公开(公告)号：US20150056382A1

公开(公告)日：2015-02-26

申请号：US14396853

申请日：2013-04-26

Applicant: OSAKA UNIVERSITY ,  SHOWA DENKO K. K.

Inventor： Katsuaki Suganuma ,  Kuniaki Ohtsuka ,  Koichiro Murahashi ,  Yasutaka Takemura ,  Hiroshi Uchida

IPC: H01B1/22 ,  C09D11/03 ,  H01B13/00 ,  C09D11/52

CPC classification number: H01B1/22 ,  C09D11/03 ,  C09D11/52 ,  H01B13/0016 ,  H01B13/003 ,  H01B13/0036 ,  H05K1/097 ,  H05K3/1283 ,  H05K2201/0108 ,  H05K2201/026 ,  H05K2203/107

Abstract: Provided is a transparent conductive ink which contains metal nanowires and/or metal nanotubes as a conductive component and can form a coating film which has good conductivity and a high light transmittance property, and also provided is a transparent conductive pattern forming method wherein this transparent conductive ink is used for forming a transparent conductive pattern by simple production steps, to thereby suppress the production cost and environmental load. At least one of metal nanowires and metal nanotubes are dispersed in a dispersion medium containing a shape-holding material which contains an organic compound having a molecular weight in the range of 150 to 500 and which has a viscosity of 1.0×103 to 2.0×106 mPa·s at 25° C., to prepare a transparent conductive ink. A transparent conductive pattern is formed by printing a pattern having an arbitrary shape on a substrate using this transparent conductive ink, subjecting the pattern to a heating treatment to dry the pattern, and subjecting the pattern which has been dried to pulsed light irradiation.

Abstract translation: 提供一种透明导电油墨，其含有金属纳米线和/或金属纳米管作为导电成分，并且可以形成具有良好导电性和高透光性的涂膜，并且还提供了一种透明导电图案形成方法，其中该透明导电 油墨用于通过简单的生产步骤形成透明导电图案，从而抑制生产成本和环境负荷。 将金属纳米线和金属纳米管中的至少一种分散在含有形状保持材料的分散介质中，所述形状保持材料含有分子量为150〜500的有机化合物，其粘度为1.0×10 3〜2.0×10 6 mPa·s，在25℃下制备透明导电油墨。 通过使用该透明导电油墨在基板上印刷任意形状的图案，对图案进行加热处理以干燥图案，对经过干燥的图案进行脉冲光照射，形成透明导电图案。

公开(公告)号：US20150030783A1

公开(公告)日：2015-01-29

申请号：US14383170

申请日：2013-03-08

Applicant: SHOWA DENKO K.K. ,  OSAKA UNIVERSITY

Inventor： Katsuaki Suganuma ,  Masaya Nogi ,  Jinting Jiu ,  Tohru Sugahara ,  Hiroshi Uchida ,  Kenji Shinozaki

IPC: H01B13/00 ,  H05K3/10

CPC classification number: H01B13/003 ,  H01B13/0026 ,  H05K1/0306 ,  H05K1/097 ,  H05K3/10 ,  H05K3/106 ,  H05K2201/0108 ,  H05K2201/026

Abstract: A method for producing a transparent conductive pattern having an improved conductivity by pulse light irradiation. A transparent conductive pattern is produced by coating and drying a dispersion liquid having metal nanowires dispersed therein on a substrate, to deposit the metal nanowires, and irradiating pulsed light having a pulse width of 20 microseconds to 50 milliseconds to the metal nanowires deposited on the substrate, to thereby join intersections of the metal nanowires.

