cover the light emitting structures and define first and second through-holes corresponding to a respective one of the light emitting structures; (c) forming electrically-conductive structures, each electrically connected with a respective one of the first semiconductor layers and first wirings, each electrically connected with a column of the second semiconductor layers aligned in a second direction; (d) forming a second insulating layer so as to cover the first wirings, the second insulating layer defining third through-holes each disposed above a respective one of the first electrically-conductive structures; and (e) forming second wirings, each electrically connected with a row the first electrically-conductive structures aligned in a first direction.

公开(公告)号：US20160240742A1

公开(公告)日：2016-08-18

申请号：US15141164

申请日：2016-04-28

Applicant: NICHIA CORPORATION

Inventor： Shun KITAHAMA ,  Keiji EMURA ,  Shinichi DAIKOKU

IPC: H01L33/42 ,  H01L33/32 ,  H01L33/46

CPC classification number: H01L33/42 ,  H01L33/32 ,  H01L33/38 ,  H01L33/405 ,  H01L33/44 ,  H01L33/46 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033

Abstract: A method of manufacturing a semiconductor light emitting element includes providing a semiconductor stacked layer body; forming an insulating layer on a portion of the semiconductor stacked layer body; forming a light-transmissive electrode covering an upper surface of the semiconductor stacked layer body and an upper surface of the insulating layer, and on a region at least partially overlapping a region for disposing an extending portion in a plan view; forming a light reflecting layer in each of the openings of the light-transmissive electrode; forming a protective layer on a main surface side of the semiconductor stacked layer body; forming a mask on an upper surface of the protective layer except for the region for forming the pad electrode; etching the protective layer to form an opening in the protective layer; and forming a pad electrode in the opening of the protective layer.