公开(公告)号：US10451254B2

公开(公告)日：2019-10-22

申请号：US15708218

申请日：2017-09-19

Applicant: OSRAM GmbH

Inventor： Roberto Didone' ,  Alberto Zanotto ,  Simon Bobbo ,  Luca Volpato

IPC: F21V17/10 ,  F21S4/20 ,  F21V3/02 ,  F21V15/01 ,  F21V21/005 ,  F21S2/00 ,  F21S8/00 ,  F21S4/28 ,  F21Y115/00 ,  F21V33/00 ,  F21V21/02 ,  F21Y103/10 ,  F21Y115/10

Abstract: A lighting device may include an elongated body having at least one light emission surface. The body has at least one longitudinal groove extending along the elongated body. The groove has a tapered cross-section with a restricted mouth portion for receiving and retaining in the groove a complementary coupling element having a restricted stem portion and an enlarged head portion.

公开(公告)号：US10302282B2

公开(公告)日：2019-05-28

申请号：US15839891

申请日：2017-12-13

Applicant: OSRAM GmbH

Inventor： Luca Volpato ,  Alessio Griffoni

IPC: F21S4/22 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  F21V21/14 ,  H05B33/08 ,  F21V21/005

Abstract: A support structure for electrically-powered lighting devices (e.g. LED modules) includes: an elongated laminar substrate having first and second mutually opposed surfaces, a layer of electrically-conductive material, e.g. copper, on the first surface of the laminar substrate, the layer including etching forming first electrically-conductive formations extending along the first surface of the laminar substrate, a distribution of electrically-conductive areas on the second surface of the laminar substrate, the distribution including electrically-conductive areas formed by means of etching and distributed with a constant separation pitch along the second surface of the laminar substrate, electrically-conductive vias extending through the laminar substrate to connect the first electrically-conductive formations and the electrically-conductive areas in said distribution, and a network of second electrically-conductive formations including electrically-conductive ink deposited (e.g. printed) on the second surface of the laminar substrate, with second electrically-conductive formations in said network being electrically connected with the electrically-conductive areas in said distribution.

公开(公告)号：US20180168009A1

公开(公告)日：2018-06-14

申请号：US15837024

申请日：2017-12-11

Applicant: OSRAM GmbH

Inventor： Simon Bobbo ,  Valerio Michielan ,  Luca Volpato

IPC: H05B33/08 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05B33/083 ,  H05B33/0803 ,  H05K1/029 ,  H05K1/11 ,  H05K1/181 ,  H05K3/222 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/0228 ,  H05K2203/173 ,  H05K2203/175

Abstract: The printed circuit board includes metallic zones including: a first, second and third positive terminal, a first and second negative terminal, wherein the second negative terminal is connected to the first negative terminal, and electric contacts for the mounting of one or more LEDs and electric traces such that the LEDs are connected in series forming a LED string. The printed circuit board comprises selection means implemented with electric traces and metallic contacts adapted to be short-circuited via links in order to permit all of the following connections: a connection of the LED string between the first and third positive terminal, a connection of the LED string between the first positive terminal and the first negative terminal, a connection of the LED string between the second and third positive terminal, and a connection of the LED string between the second positive terminal and the first negative terminal.

公开(公告)号：US20180163955A1

公开(公告)日：2018-06-14

申请号：US15839891

申请日：2017-12-13

Applicant: OSRAM GmbH

Inventor： Luca Volpato ,  Alessio Griffoni

IPC: F21V21/005 ,  H05B33/08 ,  F21S4/22 ,  F21V21/14

CPC classification number: F21V21/005 ,  F21S4/22 ,  F21V21/14 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05B33/0815 ,  H05B33/0821 ,  H05B33/089 ,  H05K1/095 ,  H05K1/113 ,  H05K1/189 ,  H05K2201/0391 ,  H05K2201/10106

Abstract: A support structure for electrically-powered lighting devices (e.g. LED modules) includes: an elongated laminar substrate having first and second mutually opposed surfaces, a layer of electrically-conductive material, e.g. copper, on the first surface of the laminar substrate, the layer including etching forming first electrically-conductive formations extending along the first surface of the laminar substrate, a distribution of electrically-conductive areas on the second surface of the laminar substrate, the distribution including electrically-conductive areas formed by means of etching and distributed with a constant separation pitch along the second surface of the laminar substrate, electrically-conductive vias extending through the laminar substrate to connect the first electrically-conductive formations and the electrically-conductive areas in said distribution, and a network of second electrically-conductive formations including electrically-conductive ink deposited (e.g. printed) on the second surface of the laminar substrate, with second electrically-conductive formations in said network being electrically connected with the electrically-conductive areas in said distribution.

公开(公告)号：US20170227179A1

公开(公告)日：2017-08-10

申请号：US15415947

申请日：2017-01-26

Applicant: OSRAM GmbH

Inventor： Alessandro Scordino ,  Geert van der Meer ,  Luca Volpato

IPC: F21S4/24 ,  F21V29/503 ,  F21K9/90 ,  H01L25/075 ,  H01L33/64

CPC classification number: F21S4/24 ,  F21K9/90 ,  F21V21/096 ,  F21V29/503 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/641 ,  H01L33/642

Abstract: A support structure for electrically-powered light radiation sources, e.g. LED sources, includes a ribbon-like flexible substrate with a front surface having, distributed therealong, mounting locations for light radiation sources. The ribbon-like substrate has a back surface with a plurality of thermally dissipative elements coupled to said back surface at locations opposed mounting locations of the light radiation sources on the front surface.