公开(公告)号：US20160020363A1

公开(公告)日：2016-01-21

申请号：US14802985

申请日：2015-07-17

Applicant: Nichia Corporation

Inventor： Shun KITAHAMA ,  Keiji EMURA ,  Shinichi DAIKOKU

IPC: H01L33/40 ,  H01L33/44 ,  H01L33/38 ,  H01L33/42

CPC classification number: H01L33/42 ,  H01L33/32 ,  H01L33/38 ,  H01L33/405 ,  H01L33/44 ,  H01L33/46 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033

Abstract: A method of manufacturing a semiconductor light emitting element includes providing a semiconductor stacked layer body; forming an insulating layer on a portion of the semiconductor stacked layer body; forming a light-transmissive electrode covering an upper surface of the semiconductor stacked layer body and an upper surface of the insulating layer, and on a region at least partially overlapping a region for disposing an extending portion in a plan view; forming a light reflecting layer in each of the openings of the light-transmissive electrode; forming a protective layer on a main surface side of the semiconductor stacked layer body; forming a mask on an upper surface of the protective layer except for the region for forming the pad electrode; etching the protective layer to form an opening in the protective layer; and forming a pad electrode in the opening of the protective layer.

Abstract translation: 一种制造半导体发光元件的方法包括：提供半导体层叠体; 在半导体层叠体的一部分上形成绝缘层; 形成覆盖所述半导体层叠体的上表面的绝缘层的上表面的透光性电极以及在平面图中至少部分地与所述延伸部配置的区域重叠的区域; 在透光电极的每个开口中形成光反射层; 在半导体层叠体主体的主面侧形成保护层; 在除了用于形成焊盘电极的区域之外的保护层的上表面上形成掩模; 蚀刻保护层以在保护层中形成开口; 以及在保护层的开口中形成焊盘电极。

公开(公告)号：US20210191031A1

公开(公告)日：2021-06-24

申请号：US17125989

申请日：2020-12-17

Applicant: NICHIA CORPORATION

Inventor： Shinichi DAIKOKU

IPC: F21V8/00 ,  H01L25/075 ,  H01L33/58 ,  H01L33/62

Abstract: A light-emitting module manufacturing method of the present disclosure includes: providing a plurality of light sources each including a semiconductor layered structure and an electrode; providing a lightguide plate having a first principal surface to serve as a light extraction surface, a second principal surface opposite to the first principal surface, and a plurality of through holes penetrating through the lightguide plate from the first principal surface to the second principal surface; providing a light modulating member in each of the through holes; providing a plurality of bonding members on the light modulating member; equalizing heights of upper surfaces of the plurality of bonding members; placing the light sources on the bonding members such that the electrode faces away from the light modulating member; providing a cover member so as to cover the second principal surface; and forming an interconnect layer electrically coupled with the light sources.

公开(公告)号：US20200341185A1

公开(公告)日：2020-10-29

申请号：US16855064

申请日：2020-04-22

Applicant: NICHIA CORPORATION

Inventor： Shinichi DAIKOKU

IPC: F21V8/00 ,  G02F1/1335 ,  G02F1/13357

Abstract: A light guide body aggregate substrate includes: a light-transmitting substrate having a main surface; a plurality of unit regions, wherein the plurality of unit regions are arranged one-dimensionally in one row extending in a first direction and a plurality of columns, or two-dimensionally in a plurality of rows extending in the first direction and a plurality of columns extending in a second direction, and wherein a light guide structure is located in each unit region; a marginal region; and a plurality of first alignment marks arranged in the first direction on the substrate in the marginal region, each first alignment mark being disposed at a position corresponding to a position in the first direction of a corresponding one of the plurality of columns of the plurality of unit regions extending in the second direction.

公开(公告)号：US20220066083A1

公开(公告)日：2022-03-03

申请号：US17412914

申请日：2021-08-26

Applicant: NICHIA CORPORATION

Inventor： Shinichi DAIKOKU

IPC: F21V8/00 ,  H01L33/50 ,  H01L33/60

Abstract: A light-emitting module includes: a light-guiding plate having a first main surface serving as a light extracting surface and a second main surface opposite to the first main surface, a recess defined in the second main surface by at least one lateral surface and a base surface; a wavelength conversion member in the recess of the light-guiding plate, the wavelength conversion member having a first surface facing the base surface defining the recess, a second surface opposite to the first surface, and at least one lateral surface between the first surface and the second surface; at least one light-emitting element bonded to the second surface of the wavelength conversion member; a light-transmissive member disposed between the lateral surface defining the recess and the lateral surface of the wavelength conversion member; and a light-reflective member covering the second main surface of the light-guiding plate and lateral surfaces of the light-emitting element.

公开(公告)号：US20200243711A1

公开(公告)日：2020-07-30

申请号：US16774614

申请日：2020-01-28

Applicant: NICHIA CORPORATION

Inventor： Yoshiki SATO ,  Masaaki KATSUMATA ,  Shinichi DAIKOKU ,  Yoshikazu MATSUDA ,  Ryuma MARUME ,  Eiko MINATO

IPC: H01L33/00 ,  H01L25/075

Abstract: A method for manufacturing a light-emitting device includes preparing an intermediate product; the product includes a light-emitting element provided with paired electrodes at a first surface and a first covering member covering the light-emitting element such that portions of surfaces of the paired electrodes are exposed. A metal paste layer is formed, continuously covering the exposed portion of the paired electrodes and the first covering member. Paired wirings are formed for preventing the paired electrodes from being short-circuited. The metal paste layer on the paired electrodes and the metal paste layer on the first covering member are irradiated with laser light to remove the metal paste layer between the paired electrodes and a portion of the metal paste layer on the first covering member.