Abstract translation: 一种通过脉冲光照射产生具有改善的导电性的透明导电图案的方法。 通过将分散在其中的金属纳米线的分散液涂布并干燥在基板上，沉积金属纳米线，并将脉冲宽度为20微秒至50毫秒的脉冲光照射到沉积在基板上的金属纳米线，制成透明导电图案 从而连接金属纳米线的交点。

公开(公告)号：US12094850B2

公开(公告)日：2024-09-17

申请号：US17595826

申请日：2020-05-28

Applicant: OSAKA UNIVERSITY

Inventor： Katsuaki Suganuma ,  Chuantong Chen ,  Zheng Zhang

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29339 ,  H01L2224/29394 ,  H01L2224/29499 ,  H01L2224/32227 ,  H01L2224/83192 ,  H01L2224/83395 ,  H01L2224/83487 ,  H01L2224/8384 ,  H01L2924/05432

Abstract: A bonding structure production method for producing a bonding structure (100) includes at least bonding a semiconductor element (30) and a substrate (10) using a silver paste. The substrate (10) includes a die attachment portion (12) to which the semiconductor element (30) is to be bonded. The die attachment portion (12) includes an alumina layer (16) serving as a surface layer on a bonding side of the die attachment portion (12) to which the semiconductor element (30) is to be bonded. The silver paste contains a solvent and silver particles with a residual strain measured by X-ray diffractometry of at least 5.0%. Preferably, the silver particles have a volume-based 50% cumulative diameter of at least 100 nm and no greater than 50 μm.

公开(公告)号：US11049840B2

公开(公告)日：2021-06-29

申请号：US16324528

申请日：2017-06-16

Applicant: OSAKA UNIVERSITY

Inventor： Katsuaki Suganuma ,  Shijo Nagao ,  Akio Shimoyama ,  Shinya Seki

IPC: B23K1/00 ,  B23K3/00 ,  H01L23/00 ,  H01L21/52 ,  B23K101/40

Abstract: A bonding device (100) bonds at least one component (C) to a substrate (B) using a metal material (M). The bonding device (100) includes a wall section (20), at least one pressing section (40), and a rotational shaft (30). The rotational shaft (30) is fixed to the wall section (20). Each pressing section (40) has an arm (42) and a presser (43) or a substrate supporting member (90). The arm (42) extends from the rotational shaft (30). The arm (42) pivots about the rotational shaft (30). The presser (43) presses the component (C). The substrate supporting member (90) is disposed on a reference surface (142). The substrate supporting member (90) supports the substrate (B). The component (C) is bonded to the substrate (B) through point contact of the presser (43) with the component (C) or point contact of the substrate supporting member (90) with the reference surface (142).

公开(公告)号：US20200378912A1

公开(公告)日：2020-12-03

申请号：US16998395

申请日：2020-08-20

Applicant: OSAKA UNIVERSITY ,  YAMATO SCIENTIFIC CO., LTD.

Inventor： Katsuaki Suganuma ,  Shijo Nagao ,  Akio Shimoyama ,  Dongjin Kim ,  Kazutaka Takeshita ,  Naoki Wakasugi

IPC: G01N25/18

Abstract: A substrate evaluation chip is used to perform a test for evaluating a thermal characteristic of a mounting substrate that is mountable a power semiconductor. The substrate evaluation chip includes an insulating substrate bonded with the mounting substrate, and a heating pattern that is formed on a surface of the insulating substrate by a metallic film and is arranged by having a predetermined shape that is optimized to beat the insulating substrate more uniformly. The insulating substrate is a substrate in which an insulating film is formed on a surface of a single crystal substrate having a thermal conductivity of 250 [W/mK] or more.

公开(公告)号：US10651143B2

公开(公告)日：2020-05-12

申请号：US16097050

申请日：2017-04-28

Applicant: SHARP KABUSHIKI KAISHA ,  OSAKA UNIVERSITY

Inventor： Tomotoshi Satoh ,  Hiroya Sato ,  Katsuaki Suganuma ,  Aiji Suetake ,  Shijo Nagao ,  Jinting Jiu ,  Seiichiro Kihara

IPC: H01L23/00 ,  H05K3/32 ,  H01B1/02 ,  B22F1/00 ,  H01B1/22 ,  B22F7/06 ,  B22F5/00

Abstract: Provided is an electrode like a protruding electrode that is self-standing on a substrate. A conductive paste (202) contains a conductive powder, an alcoholic liquid component, and no adhesives. The conductive powder contains conductive particles having a thickness of 0.05 μm or more and 0.1 μm or less and a representative length of 5 μm or more and 10 μm or less, the representative length being a maximum diameter in a plane perpendicular to the direction of the thickness. The weight percentage of the alcoholic liquid component relative to the conductive paste is 8% or more and 20% or less.

