公开(公告)号：US11163216B2

公开(公告)日：2021-11-02

申请号：US16855988

申请日：2020-04-22

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Takehiko Tanaka ,  Zhenyu Chen ,  Nan Guo ,  Zhen Huang ,  Duanliang Cheng ,  Liang Ding ,  Feifan Chen ,  Heng Jiang

IPC: G03B17/12 ,  G03B17/02 ,  H01L27/146 ,  G03B19/02 ,  H04N5/225 ,  F16M11/10 ,  G03B17/56 ,  F16M11/04 ,  F16M13/00

Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

公开(公告)号：US10771666B2

公开(公告)日：2020-09-08

申请号：US15780534

申请日：2016-12-01

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Baozhong Zhang ,  Zhen Huang ,  Feifan Chen ,  Nan Guo ,  Zhenyu Chen ,  Ye Wu

IPC: H04N5/225 ,  G03B17/02 ,  G02B7/04 ,  H05K3/30 ,  H05K3/34

Abstract: The present disclosure provides a camera module and an electrical bracket thereof. The electrical bracket is provided with a clear aperture. The electrical bracket not only has the functions of a conventional circuit board (conduction of the electrical signal of an electronic device such as a chip and a motor), but also has the effects of a conventional base to support an optical filter and serve as a motor base bracket.

公开(公告)号：US10701255B2

公开(公告)日：2020-06-30

申请号：US15780532

申请日：2016-12-01

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Baozhong Zhang ,  Zhenyu Chen ,  Zhen Huang ,  Heng Jiang

IPC: H04N5/225 ,  G02B13/00

Abstract: A photographing module and electric bracket thereof. The electric bracket can be made into any shape, having not only a function of a traditional base that supports a motor, but also serving to dispose a circuit, so as to ensure stability and security of a circuit of the photographing module. The electric bracket can also integrate therein a drive coil or an EMI shielding conductive layer, so as to reduce a material loss and manufacturing cost, while increasing reliability of shielding protection.

公开(公告)号：US10197890B2

公开(公告)日：2019-02-05

申请号：US15317118

申请日：2016-10-25

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Zhenyu Chen ,  Takehiko Tanaka ,  Nan Guo ,  Zhen Huang ,  Duanliang Cheng ,  Liang Ding ,  Feifan Chen ,  Heng Jiang

IPC: G03B17/56 ,  G03B17/12 ,  G03B17/02 ,  H04N5/225 ,  F16M11/10 ,  F16M11/04 ,  F16M13/00

Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

公开(公告)号：US20180113378A1

公开(公告)日：2018-04-26

申请号：US15317118

申请日：2016-10-25

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie Zhao ,  Zhenyu Chen ,  Takehiko Tanaka ,  Nan Guo ,  Zhen Huang ,  Duanliang Cheng ,  Liang Ding ,  Feifan Chen ,  Heng Jiang

IPC: G03B17/12 ,  H04N5/225

CPC classification number: G03B17/12 ,  F16M11/04 ,  F16M11/041 ,  F16M11/10 ,  F16M13/00 ,  G03B17/02 ,  G03B17/56 ,  G03B19/023 ,  H04N5/2254 ,  H04N5/2258

Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

公开(公告)号：US09894772B2

公开(公告)日：2018-02-13

申请号：US15460221

申请日：2017-03-15

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Zhenyu Chen ,  Takehiko Tanaka ,  Nan Guo ,  Zhen Huang ,  Duanliang Cheng ,  Liang Ding ,  Feifan Chen ,  Heng Jiang

IPC: H05K3/00 ,  H04N5/225 ,  B29C45/14 ,  G02B7/02 ,  G02B7/00 ,  B29L31/34

CPC classification number: H05K3/0011 ,  B29C45/14418 ,  B29C45/14639 ,  B29C45/14655 ,  B29C2045/14663 ,  B29L2031/3481 ,  G02B7/006 ,  G02B7/021 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/2258 ,  H05K3/284 ,  H05K2201/10121 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: A manufacturing method of a molded photosensitive assembly of an array imaging module includes the steps of providing an enclosing element at a mold engaging surface of a first mold body of a mold; receiving the circuit board in the mold and positioning between the first mold body and a second mold body; introducing a fluid state mold material into the closed mold to fill the mold cavity and enclose the electronic elements; solidifying the mold material in the mold cavity and forming a molded base integrated with the circuit board and the electronic elements; and separating the first mold body and the second mold body and obtaining a molded photosensitive assembly which is an integrated body of the circuit board, the electronic elements.