公开(公告)号：US20190006336A1

公开(公告)日：2019-01-03

申请号：US16024605

申请日：2018-06-29

Applicant: NICHIA CORPORATION

Inventor： Shinichi DAIKOKU ,  Daisuke SANGA

IPC: H01L25/16 ,  H01L33/00 ,  H01L33/60 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L33/38 ,  H01L33/20

Abstract: A method of manufacturing a light emitting device includes: providing a semiconductor stack including a first semiconductor layer and a second semiconductor layer; forming light emitting cells by forming grooves in column and row directions; exposing a portion of the first semiconductor layer from the second semiconductor layer in each light emitting cell; forming a first insulation layer having a first hole on the light emitting cells and the grooves; forming a wiring electrode to be in electrical connection with the first semiconductor layer at the first hole in each light emitting cell; forming a second hole in the first insulation layer; forming a second electrode to be in electrical connection with the second semiconductor layer at the second hole; thinning the first semiconductor layer; and exposing the first insulation layer from the first semiconductor layer at the grooves while roughening the surface of the first semiconductor layer.

公开(公告)号：US20210116631A1

公开(公告)日：2021-04-22

申请号：US17138405

申请日：2020-12-30

Applicant: NICHIA CORPORATION

Inventor： Shinichi DAIKOKU

IPC: F21V8/00 ,  G02F1/13357 ,  G02F1/1335

Abstract: A light guide body aggregate substrate includes: a light-transmitting substrate having a main surface; a plurality of unit regions located at the main surface of the substrate, wherein the plurality of unit regions are spaced apart from each other, wherein the plurality of unit regions are arranged one-dimensionally in one row extending in a first direction and a plurality of columns, or arranged two-dimensionally in a plurality of rows extending in the first direction and a plurality of columns extending in a second direction, and wherein a light guide structure is located in each unit region; a first region located at the main surface of the substrate, surrounding the plurality of unit regions; and a 1-A alignment mark and a 1-B alignment mark arranged at the substrate in the first region.

公开(公告)号：US20200013933A1

公开(公告)日：2020-01-09

申请号：US16505031

申请日：2019-07-08

Applicant: NICHIA CORPORATION

Inventor： Shinichi DAIKOKU

IPC: H01L33/50 ,  F21V8/00 ,  G02F1/1335 ,  H01L33/60

Abstract: A method, comprising: providing a light emitting element including a semiconductor stack body and an electrode; providing a lightguide plate having a first surface and a second surface opposite to the first surface, wherein the second surface includes a plurality of recesses; arranging a light-transmitting member in each of the recesses; adjusting upper surfaces of the light-transmitting members to a uniform height; placing a wavelength conversion member on the light-transmitting member; placing the light emitting element on the wavelength conversion member with the electrode facing up; arranging a cover member that covers the light emitting element; removing the cover member until the electrode is exposed; and forming a wiring that electrically connects the light emitting elements together.

公开(公告)号：US20160240757A1

公开(公告)日：2016-08-18

申请号：US15041921

申请日：2016-02-11

Applicant: NICHIA CORPORATION

Inventor： Shinichi DAIKOKU ,  Shun KITAHAMA ,  Keiji EMURA ,  Akihiro NAKAMURA

IPC: H01L33/62 ,  H01L33/38

CPC classification number: H01L33/38 ,  H01L33/145 ,  H01L33/42

Abstract: A light-emitting element includes a semiconductor stacked body, a light transmissive conductive film disposed on the semiconductor stacked body, the light transmissive conductive film including a plurality of through holes, insulation films disposed in the plurality of through holes, the plurality of through holes being disposed on the semiconductor stacked body; and a pad electrode disposed on the light transmissive conductive film and the insulation films.

Abstract translation: 发光元件包括半导体层叠体，设置在半导体层叠体上的透光导电膜，透光导电膜包括多个通孔，设置在多个通孔中的绝缘膜，多个通孔 设置在半导体堆叠体上; 以及设置在透光导电膜和绝缘膜上的焊盘电极。

公开(公告)号：US20220302341A1

公开(公告)日：2022-09-22

申请号：US17830148

申请日：2022-06-01

Applicant: NICHIA CORPORATION

Inventor： Yoshiki SATO ,  Masaaki KATSUMATA ,  Shinichi DAIKOKU ,  Yoshikazu MATSUDA ,  Ryuma MARUME ,  Eiko MINATO

IPC: H01L33/00 ,  H01L25/075

Abstract: A light-emitting device comprising a package comprising a light-emitting element comprising a first surface and a second surface opposite to the first surface, a first light-transmissive member arranged on the second surface of the light-emitting element, paired electrodes at the first surface of the light-emitting element, and a first covering member covering the light-emitting element such that the paired electrodes are exposed from the first covering member. The light-emitting device further comprises a light-guiding plate on which the package is placed, and a second covering member arranged on the light-guiding plate and covering laterally the package. The light-emitting device further comprises paired wirings continuously covering the paired electrodes exposed and the first covering members and being connected to the paired electrodes respectively. The paired wirings are formed by irradiation of laser light on a metal paste layer continuously covering the paired electrodes and the first covering member to remove the metal paste layer between the paired electrodes, the metal paste layer comprising a mixture of a resin and metal powder.