公开(公告)号：US20210164839A1

公开(公告)日：2021-06-03

申请号：US17267789

申请日：2019-08-09

Applicant: Obsidian Sensors, Inc.

Inventor： John HONG ,  Bing WEN ,  Edward CHAN ,  Tallis CHANG ,  Sean ANDREWS

IPC: G01J5/02 ,  G01J5/20 ,  B81B3/00

Abstract: Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems for transmitting and detecting radiation. The devices and methods described herein are applicable to terahertz radiation. In some embodiments, the MEMS devices and systems are used in imaging applications. In some embodiments, a microelectromechanical system comprises a glass substrate configured to pass radiation from a first surface of the glass substrate through a second surface of the glass substrate, the glass substrate comprising TFT circuitry; a lid comprising a surface; spacers separating the lid and glass substrate; a cavity defined by the spacers, surface of the lid, and second surface of the glass substrate; a pixel in the cavity, positioned on the second surface of the glass substrate, electrically coupled to the TFT circuitry, and comprising an absorber to detect the radiation; and a reflector to direct the radiation to the absorbers and positioned on the lid.

公开(公告)号：US20210102844A1

公开(公告)日：2021-04-08

申请号：US17048046

申请日：2019-04-17

Applicant: Obsidian Sensors, Inc.

Inventor： Edward CHAN ,  Bing WEN ,  John HONG ,  Tallis CHANG ,  Seung-Tak RYU

IPC: G01J5/24 ,  G01J5/02 ,  G01J1/42 ,  H04N5/33 ,  G01J1/46

Abstract: Methods of sensor readout and calibration and circuits for performing the methods are disclosed. In some embodiments, the methods include driving an active sensor at a voltage. In some embodiments, the methods include use of a calibration sensor, and the circuits include the calibration sensor. In some embodiments, the methods include use of a calibration current source and circuits include the calibration current source. In some embodiments, a sensor circuit includes a Sigma-Delta ADC. In some embodiments, a column of sensors is readout using first and second readout circuits during a same row time.

公开(公告)号：US20210002130A1

公开(公告)日：2021-01-07

申请号：US16982519

申请日：2019-03-20

Applicant: Obsidian Sensors, Inc.

Inventor： John HONG ,  Tallis CHANG ,  Edward CHAN ,  Bing WEN ,  Yaoling PAN ,  Kenji NOMURA

IPC: B81C1/00

Abstract: A method of manufacturing MEMS housings includes: providing glass spacers; providing a window plate; attaching the window plate to the glass spacers; aligning the glass spacers with a device glass plate having MEMS devices thereon; bonding the glass spacers to the device glass plate; and singulating the glass spacers, window plate, and device glass plate to produce the MEMS housings.