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    Guide plate for probe card and probe card having same
    12.
    发明授权
    Guide plate for probe card and probe card having same 有权

    公开(公告)号：US11193955B2

    公开(公告)日：2021-12-07

    申请号：US16794147

    申请日：2020-02-18

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: G01R1/073

    Abstract: The present invention provides a guide plate for a probe card. The guide plate for the probe card according to the present invention includes: a first guide plate including a plurality of first pin insertion holes formed therein, and made of an anodic oxide film; and a second guide plate disposed to be spaced apart from the first guide plate by a predetermined distance, and including a plurality of second pin insertion holes through which probe pins passing through the first pin insertion holes pass, wherein a buffer part is provided at least partially on each of an upper portion and a lower portion of the first guide plate.

    Micro LED transfer head
    13.
    发明授权
    Micro LED transfer head 有权

    公开(公告)号：US11145788B2

    公开(公告)日：2021-10-12

    申请号：US16734175

    申请日：2020-01-03

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: H01L33/00 ,  H01L33/64 ,  H01L25/075

    Abstract: The present invention relates generally to a micro LED transfer head transferring a micro light-emitting diode (micro LED) from a first substrate to a second substrate. More particularly, the present invention relates to a micro LED transfer head holding and transferring a micro LED in which holding portions and surrounding areas of the holding portions are configured of different materials.

    Micro sensor
    14.
    发明授权
    Micro sensor 有权

    公开(公告)号：US10539526B2

    公开(公告)日：2020-01-21

    申请号：US15674463

    申请日：2017-08-10

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: G01N27/12

    Abstract: Disclosed is a micro sensor. Particularly, disclosed is a micro sensor capable of changing a resistance value of a resistance unit connected to a sensor electrode depending on a sensing material, the resistance unit having at least two resistors.

    Micro Heater and Micro Sensor
    17.
    发明申请
    Micro Heater and Micro Sensor 审中-公开
    微加热器和微型传感器

    公开(公告)号：US20160370336A1

    公开(公告)日：2016-12-22

    申请号：US15181976

    申请日：2016-06-14

    Applicant: Point Engineering Co., Ltd.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: G01N33/00 ,  H05B3/03 ,  H05B3/24 ,  H05B1/02

    CPC classification number: G01N33/0027 ,  G01N27/121 ,  G01N27/128 ,  H05B1/0247 ,  H05B3/03 ,  H05B3/24

    Abstract: A micro heater includes a substrate and a heater electrode formed on the substrate. The substrate includes a plurality of pores formed to vertically extend through the substrate. A micro sensor includes a substrate, a sensor electrode formed on the substrate, and a heater electrode formed on the substrate. A protective layer may be used to protect any of the electrodes against oxidation. Any of the electrodes may be formed on a barrier layer positioned on the porous layer.

    Abstract translation: 微加热器包括形成在基板上的基板和加热电极。 衬底包括形成为垂直延伸穿过衬底的多个孔。 微型传感器包括基板，形成在基板上的传感器电极和形成在基板上的加热电极。 可以使用保护层来保护任何电极免受氧化。 任何电极可以形成在位于多孔层上的阻挡层上。

    Chip Substrate Comprising Cavity with Curved Surfaces
    18.
    发明申请
    Chip Substrate Comprising Cavity with Curved Surfaces 有权
    包括具有弯曲表面的腔的芯片衬底

    公开(公告)号：US20160095222A1

    公开(公告)日：2016-03-31

    申请号：US14866073

    申请日：2015-09-25

    Applicant: Point Engineering Co., Ltd.

    Inventor： Seung Ho Park ,  Tae Hwan Song ,  Sung Hyun Byun

    IPC: H05K1/18 ,  H05K1/02

    CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/60 ,  H05K1/05 ,  H05K1/185 ,  H05K2201/09745 ,  H05K2201/10106

    Abstract: A chip substrate includes conductive portions, an insulation portion and a cavity. The conductive portions are laminated in one direction to constitute the chip substrate. The insulation portion is interposed between the conductive portions to electrically isolate the conductive portions. The cavity is formed on an upper surface of the chip substrate at a predetermined depth in a region including the insulation portion. The cavity is defined by a plurality of continuously-extending curved surfaces having predetermined radii of curvature.

    Abstract translation: 芯片基板包括导电部分，绝缘部分和空腔。 导电部分沿一个方向层叠以构成芯片基板。 绝缘部分介于导电部分之间，以使导电部分电隔离。 在包括绝缘部分的区域中，在芯片基板的上表面上以预定的深度形成空腔。 空腔由具有预定曲率半径的多个连续延伸的弯曲表面限定。

    Probe head and probe card having same
    19.
    发明授权
    Probe head and probe card having same 有权

    公开(公告)号：US12222370B2

    公开(公告)日：2025-02-11

    申请号：US17919739

    申请日：2021-04-20

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: G01R1/073 ,  G01R1/067

    Abstract: A probe head and a probe card having the same are provided. The probe head includes a plurality of guide plates each having a guide hole, wherein each of the guide plates has a shape in which a plurality of layers are stacked, and each of the guide plates includes: a first guide layer provided at a lowermost side thereof, and having a first guide hole; and a second guide layer provided at an uppermost side thereof, and having a second guide hole, wherein a side wall of the first guide hole and a side wall of the second guide hole are not provided on the same vertical line.

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