公开(公告)号：US20180230004A1

公开(公告)日：2018-08-16

申请号：US15431725

申请日：2017-02-13

Applicant: OBSIDIAN SENSORS, INC.

Inventor： Yaoling PAN ,  Omar BCHIR

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/008 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00214 ,  B81C2201/05 ,  B81C2203/0792 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2224/45099

Abstract: Conventional package for integration of MEMS and electronics suffer from profiles that are undesirably high to due to the thickness of the glass. Also in conventional package manufacturing, the MEMS and electronic devices are first individualized, and the individualized MEMS and electronics are combined into a package, and thus can be costly. To address these and other disadvantages, a panel level packaging is proposed. In this proposal, plural MEMS devices are integrated with plural semiconductor devices at a panel level, and the panel is then individualized into separate packages.

公开(公告)号：US20250042727A1

公开(公告)日：2025-02-06

申请号：US18737611

申请日：2024-06-07

Applicant: OBSIDIAN SENSORS, INC.

Inventor： John HONG ,  Tallis CHANG ,  Edward CHAN ,  Bing WEN ,  Yaoling PAN ,  Sean ANDREWS

IPC: B81C1/00 ,  B81B3/00 ,  G01J5/20

Abstract: An electromechanical systems structure including: providing a stack, including a structural layer extending in a plane, a sidewall layer including a first portion lying in a plane parallel to the structural layer plane and a second portion lying in a plane transverse to the structural layer plane, an etch-stop layer, positioned between the sidewall layer and the structural layer, including an etch-selectivity different from an etch-selectivity of the structural layer and an etch-selectivity of the sidewall layer, and a mold comprising a wall parallel to the sidewall layer's second portion; etching the sidewall layer's first portion to expose the etch-stop layer; removing the mold; etching the etch-stop layer such that the sidewall layer's second portion masks a portion of the etch-stop layer; removing the sidewall layer's second portion; and etching the structural layer such that the portion of the etch-stop layer masks a portion of the structural layer.

公开(公告)号：US20200294878A1

公开(公告)日：2020-09-17

申请号：US16660664

申请日：2019-10-22

Applicant: Obsidian Sensors, Inc.

Inventor： Yaoling PAN ,  Tallis Young CHANG ,  John Hyunchul HONG

IPC: H01L23/31 ,  B81C1/00 ,  B81B7/00 ,  H01L21/56 ,  H01L21/683 ,  H01L21/768 ,  H01L23/522 ,  H01L23/528 ,  H01L27/12 ,  H01L33/52 ,  H01L33/62 ,  H01L51/00 ,  H01L51/52 ,  H01L51/56

Abstract: This disclosure provides devices and methods for 3-D device packaging with backside interconnections. One or more device elements can be hermetically sealed from an ambient environment, such as by vacuum lamination and bonding. One or more via connections provide electrical interconnection from a device element to a back side of a device substrate, and provide electrical interconnection from the device substrate to external circuitry on the back side of the device. The external circuitry can include a printed circuit board or flex circuit. In some implementations, an electrically conductive pad is provided on the back side, which is electrically connected to at least one of the via connections. In some implementations, the one or more via connections are electrically connected to one or more electrical components or interconnections, such as a TFT or a routing line.

公开(公告)号：US20180364439A1

公开(公告)日：2018-12-20

申请号：US15625089

申请日：2017-06-16

Applicant: OBSIDIAN SENSORS, INC.

Inventor： Yaoling PAN ,  Jian MA ,  John HONG ,  Tallis CHANG

IPC: G02B7/02 ,  G02B3/00 ,  H04N5/225

Abstract: Conventional optical lens assembly typically require a capping window, which is expensive, to protect the optical sensor. Also, each conventional optical lens assembly is discretely assembled, and thus incurs additional costs. To address these and other disadvantages, it is proposed to assemble a plurality of imaging sensors, a plurality of spacers, and a plurality of lenses at a panel. The resulting lens assembly array can be individualized into separate lens assemblies.

公开(公告)号：US20210002130A1

公开(公告)日：2021-01-07

申请号：US16982519

申请日：2019-03-20

Applicant: Obsidian Sensors, Inc.

Inventor： John HONG ,  Tallis CHANG ,  Edward CHAN ,  Bing WEN ,  Yaoling PAN ,  Kenji NOMURA

IPC: B81C1/00

Abstract: A method of manufacturing MEMS housings includes: providing glass spacers; providing a window plate; attaching the window plate to the glass spacers; aligning the glass spacers with a device glass plate having MEMS devices thereon; bonding the glass spacers to the device glass plate; and singulating the glass spacers, window plate, and device glass plate to produce the MEMS housings.