公开(公告)号：US11688554B2

公开(公告)日：2023-06-27

申请号：US17188084

申请日：2021-03-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Ho Hong ,  Hyun Sub Oh ,  Youn Soo Kim ,  Hong Kyu Shin ,  Hee Sung Choi

IPC: H01G2/02 ,  H01G2/10 ,  H01G9/048 ,  H01G9/012 ,  H01G9/08 ,  H01G9/15 ,  H01G9/04

CPC classification number: H01G2/02 ,  H01G2/10 ,  H01G9/012 ,  H01G9/048 ,  H01G9/08 ,  H01G9/15 ,  H01G2009/05

Abstract: A tantalum capacitor includes: first and second surfaces facing in a first direction, third and fourth surfaces facing in a second direction, and fifth and sixth surfaces facing in a third direction; a tantalum body having one surface through which a tantalum wire is exposed in the first direction; and a substrate on which the tantalum body is mounted, wherein the substrate may be an organic-inorganic composite substrate.

公开(公告)号：US09288902B2

公开(公告)日：2016-03-15

申请号：US14097049

申请日：2013-12-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Eun Sil Kim ,  Sung Han Kim ,  Sa Yong Lee ,  Jin Ho Hong ,  Yong Il Kwon ,  Sang Hyun Shin ,  Keun Yong Lee

IPC: H05K1/00 ,  H05K1/03 ,  G03F7/40 ,  H05K3/10 ,  H05K3/12 ,  H05K1/02 ,  H05K3/40 ,  H05K3/42

CPC classification number: H05K1/0306 ,  G03F7/40 ,  H05K1/0274 ,  H05K1/0393 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/4061 ,  H05K3/426 ,  H05K2201/0376

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same.The printed circuit board includes a light-blocking glass substrate; a negative photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and embedded in the negative photosensitive insulating layer.

Abstract translation: 这里公开了一种印刷电路板及其制造方法。 印刷电路板包括遮光玻璃基板; 形成在所述玻璃基板上的负光敏绝缘层; 以及形成在玻璃基板上并嵌入负光敏绝缘层中的电路图案。

公开(公告)号：US20150097647A1

公开(公告)日：2015-04-09

申请号：US14502578

申请日：2014-09-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sa Yong Lee ,  Yong Il Kwon ,  Jin Ho Hong ,  Sung Han Kim ,  Keun Yong Lee

IPC: H01F27/32 ,  H01F27/29

CPC classification number: H01F17/0013 ,  H01L2224/48091 ,  H01L2924/00014 ,  Y10T428/31612 ,  H01L2224/45099

Abstract: A chip component includes a magnetic substrate having ferrite layers, and an insulating layer disposed on the magnetic substrate and having an electrode disposed therein. An external electrode is connected to the electrode on the insulating layer. The magnetic substrate and the insulating layer have a chemical coupling structure formed on an interface therebetween. The chemical coupling structure includes Si—O—C or Si—O—N.

Abstract translation: 芯片部件包括具有铁氧体层的磁性基板和设置在磁性基板上并具有设置在其中的电极的绝缘层。 外部电极连接到绝缘层上的电极。 磁性基板和绝缘层在它们之间的界面上形成有化学耦合结构。 化学偶联结构包括Si-O-C或Si-O-N。

公开(公告)号：US20140154479A1

公开(公告)日：2014-06-05

申请号：US13845032

申请日：2013-03-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Geum Hee Yun ,  Jin Ho Hong ,  Sa Yong Lee ,  Jin Young Kim ,  Keun Yong Lee

IPC: H05K1/03 ,  H01B3/40

CPC classification number: H05K1/0373 ,  H01B3/40 ,  H05K2201/0141 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/24802

Abstract: Disclosed herein is a resin composition for a printed circuit board, including: a liquid crystalline oligomer; an epoxy resin; and an inorganic filler which is a reaction product of silica, silane having a vinyl group and an alkoxy group, and vinyl or hydroxyl terminated silicone oil. The resin composition has a low thermal expansion coefficient, excellent heat resistance and a high glass transition temperature.

Abstract translation: 本发明公开了一种用于印刷电路板的树脂组合物，包括：液晶低聚物; 环氧树脂; 和作为二氧化硅，具有乙烯基和烷氧基的硅烷和乙烯基或羟基封端的硅油的反应产物的无机填料。 树脂组合物的热膨胀系数低，耐热性优异，玻璃化转变温度高。