公开(公告)号：US08991194B2

公开(公告)日：2015-03-31

申请号：US13867589

申请日：2013-04-22

Applicant: Phononic Devices, Inc.

Inventor： Jesse W. Edwards ,  M. Sean June ,  Robert Joseph Therrien ,  Abhishek Yadav

IPC: F25B21/02 ,  F25B21/04

CPC classification number: F25B21/04 ,  F25B21/02 ,  F25B2321/021 ,  F25B2321/0212 ,  F25B2321/023 ,  F25B2321/025 ,  F25B2700/2104 ,  Y02B30/66

Abstract: Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s).

Abstract translation: 本公开的实施例涉及控制多个热电冷却器（TEC）以保持室的设定点温度。 在一个实施例中，控制器接收对应于室的温度的温度数据。 基于温度数据，控制器选择性地控制TEC的两个或多个子集以将腔室的温度保持在期望的设定点温度。 以这种方式，控制器能够控制TEC，使得TEC操作以有效地将室的温度保持在设定点温度。 在另一个实施例中，控制器基于温度数据和期望的性能轮廓来选择由控制器启用的一个或多个控制方案。 然后，控制器根据所选择的控制方案独立地控制TEC的一个或多个子集。

公开(公告)号：US08893513B2

公开(公告)日：2014-11-25

申请号：US13888847

申请日：2013-05-07

Applicant: Phononic Devices, Inc.

Inventor： M. Sean June ,  Robert Joseph Therrien ,  Abhishek Yadav ,  Jesse W. Edwards

IPC: F25B21/02 ,  F25B21/00 ,  H05K1/18 ,  H05K1/02

CPC classification number: F25B21/00 ,  F25B21/02 ,  H05K1/0204 ,  H05K1/182 ,  H05K2201/066 ,  H05K2201/10219 ,  Y10T29/49002

Abstract: A thermoelectric heat exchanger component includes a circuit board and multiple thermoelectric devices attached to the circuit board. Heights of at least two of the thermoelectric devices are different due to, for example, tolerances in a manufacturing process for the thermoelectric devices. The thermoelectric heat exchanger component also includes a first heat spreading lid over a first surface of the thermoelectric devices and a second heat spreading lid over a second surface of the thermoelectric devices. A thermal interface material is present between each one of the thermoelectric devices and the first and second heat spreading lids. The first heat spreading lid and the second heat spreading lid are oriented such that the thickness of the thermal interface material, and thus a thermal interface resistance, is optimized for the thermoelectric devices.

Abstract translation: 热电换热器部件包括电路板和附接到电路板的多个热电装置。 至少两个热电装置的高度由于例如热电装置的制造工艺中的公差而不同。 热电换热器部件还包括热电装置的第一表面上的第一散热盖和热电装置的第二表面上的第二散热盖。 在每个热电器件和第一和第二散热盖之间存在热界面材料。 第一散热盖和第二散热盖被定向成使得热界面材料的厚度以及因此的热界面电阻被优化用于热电装置。

公开(公告)号：US20130291563A1

公开(公告)日：2013-11-07

申请号：US13888833

申请日：2013-05-07

Applicant: PHONONIC DEVICES, INC.

Inventor： Jesse W. Edwards ,  M. Sean June ,  Robert Joseph Therrien ,  Abhishek Yadav

IPC: F25B21/04

CPC classification number: F25B21/04 ,  F25B21/02 ,  F25B2321/021 ,  F25B2321/0212 ,  F25B2321/023 ,  F25B2321/025 ,  F25B2700/2104 ,  Y02B30/66

Abstract: Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s).

Abstract translation: 本公开的实施例涉及控制多个热电冷却器（TEC）以保持室的设定点温度。 在一个实施例中，控制器接收对应于室的温度的温度数据。 基于温度数据，控制器选择性地控制TEC的两个或多个子集以将腔室的温度保持在期望的设定点温度。 以这种方式，控制器能够控制TEC，使得TEC操作以有效地将室的温度保持在设定点温度。 在另一个实施例中，控制器基于温度数据和期望的性能轮廓来选择由控制器启用的一个或多个控制方案。 然后，控制器根据所选择的控制方案独立地控制TEC的一个或多个子集。

公开(公告)号：US20130291560A1

公开(公告)日：2013-11-07

申请号：US13867567

申请日：2013-04-22

Applicant: PHONONIC DEVICES, INC.

Inventor： Robert Joseph Therrien ,  M. Sean June ,  Jesse W. Edwards ,  James Barton Summers, III ,  Abhishek Yadav

IPC: F25B21/04

CPC classification number: F25B21/04 ,  F25B21/02 ,  F25B2321/021 ,  F25B2321/0212 ,  F25B2321/023 ,  F25B2321/025 ,  F25B2700/2104 ,  Y02B30/66

Abstract: Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s).

Abstract translation: 本公开的实施例涉及控制多个热电冷却器（TEC）以保持室的设定点温度。 在一个实施例中，控制器接收对应于室的温度的温度数据。 基于温度数据，控制器选择性地控制TEC的两个或多个子集以将腔室的温度保持在期望的设定点温度。 以这种方式，控制器能够控制TEC，使得TEC操作以有效地将室的温度保持在设定点温度。 在另一个实施例中，控制器基于温度数据和期望的性能轮廓来选择由控制器启用的一个或多个控制方案。 然后，控制器根据所选择的控制方案独立地控制TEC的一个或多个子集。

公开(公告)号：US20130291559A1

公开(公告)日：2013-11-07

申请号：US13888847

申请日：2013-05-07

Applicant: PHONONIC DEVICES, INC.

Inventor： M. Sean June ,  Robert Joseph Therrien ,  Abhishek Yadav ,  Jesse W. Edwards

IPC: F25B21/00

CPC classification number: F25B21/00 ,  F25B21/02 ,  H05K1/0204 ,  H05K1/182 ,  H05K2201/066 ,  H05K2201/10219 ,  Y10T29/49002

Abstract: Embodiments of a thermoelectric heat exchanger component having a heat spreading lid that optimizes thermal interface resistance between the heat spreading lid and multiple thermoelectric devices and methods of fabrication thereof are disclosed. In one embodiment, a thermoelectric heat exchanger component includes a circuit board and multiple thermoelectric devices attached to the circuit board. Heights of at least two of the thermoelectric devices are different due to, for example, tolerances in a manufacturing process for the thermoelectric devices. The thermoelectric heat exchanger component also includes a heat spreading lid over the thermoelectric devices and a thermal interface material between the thermoelectric devices and the heat spreading lid. An orientation (i.e., a tilt) of the heat spreading lid is such that a thickness of the thermal interface material, and thus a thermal interface resistance, is optimized for the thermoelectric devices.

Abstract translation: 公开了一种具有散热盖的散热盖的优化热传导盖和多个热电元件之间的热界面电阻的热电换热器部件的实施例及其制造方法。 在一个实施例中，热电换热器部件包括电路板和附接到电路板的多个热电装置。 至少两个热电装置的高度由于例如热电装置的制造工艺中的公差而不同。 热电换热器部件还包括热电装置上的散热盖和热电装置与散热盖之间的热界面材料。 散热盖的取向（即，倾斜）使得热界面材料的厚度以及因此的热界面电阻被优化用于热电装置。