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公开(公告)号：US09234682B2
公开(公告)日：2016-01-12
申请号：US13888833
申请日：2013-05-07
Applicant: Phononic Devices, Inc.
Inventor： Jesse W. Edwards , M. Sean June , Robert Joseph Therrien , Abhishek Yadav
CPC classification number: F25B21/04 , F25B21/02 , F25B2321/021 , F25B2321/0212 , F25B2321/023 , F25B2321/025 , F25B2700/2104 , Y02B30/66
Abstract: A two-phase heat exchanger includes a hot side heat sink, a cold side heat sink, and one or more thermoelectric modules disposed between the hot side heat sink and the cold sink heat sink such that hot sides of the one or more thermoelectric modules are thermally coupled to the hot side heat sink and cold sides of the one or more thermoelectric modules are thermally coupled to the cold side heat sink. The two-phase heat exchanger is configured to be mounted at an angle from vertical.
Abstract translation: 两相热交换器包括热侧散热器，冷侧散热器和设置在热侧散热器和冷却水槽散热器之间的一个或多个热电模块，使得一个或多个热电模块的热侧为 热耦合到热侧散热器并且一个或多个热电模块的冷侧热耦合到冷侧散热器。 两相热交换器被配置为以垂直方式成一角度安装。
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公开(公告)号：US20150354869A1
公开(公告)日：2015-12-10
申请号：US14734119
申请日：2015-06-09
Applicant: Phononic Devices, Inc.
Inventor： Jesse W. Edwards , Robert Joseph Therrien , Mattias K-O Olsson , Robert B. Allen , Abhishek Yadav , Paul Brian McCain , Ricardo E. Rodriguez , Justin W. English , Daniel Barus , Marshall Stanley
IPC: F25B30/02
CPC classification number: F24F5/0096 , F04D17/16 , F04D25/088 , F04D29/30 , F04D29/38 , F04D29/5826 , F04D29/584 , F24F5/001 , F24F5/0021 , F24F5/0042 , F24F7/007 , F24F2221/54 , F25B21/02 , F25B23/006 , F25B30/02 , F28D15/0208 , F28D15/0266 , F28D15/0275 , F28F13/125
Abstract: Embodiments of a hybrid fan and active heat pumping system are disclosed. In some embodiments, the hybrid fan and active heat pumping system comprises a fan assembly and an active heat pumping system comprises a heat pump. The active heat pumping system is integrated with the fan assembly and is operable to actively cool or heat air as the air passes through the fan assembly. In some embodiments, the heat pump comprised in the active heat pumping system is a solid-state heat pump, a vapor compression heat pump, or a Stirling Cycle heat pump.
Abstract translation: 公开了混合风扇和主动式热泵系统的实施例。 在一些实施例中，混合风扇和主动式热泵系统包括风扇组件和包括热泵的主动热泵系统。 主动热泵系统与风扇组件集成，并且可操作以在空气通过风扇组件时主动冷却或加热空气。 在一些实施例中，包括在主动式热泵系统中的热泵是固态热泵，蒸汽压缩热泵或斯特林循环热泵。
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公开(公告)号：US08991194B2
公开(公告)日：2015-03-31
申请号：US13867589
申请日：2013-04-22
Applicant: Phononic Devices, Inc.
Inventor： Jesse W. Edwards , M. Sean June , Robert Joseph Therrien , Abhishek Yadav
CPC classification number: F25B21/04 , F25B21/02 , F25B2321/021 , F25B2321/0212 , F25B2321/023 , F25B2321/025 , F25B2700/2104 , Y02B30/66
Abstract: Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s).
Abstract translation: 本公开的实施例涉及控制多个热电冷却器（TEC）以保持室的设定点温度。 在一个实施例中，控制器接收对应于室的温度的温度数据。 基于温度数据，控制器选择性地控制TEC的两个或多个子集以将腔室的温度保持在期望的设定点温度。 以这种方式，控制器能够控制TEC，使得TEC操作以有效地将室的温度保持在设定点温度。 在另一个实施例中，控制器基于温度数据和期望的性能轮廓来选择由控制器启用的一个或多个控制方案。 然后，控制器根据所选择的控制方案独立地控制TEC的一个或多个子集。
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14.发明授权公开(公告)号：US08893513B2
公开(公告)日：2014-11-25
申请号：US13888847
申请日：2013-05-07
Applicant: Phononic Devices, Inc.
Inventor： M. Sean June , Robert Joseph Therrien , Abhishek Yadav , Jesse W. Edwards
CPC classification number: F25B21/00 , F25B21/02 , H05K1/0204 , H05K1/182 , H05K2201/066 , H05K2201/10219 , Y10T29/49002
Abstract: A thermoelectric heat exchanger component includes a circuit board and multiple thermoelectric devices attached to the circuit board. Heights of at least two of the thermoelectric devices are different due to, for example, tolerances in a manufacturing process for the thermoelectric devices. The thermoelectric heat exchanger component also includes a first heat spreading lid over a first surface of the thermoelectric devices and a second heat spreading lid over a second surface of the thermoelectric devices. A thermal interface material is present between each one of the thermoelectric devices and the first and second heat spreading lids. The first heat spreading lid and the second heat spreading lid are oriented such that the thickness of the thermal interface material, and thus a thermal interface resistance, is optimized for the thermoelectric devices.