公开(公告)号：US09781324B2

公开(公告)日：2017-10-03

申请号：US15460216

申请日：2017-03-15

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Zhenyu Chen ,  Takehiko Tanaka ,  Nan Guo ,  Zhen Huang ,  Duanliang Cheng ,  Liang Ding ,  Feifan Chen ,  Heng Jiang

IPC: H04N5/225 ,  G02B7/02 ,  H05K1/02

CPC classification number: H04N5/2257 ,  G02B7/021 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2258 ,  H05K1/0274 ,  H05K2201/10121

Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

公开(公告)号：US12081849B2

公开(公告)日：2024-09-03

申请号：US17635121

申请日：2020-07-08

Applicant: NINGBO SUNNY OPOTECH CO., LTD

Inventor： Zhongyu Luan ,  Zhen Huang ,  Li Liu ,  Hongfeng Gan ,  Tinghua Li ,  Xinxiang Sun

IPC: H04N23/54 ,  H04N23/55 ,  H04N23/57 ,  H05K1/18 ,  H05K3/30

CPC classification number: H04N23/54 ,  H04N23/55 ,  H04N23/57 ,  H05K1/181 ,  H05K3/303 ,  H05K2201/10151 ,  H05K2203/1316

Abstract: The present application relates to a photosensitive assembly, including a circuit board, a photosensitive chip and a metal wire. A first surface of the circuit board has a protrusion structure and a chip attachment area, and the protrusion structure is distributed in the chip attachment area. The photosensitive chip is attached to the first surface by an adhesive, and the adhesive is at least disposed between the top surface of the protrusion structure and the bottom surface of the photosensitive chip. The metal wire electrically connects the photosensitive chip and the circuit board in a wire bonding manner. The present application further provides a corresponding manufacturing method for a camera module and a photosensitive assembly. The present application can avoid or suppress the deformation of the photosensitive chip at a smaller cost of space size. The photosensitive assembly and the camera module of the present application can improve the structural strength of the circuit board. The photosensitive assembly and the camera module of the present application can improve the heat dissipation efficiency of the photosensitive chip.

公开(公告)号：US11906879B2

公开(公告)日：2024-02-20

申请号：US17603183

申请日：2020-03-02

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Zhen Huang ,  Zhongyu Luan ,  Zongchun Yang ,  Fengsheng Xi ,  Chenxiang Xu

IPC: G03B17/02 ,  B29D11/00 ,  G03B13/34 ,  H04N23/54

CPC classification number: G03B17/02 ,  B29D11/00807 ,  G03B13/34 ,  H04N23/54

Abstract: Provided are a camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device. The molded photosensitive assembly is assembled with at least one optical lenses to form a camera module. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filter member. The molded base includes a first molded portion and a second molded portion. The first molded portion embeds a part of the imaging assembly. The second molded portion is integrally formed on a first upper surface of the first molded portion, and the second molded portion has a second upper surface and a second outer side surface. A filter member is attached to the second upper surface of the second molded portion, and corresponds to a photosensitive path of the imaging assembly. The second upper surface of the second molded portion is higher than the first upper surface of the first molded portion, so as to define and form an outer space by a second outer side surface of the second molded portion and the first upper surface of the first molded portion.

公开(公告)号：US11871100B2

公开(公告)日：2024-01-09

申请号：US17600735

申请日：2020-03-02

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Zhen Huang ,  Zhongyu Luan ,  Zongchun Yang ,  Lifeng Kan ,  Chenxiang Xu

IPC: H04N23/55 ,  G03B1/00 ,  G02B7/02 ,  G03B11/00

CPC classification number: H04N23/55 ,  G03B11/00 ,  G02B7/021

Abstract: Disclosed are a camera module, a blocking-type photosensitive assembly, a manufacturing method thereof, and an electronic device. The camera module includes a blocking-type photosensitive assembly and at least one motor camera lens assembly arranged on the blocking-type photosensitive assembly. The blocking-type photosensitive assembly includes a molded photosensitive assembly and a blocking structure arranged on the molded photosensitive assembly. A blocking surface of the blocking structure is higher than an upper surface of a filter element, and at least a part of the projection of the blocking surface of the blocking structure on the molded photosensitive assembly overlaps with the projection of an optical lens of the motor camera lens assembly on the molded photosensitive assembly to block the optical lens from directly contacting the filter element.