公开(公告)号：US10332853B2

公开(公告)日：2019-06-25

申请号：US15116104

申请日：2015-02-03

Applicant: OSAKA UNIVERSITY

Inventor： Katsuaki Suganuma ,  Shijo Nagao ,  Chulmin Oh

IPC: H01L23/48 ,  H01L23/00 ,  H01L23/367 ,  H01L23/42 ,  H01L23/373

Abstract: A bonding structure (100) of the present invention includes a substrate (110), a metal film (120), a semiconductor element (130). The substrate (110), the metal film (120), and the semiconductor element (130) are laminated in order just mentioned. The metal film (120) contains a metal diffused through stress migration, and the substrate (110) and the semiconductor element (130) are bonded together with the metal film (120) therebetween.

公开(公告)号：US09236162B2

公开(公告)日：2016-01-12

申请号：US14396853

申请日：2013-04-26

Applicant: OSAKA UNIVERSITY ,  SHOWA DENKO K. K.

Inventor： Katsuaki Suganuma ,  Kuniaki Ohtsuka ,  Koichiro Murahashi ,  Yasutaka Takemura ,  Hiroshi Uchida

IPC: C09D11/52 ,  C09D11/03 ,  H01B1/22 ,  H01B13/00 ,  H05K1/09 ,  H05K3/12

CPC classification number: H01B1/22 ,  C09D11/03 ,  C09D11/52 ,  H01B13/0016 ,  H01B13/003 ,  H01B13/0036 ,  H05K1/097 ,  H05K3/1283 ,  H05K2201/0108 ,  H05K2201/026 ,  H05K2203/107

Abstract: Provided is a transparent conductive ink which contains metal nanowires and/or metal nanotubes as a conductive component and can form a coating film which has good conductivity and a high light transmittance property, and also provided is a transparent conductive pattern forming method wherein this transparent conductive ink is used for forming a transparent conductive pattern by simple production steps, to thereby suppress the production cost and environmental load. At least one of metal nanowires and metal nanotubes are dispersed in a dispersion medium containing a shape-holding material which contains an organic compound having a molecular weight in the range of 150 to 500 and which has a viscosity of 1.0×103 to 2.0×106 mPa·s at 25° C., to prepare a transparent conductive ink. A transparent conductive pattern is formed by printing a pattern having an arbitrary shape on a substrate using this transparent conductive ink, subjecting the pattern to a heating treatment to dry the pattern, and subjecting the pattern which has been dried to pulsed light irradiation.

Abstract translation: 提供一种透明导电油墨，其含有金属纳米线和/或金属纳米管作为导电成分，并且可以形成具有良好导电性和高透光性的涂膜，并且还提供了一种透明导电图案形成方法，其中该透明导电 油墨用于通过简单的生产步骤形成透明导电图案，从而抑制生产成本和环境负荷。 将金属纳米线和金属纳米管中的至少一种分散在含有形状保持材料的分散介质中，所述形状保持材料含有分子量为150〜500的有机化合物，其粘度为1.0×10 3〜2.0×10 6 mPa·s，在25℃下制备透明导电油墨。 通过使用该透明导电油墨在基板上印刷任意形状的图案，对图案进行加热处理以干燥图案，对经过干燥的图案进行脉冲光照射，形成透明导电图案。

公开(公告)号：US20150103269A1

公开(公告)日：2015-04-16

申请号：US14396994

申请日：2013-04-26

Applicant: OSAKA UNIVERSITY ,  SHOWA DENKO K.K.

