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公开(公告)号：US12185055B2
公开(公告)日：2024-12-31
申请号：US18045887
申请日：2022-10-12
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： Guofeng Chen , Rakesh Kumar , You Qian , Michael Jon Wurtz , Humberto Campanella-Pineda
Abstract: An electronic device package comprises an electronic acoustic device including a primary microphone having a frequency response having a resonance frequency, and a reference microphone having a frequency response including a resonance frequency. The primary microphone and the reference microphone are configured to substantially simultaneously receive a common acoustic signal to produce a transduced signal of the primary microphone and a transduced signal of the reference microphone, the resonance frequency of the reference microphone being different than the resonance frequency of the primary microphone. An equalization module is configured to equalize the frequency response of the microphone based on the transduced signal of the microphone and the transduced signal of the reference microphone. The package defines a first back cavity of the primary microphone and a second back cavity of the reference microphone, the second back cavity being acoustically isolated from the first back cavity.
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公开(公告)号：US20240364298A1
公开(公告)日：2024-10-31
申请号：US18636056
申请日：2024-04-15
Applicant: Skyworks Solutions, Inc.
Inventor： Humberto Campanella-Pineda , Guofeng Chen , You Qian , Rakesh Kumar
CPC classification number: H03H9/02102 , H03H9/02015 , H03H9/02157 , H03H9/568
Abstract: A bulk acoustic wave device that is configured to excite an overtone mode as a main mode is disclosed. The bulk acoustic wave device can include a first electrode, a piezoelectric layer, a second electrode, and at least one temperature compensation layer. The piezoelectric layer is positioned over the first electrode. The second electrode is positioned such that the piezoelectric layer is located between the first and second electrodes. The at least one temperature compensation layer is configured to provide temperature compensation for the bulk acoustic wave device. The at least one temperature compensation layer has a thickness that is a multiple of one thirty-second of a wavelength of an acoustic wave propagating through the at least one temperature compensation layer. The bulk acoustic wave device is configured to excite the overtone mode as the main mode.
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公开(公告)号：US20230135200A1
公开(公告)日：2023-05-04
申请号：US18050920
申请日：2022-10-28
Applicant: Skyworks Solutions, Inc.
Inventor： You Qian , Rakesh Kumar , Guofeng Chen
IPC: H04R17/02
Abstract: A cantilever sensor (e.g., piezoelectric sensor) includes a beam with a sensor or electrode at a proximal end and a tip that extends from the sensor to the distal (unsupported) end of the beam. The tip is modified to modify (e.g., tune) the resonant frequency of the cantilever sensor. The resonant frequency of the cantilever sensor is tuned by using a material for the tip with a stiffness (e.g., a Young's Modulus) and/or a mass or density that results in the desired resonant frequency. The resonant frequency of the cantilever sensor can also be tuned by modifying the shape of the tip to have a higher vertical structure in a Z direction transverse to a length of the beam of the sensor.
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公开(公告)号：US20230081056A1
公开(公告)日：2023-03-16
申请号：US17943816
申请日：2022-09-13
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： You Qian , Rakesh Kumar , Guofeng Chen
Abstract: A piezoelectric microelectromechanical systems (MEMS) microphone is provided comprising a substrate including walls defining a cavity and at least two of the walls defining a respective anchor region each, a piezoelectric film layer defining at least two beams, each respective beam supported by the substrate at each anchor region, the beams being free along a portion of their respective lengths and also connected at a connecting region away from the respective anchor regions; and an electrode disposed over the piezoelectric film layer. A method of manufacturing such a MEMS microphone is also provided.
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公开(公告)号：US20230011561A1
公开(公告)日：2023-01-12
申请号：US17810870
申请日：2022-07-06
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： You Qian , Humberto Campanella-Pineda , Guofeng Chen , Rakesh Kumar
Abstract: A piezoelectric microelectromechanical systems (MEMS) microphone is provided comprising a substrate including walls defining a cavity and at least one of the walls defining an anchor region, a piezoelectric film layer supported by the substrate at the anchor region; an electrode disposed over the piezoelectric film layer and adjacent the anchor region and including an edge adjacent the anchor region having two straight portions and a protruding portion between the two straight portions, and the wall of the cavity that defines the anchor region including an indent corresponding in shape to the protruding portion of the electrode. A method of manufacturing such a MEMS microphone is also provided.