Abstract translation: 热电换热器部件包括电路板和附接到电路板的多个热电装置。 至少两个热电装置的高度由于例如热电装置的制造工艺中的公差而不同。 热电换热器部件还包括热电装置的第一表面上的第一散热盖和热电装置的第二表面上的第二散热盖。 在每个热电器件和第一和第二散热盖之间存在热界面材料。 第一散热盖和第二散热盖被定向成使得热界面材料的厚度以及因此的热界面电阻被优化用于热电装置。
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公开(公告)号：US20130291563A1
公开(公告)日：2013-11-07
申请号：US13888833
申请日：2013-05-07
Applicant: PHONONIC DEVICES, INC.
Inventor： Jesse W. Edwards , M. Sean June , Robert Joseph Therrien , Abhishek Yadav
IPC: F25B21/04
CPC classification number: F25B21/04 , F25B21/02 , F25B2321/021 , F25B2321/0212 , F25B2321/023 , F25B2321/025 , F25B2700/2104 , Y02B30/66
Abstract: Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s).
Abstract translation: 本公开的实施例涉及控制多个热电冷却器（TEC）以保持室的设定点温度。 在一个实施例中，控制器接收对应于室的温度的温度数据。 基于温度数据，控制器选择性地控制TEC的两个或多个子集以将腔室的温度保持在期望的设定点温度。 以这种方式，控制器能够控制TEC，使得TEC操作以有效地将室的温度保持在设定点温度。 在另一个实施例中，控制器基于温度数据和期望的性能轮廓来选择由控制器启用的一个或多个控制方案。 然后，控制器根据所选择的控制方案独立地控制TEC的一个或多个子集。
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Patent Agency Ranking
公开(公告)号：US20130291560A1
公开(公告)日：2013-11-07
申请号：US13867567
申请日：2013-04-22
Applicant: PHONONIC DEVICES, INC.
Inventor： Robert Joseph Therrien , M. Sean June , Jesse W. Edwards , James Barton Summers, III , Abhishek Yadav
IPC: F25B21/04
CPC classification number: F25B21/04 , F25B21/02 , F25B2321/021 , F25B2321/0212 , F25B2321/023 , F25B2321/025 , F25B2700/2104 , Y02B30/66
Abstract: Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s).
Abstract translation: 本公开的实施例涉及控制多个热电冷却器（TEC）以保持室的设定点温度。 在一个实施例中，控制器接收对应于室的温度的温度数据。 基于温度数据，控制器选择性地控制TEC的两个或多个子集以将腔室的温度保持在期望的设定点温度。 以这种方式，控制器能够控制TEC，使得TEC操作以有效地将室的温度保持在设定点温度。 在另一个实施例中，控制器基于温度数据和期望的性能轮廓来选择由控制器启用的一个或多个控制方案。 然后，控制器根据所选择的控制方案独立地控制TEC的一个或多个子集。
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17.发明申请公开(公告)号：US20130291559A1
公开(公告)日：2013-11-07
申请号：US13888847
申请日：2013-05-07
Applicant: PHONONIC DEVICES, INC.
Inventor： M. Sean June , Robert Joseph Therrien , Abhishek Yadav , Jesse W. Edwards
IPC: F25B21/00
CPC classification number: F25B21/00 , F25B21/02 , H05K1/0204 , H05K1/182 , H05K2201/066 , H05K2201/10219 , Y10T29/49002
Abstract: Embodiments of a thermoelectric heat exchanger component having a heat spreading lid that optimizes thermal interface resistance between the heat spreading lid and multiple thermoelectric devices and methods of fabrication thereof are disclosed. In one embodiment, a thermoelectric heat exchanger component includes a circuit board and multiple thermoelectric devices attached to the circuit board. Heights of at least two of the thermoelectric devices are different due to, for example, tolerances in a manufacturing process for the thermoelectric devices. The thermoelectric heat exchanger component also includes a heat spreading lid over the thermoelectric devices and a thermal interface material between the thermoelectric devices and the heat spreading lid. An orientation (i.e., a tilt) of the heat spreading lid is such that a thickness of the thermal interface material, and thus a thermal interface resistance, is optimized for the thermoelectric devices.
Abstract translation: 公开了一种具有散热盖的散热盖的优化热传导盖和多个热电元件之间的热界面电阻的热电换热器部件的实施例及其制造方法。 在一个实施例中，热电换热器部件包括电路板和附接到电路板的多个热电装置。 至少两个热电装置的高度由于例如热电装置的制造工艺中的公差而不同。 热电换热器部件还包括热电装置上的散热盖和热电装置与散热盖之间的热界面材料。 散热盖的取向（即，倾斜）使得热界面材料的厚度以及因此的热界面电阻被优化用于热电装置。
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公开(公告)号：US20170363307A1
公开(公告)日：2017-12-21
申请号：US15628066
申请日：2017-06-20
Applicant: Phononic Devices, Inc.
