Abstract:
The invention refers to an electronic system, comprising several power-dissipating components, and a circuit board, wherein said power-dissipating components are mounted both to a top side and a bottom side of said circuit board. Further, the invention refers to method for mounting power-dissipating components onto a circuit board, comprising the steps of (a) determining the thermal behavior of said power-dissipating components; and (b) determining, in accordance thereto, the placement of said power-dissipating components on both a top side and a bottom side of said circuit board.
Abstract:
A differential output amplifier arrangement (DOA) including two operational amplifiers (OA1,OA2), each having a feedback resistor (R2,R20), and which are coupled by a first resistor (R1) between similar polarity type input terminals, further includes a pair of output resistors (R3,R30), coupled between respective output terminals (OUT1,OUT2), of each respective operational amplifier, and corresponding respective output terminals (ZOUT1,ZOUT2) of said arrangement, and a pair of resistors (R4,R40), each of which is cross-coupled between a respective output terminal of said arrangement (ZOUT1,ZOUT2) and one of the two similar polarity type, by the first resistor coupled, input terminals (INN2,INN1) of the respective cross-coupled operational amplifier. A method for adapting the output impedance of a differential output amplifier arrangement is described as well.