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Patent Agency Ranking
公开(公告)号：US20240364297A1
公开(公告)日：2024-10-31
申请号：US18635933
申请日：2024-04-15
Applicant: Skyworks Solutions, Inc.
Inventor： Humberto Campanella-Pineda , Guofeng Chen , You Qian , Rakesh Kumar
CPC classification number: H03H9/02102 , H03H9/173 , H03H9/176
Abstract: A bulk acoustic wave device that is configured to excite an overtone mode as a main mode is disclosed. The bulk acoustic wave device can include a first electrode, a second electrode, a piezoelectric layer disposed between the first and second electrodes, and a temperature compensation layer between the first and second electrodes. A total thickness of the piezoelectric layer and the temperature compensation layer is sufficiently thick to excite the overtone mode as the main mode. Related filters, multiplexers, radio frequency modules, wireless communications devices, and methods are also disclosed.
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公开(公告)号：US20230269524A1
公开(公告)日：2023-08-24
申请号：US18045887
申请日：2022-10-12
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： Guofeng Chen , Rakesh Kumar , You Qian , Michael John Wurtz , Humberto Campanella-Pineda
Abstract: An electronic device package comprises an electronic acoustic device including a primary microphone having a frequency response having a resonance frequency, and a reference microphone having a frequency response including a resonance frequency. The primary microphone and the reference microphone are configured to substantially simultaneously receive a common acoustic signal to produce a transduced signal of the primary microphone and a transduced signal of the reference microphone, the resonance frequency of the reference microphone being different than the resonance frequency of the primary microphone. An equalization module is configured to equalize the frequency response of the microphone based on the transduced signal of the microphone and the transduced signal of the reference microphone. The package defines a first back cavity of the primary microphone and a second back cavity of the reference microphone, the second back cavity being acoustically isolated from the first back cavity.
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公开(公告)号：US20230092374A1
公开(公告)日：2023-03-23
申请号：US17948101
申请日：2022-09-19
Applicant: Skyworks Solutions, Inc.
Inventor： You Qian , Rakesh Kumar , Guofeng Chen
IPC: H04R17/02 , H01L41/29 , H01L41/316 , H01L41/332 , H04R31/00
Abstract: A method for making a piezoelectric microelectromechanical systems (MEMS) microphone is provided, comprising depositing a piezoelectric film layer onto a substrate; selectively etching the piezoelectric film layer to define lines; removing the substrate to define a cavity; and breaking the piezoelectric film layer along the lines, such that the microphone has at least two cantilevered beams. The piezoelectric microelectromechanical systems (MEMS) microphone is also provided.
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公开(公告)号：US20230012046A1
公开(公告)日：2023-01-12
申请号：US17810871
申请日：2022-07-06
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： You Qian , Rakesh Kumar , Guofeng Chen
Abstract: A piezoelectric microelectromechanical systems (MEMS) microphone is provided comprising a substrate including walls defining a cavity and at least one of the walls defining an anchor region, a piezoelectric film layer supported by the substrate at the anchor region such that the piezoelectric film layer is cantilevered, the piezoelectric film layer being formed to introduce differential stress between a front surface of the piezoelectric film layer oriented away from the cavity and a back surface of the piezoelectric film layer oriented towards the cavity such that the piezoelectric film layer is bent into the cavity, and an electrode disposed over the piezoelectric film layer and adjacent the anchor region. A method of manufacturing such a MEMS microphone is also provided.
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公开(公告)号：US20230007405A1
公开(公告)日：2023-01-05
申请号：US17810359
申请日：2022-07-01
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： You Qian , Rakesh Kumar , Guofeng Chen
IPC: H04R17/02
Abstract: A piezoelectric microelectromechanical system microphone comprises a frame, a film of piezoelectric material including slits defining a plurality of independently displaceable piezoelectric elements within an area defined by a perimeter of the frame, bases of the plurality of piezoelectric elements mechanically secured to the frame, tips of the plurality of piezoelectric elements being free to be displaced in a direction perpendicular to a plane defined by the frame responsive to impingement of sound waves on the plurality of piezoelectric elements, and edge extensions extending from edges of the plurality of piezoelectric elements in the direction perpendicular to the plane defined by the frame to reduce a 3 dB roll-off frequency of the piezoelectric microelectromechanical system microphone.
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