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公开(公告)号：US20230215652A1
公开(公告)日：2023-07-06
申请号：US17877507
申请日：2022-07-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Cheol Woo Park , Jin Hyung Lim , Seung Hun Han , Ji Hong Jo
CPC classification number: H01G4/30 , H01G4/008 , H01G4/012 , H01G4/232 , H01G4/1227
Abstract: A multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface; a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface; an insulating layer disposed on the first and second connection portions and covering the second surface, and third and fourth band portions; and first and second plating layers respectively disposed on the first and second band portions. The insulating layer includes an oxide containing Ti. The dielectric layer includes one of BaTiO3, (Ba1-xCax) TiO3 (0
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公开(公告)号：US12148572B2
公开(公告)日：2024-11-19
申请号：US17960927
申请日：2022-10-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Hun Han , Jae Young Na , Sung Soo Kim , Jin Hyung Lim , Yun Sung Kang , Ji Hong Jo
Abstract: A multilayer electronic component includes a body having a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween. The body has a hexahedral shape. A first external electrode includes a first connection portion disposed on a third surface, and first and third band portions extending from the first connection portion respectively onto a portion of a first and a second surface. A second external electrode includes a second connection portion disposed on a fourth surface, and second and fourth band portions extending from the second connection portion respectively onto a portion of the first and second surfaces. An insulating layer including an oxide containing hafnium is disposed on the first and second connection portions and covers the second surface and the third and fourth band portions. First and second plating layers are disposed respectively on the first and second band portions.
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公开(公告)号：US11476826B2
公开(公告)日：2022-10-18
申请号：US15812842
申请日：2017-11-14
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Won Han , Dae Ho Kim , Yong Suk Kim , Seung Hun Han , Moon Chul Lee , Chang Hyun Lim , Sung Jun Lee , Sang Kee Yoon , Tae Yoon Kim , Sang Uk Son
Abstract: A bulk acoustic wave resonator includes: a substrate; a membrane layer forming a cavity together with the substrate; a lower electrode disposed on the membrane layer; a piezoelectric layer disposed on a flat surface of the lower electrode; and an upper electrode covering a portion of the piezoelectric layer and exposing a side of the piezoelectric layer to air, wherein the piezoelectric layer includes a step portion extended from the side of the piezoelectric layer and disposed on the flat surface of the lower electrode.
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公开(公告)号：US20220208457A1
公开(公告)日：2022-06-30
申请号：US17412731
申请日：2021-08-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kyo Yeol Lee , Seung Hun Han , Sang Wook Lee , Jung Min Kim , Jeong Ryeol Kim
Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer, an average thickness of the protective layer is 70 nm or more and/or less than 400 nm, and a ratio of an average thickness of the coating layer to the average thickness of the protective layer is 0.25 or more and/or 0.75 or less.
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公开(公告)号：US10903011B2
公开(公告)日：2021-01-26
申请号：US16050480
申请日：2018-07-31
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Hun Han , Sung Min Cho , Dong Joon Oh
IPC: H01G4/008 , H01G4/30 , H01G4/232 , H01G4/248 , C23C16/455
Abstract: A multilayer electronic component includes: a capacitor body including first and second internal electrodes disposed to be alternately exposed through opposite surfaces, respectively, with respective dielectric layers interposed therebetween; first and second thin film layers including at least one of titanium nitride (TiN), ruthenium (Ru), platinum (Pt), iridium (Ir), or titanium (Ti), disposed on the surfaces of the capacitor body, and connected to the first and second internal electrodes, respectively; and first and second external electrodes formed on the first and second thin film layers. A thickness of the first or second thin film layer is less than or equal to 60 nm.
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Patent Agency Ranking
公开(公告)号：US10770232B2
公开(公告)日：2020-09-08
申请号：US16044898
申请日：2018-07-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Hun Han , Sung Min Cho , Dong Joon Oh
Abstract: A multilayer electronic component for enhancing damp proof reliability includes: a capacitor body including a plurality of dielectric layers, and first and second internal electrodes, alternately disposed across the dielectric layers to expose one end of the first and second electrodes through third and fourth surfaces of the capacitor body; first and second conductive layers disposed on the third and fourth surfaces of the capacitor body and connected to the first and second internal electrodes, respectively; first and second plating layers covering surfaces of the first and second conductive layers; and a plurality of coating layers configured in a multilayer structure on a surface of the capacitor body to expose the first and second plating layers and having an entire thickness of 10 nm to 200 nm.
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公开(公告)号：US12266476B2
公开(公告)日：2025-04-01
申请号：US17412731
申请日：2021-08-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kyo Yeol Lee , Seung Hun Han , Sang Wook Lee , Jung Min Kim , Jeong Ryeol Kim
Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer, an average thickness of the protective layer is 70 nm or more and/or less than 400 nm, and a ratio of an average thickness of the coating layer to the average thickness of the protective layer is 0.25 or more and/or 0.75 or less.
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公开(公告)号：US20230215641A1
公开(公告)日：2023-07-06
申请号：US17960927
申请日：2022-10-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Hun Han , Jae Young Na , Sung Soo Kim , Jin Hyung Lim , Yun Sung Kang , Ji Hong Jo
CPC classification number: H01G4/2325 , H01G4/30
Abstract: A multilayer electronic component includes a body having a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween. The body has a hexahedral shape. A first external electrode includes a first connection portion disposed on a third surface, and first and third band portions extending from the first connection portion respectively onto a portion of a first and a second surface. A second external electrode includes a second connection portion disposed on a fourth surface, and second and fourth band portions extending from the second connection portion respectively onto a portion of the first and second surfaces. An insulating layer including an oxide containing hafnium is disposed on the first and second connection portions and covers the second surface and the third and fourth band portions. First and second plating layers are disposed respectively on the first and second band portions.
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公开(公告)号：US11594374B2
公开(公告)日：2023-02-28
申请号：US17338370
申请日：2021-06-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kyo Yeol Lee , Seung Hun Han , Sang Wook Lee , Jung Min Kim , Jeong Ryeol Kim
Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer.
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公开(公告)号：US10903814B2
公开(公告)日：2021-01-26
申请号：US15789024
申请日：2017-10-20
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Won Han , Chang Hyun Lim , Yong Suk Kim , Seung Hun Han , Sung Jun Lee , Sang Kee Yoon , Tae Yoon Kim
IPC: H03H9/02 , H03H9/17 , H01L41/047 , H03H9/54
Abstract: A bulk acoustic wave resonator includes a membrane layer, together with a substrate, forming a cavity, a lower electrode disposed on the membrane layer, a piezoelectric layer disposed on a flat surface of the lower electrode and an upper electrode covering a portion of the piezoelectric layer. An overall region at a side of the piezoelectric layer is exposed to the air. The side of the piezoelectric layer has a gradient of 65° to 90° with respect to a top surface of the lower electrode.
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