Inventor： Katsuaki Suganuma ,  Hiroshi Uchida ,  Kenji Shinozaki

IPC: G06F3/044 ,  H05K3/12 ,  H05K3/28 ,  H05K1/09

CPC classification number: G06F3/044 ,  G06F2203/04103 ,  H05K1/097 ,  H05K3/1208 ,  H05K3/1283 ,  H05K3/1291 ,  H05K3/28 ,  H05K2201/0108 ,  H05K2203/107

Abstract: Provided are a transparent conductive substrate production method for an electrostatic capacitance touch panel having a high pattern recognition property, by simple steps without using a vacuum process and a wet etching method, as well as a transparent conductive substrate and an electrostatic capacitance touch panel. An electrode drawing lead wiring pattern is formed on at least one main face of a transparent film using a conductive paste. An electrode pattern forming unit prints an electrode pattern with a transparent conductive pattern forming ink containing metal nanowires or metal nanoparticles so that the electrode pattern is connected to the electrode drawing lead wiring pattern, and dries the printed electrode pattern. The dried electrode pattern is subjected to pulsed light irradiation by a photoirradiation unit 18, to sinter the metal nanowires or the metal nanoparticles contained in the transparent conductive pattern forming ink.

Abstract translation: 提供一种透明的导电性基板制造方法，其具有高图案识别性能，通过简单的步骤，不使用真空处理和湿蚀刻方法，以及透明导电基板和静电电容触摸面板。 使用导电膏在透明膜的至少一个主面上形成电极引出布线图案。 电极图案形成单元用形成含有金属纳米线或金属纳米线的墨的透明导电图案印刷电极图案，使得电极图案连接到电极引出布线图案，并干燥印刷电极图案。 通过光照射单元18对干燥的电极图案进行脉冲光照射，以烧结形成在透明导电图案中的金属纳米线或金属纳米颗粒。

公开(公告)号：US20140305684A1

公开(公告)日：2014-10-16

申请号：US14358164

申请日：2012-10-23

Applicant: NOF CORPORATION ,  OSAKA UNIVERSITY

Inventor： Eui-chul Kang ,  Tomoyuki Ohtake ,  Katsuaki Suganuma ,  Masaya Nogi ,  Natsuki Komoda

IPC: C09D11/00 ,  C23C18/08

CPC classification number: C09D11/52 ,  C09D11/30 ,  C09D11/32 ,  C23C18/06 ,  C23C18/08 ,  H01B1/22 ,  H05K1/097 ,  H05K3/1283 ,  H05K2203/121

Abstract: A composition for copper patterning and a method of copper patterning using the composition are provided, which composition is excellently safe in copper patterning, sintering at lower temperatures, and capable of forming a highly conducive copper pattern of a desired shape even on a plastic substrate. The composition contains Component A: a copper β-ketocarboxylate compound of formula (1): (R1, R2: H or C1-C6 straight- or C3-C6 branched-hydrocarbon group, etc.); and based on 1 mol of this compound, Component B: an amine compound having a boiling point of not higher than 250° C. at 0.1 to 500 mol; and Component C-1: an organic acid having pKa of not more than 4 at 0.01 to 20 mol, and/or Component C-2: an organic copper compound composed of copper and an organic acid having pKa of not more than 4 at 0.01 to 100 mol. The composition is useful in the field of electronics.

Abstract translation: 提供了一种用于铜图案化的组合物和使用该组合物的铜图案化方法，该组合物在铜图案化中是非常安全的，在较低温度下烧结，并且即使在塑料基板上也能够形成所需形状的高导电性铜图案。 该组合物含有组分A：式（1）的铜＆bgr-酮羧酸盐化合物：（R1，R2：H或C1-C6直链或C3-C6支链烃基等）; 并且基于1摩尔该化合物，组分B：沸点不高于250℃的胺化合物，0.1至500摩尔; 和组分C-1：在0.01至20mol下pKa不大于4的有机酸和/或组分C-2：由铜和有机酸组成的有机铜化合物，其中pKa不大于4，0.01 至100mol。 该组合物在电子领域是有用的。