Inventor： Jesse W. Edwards , Devon Newman , Erik P. Miller
CPC classification number: F24F5/0042 , F24F1/0022 , F24F1/0059 , F24F12/003 , F24F2203/104 , F25B21/02 , Y02B30/52 , Y02B30/563
Abstract: A micro-climate control system includes a thermoelectric system integrated with a fan assembly. The thermoelectric system is operable to actively cool or heat air as the air passes through the fan assembly. The thermoelectric system includes a thermoelectric heat pump, a heat reject subsystem, and a heat accept subsystem. The fan assembly is operable to draw air from a space to be conditioned and output conditioned air passed through one of the heat reject subsystem and the heat accept subsystem to the space to be conditioned and output air passed through the other away from the space to be conditioned. In this way, the micro-climate control system may provide localized comfort, while allowing a larger climate control system to maintain a more efficient temperature set point. In this way, the overall energy consumption may be reduced while providing the same level of effective comfort.
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19.发明授权High-efficiency power conversion architecture for driving a thermoelectric cooler in energy conscious applications 有权高能效转换架构，用于在能源意识应用中驱动热电冷却器公开(公告)号：US09581362B2
公开(公告)日：2017-02-28
申请号：US14733270
申请日：2015-06-08
Applicant: Phononic Devices, Inc.
Inventor： Marshall Stanley , Daniel Barus , Ricardo E. Rodriguez , Jesse W. Edwards , Robert Joseph Therrien
CPC classification number: F25B21/02 , G05D23/1919 , H01L35/28 , H02M7/23 , H02M2001/0048 , Y02B70/1491
Abstract: Systems and methods are disclosed herein relating to an Alternating Current-Direct Current (AC-DC) power conversion system for supplying power to one or more Thermoelectric Coolers (TECs). In some embodiments, a system comprises one or more TECs and an AC-DC power conversion system configured to supply power to the one or more TECs for a high efficiency mode of operation and a high heat pumping mode of operation. The AC-DC power conversion system comprises a first AC-DC power converter configured to convert an AC input to a DC output at a first output power level for the high efficiency mode of operation of the one or more TECs. The AC-DC power conversion system further comprises a second AC-DC power converter configured to convert the AC input to a DC output at a second output power level for the high heat pumping mode of operation of the one or more TECs.
Abstract translation: 本文公开了与向一个或多个热电冷却器（TEC）供电的交流 - 直流（AC-DC）功率转换系统相关的系统和方法。 在一些实施例中，系统包括一个或多个TEC和AC-DC电力转换系统，其被配置为向一个或多个TEC供电用于高效率运行模式和高热泵运行模式。 AC-DC电力转换系统包括第一AC-DC电力转换器，其被配置为为一个或多个TEC的高效率操作模式以一第一输出功率电平将AC输入转换为DC输出。 AC-DC电力转换系统还包括第二AC-DC电力转换器，其被配置为将AC输入转换成用于一个或多个TEC的高热泵运行模式的第二输出功率电平的DC输出。
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20.发明授权公开(公告)号：US09341394B2
公开(公告)日：2016-05-17
申请号：US13888799
申请日：2013-05-07
Applicant: Phononic Devices, Inc.
Inventor： Jesse W. Edwards , M. Sean June , Robert Joseph Therrien , Abhishek Yadav
CPC classification number: F25B21/04 , F25B21/02 , F25B2321/021 , F25B2321/0212 , F25B2321/023 , F25B2321/025 , F25B2700/2104 , Y02B30/66
Abstract: A thermoelectric refrigeration system including at least one cooling chamber and a thermoelectric heat exchange system. The thermoelectric heat exchange system includes cascaded heat sinks. The cascaded heat sinks include cascaded cold side heat sinks and a hot side heat sink. The cascaded cold side heat sinks include a first cold side heat sink and a second cold side heat sink. The thermoelectric heat exchange system also includes a first plurality of thermoelectric coolers disposed between the first cold side heat sink and the second cold side heat sink and a second plurality of thermoelectric coolers disposed between the second cold side heat sink and the hot side heat sink. Each thermoelectric cooler is a module including multiple thermoelectric devices.
Abstract translation: 一种包括至少一个冷却室和热电热交换系统的热电制冷系统。 热电换热系统包括级联散热器。 级联散热器包括级联的冷侧散热器和热侧散热器。 级联的冷侧散热器包括第一冷侧散热器和第二冷侧散热器。 热电热交换系统还包括设置在第一冷侧散热器和第二冷侧散热器之间的第一多个热电冷却器和设置在第二冷侧散热器和热侧散热器之间的第二多个热电冷却器。 每个热电冷却器是包括多个热电装置的模块。
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