-
公开(公告)号：US12219333B2
公开(公告)日：2025-02-04
申请号：US17664023
申请日：2022-05-18
Applicant: Skyworks Solutions, Inc.
Inventor： Guofeng Chen , Michael Jon Wurtz , Rakesh Kumar , You Qian , Humberto Campanella-Pineda
Abstract: A method of making an acoustic sensor (e.g., a piezoelectric sensor for a piezoelectric microelectromechanical systems microphone) includes forming or depositing one or more piezoelectric layers to define a beam extending between a proximal portion and a distal tip (e.g., unsupported free end), the beam having a width in plan view that is greater at a location distal of the proximal portion than at the proximal portion. The method also comprises attaching the beam to a substrate in cantilever form so that the proximal portion of the beam is anchored to the substrate and the distal tip is a free unsupported end of the beam. One or more electrodes are disposed on or in the proximal portion of the beam.
-
公开(公告)号：US20230121053A1
公开(公告)日：2023-04-20
申请号：US18045885
申请日：2022-10-12
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： Humberto Campanella-Pineda , Michael Jon Wurtz , Rakesh Kumar , You Qian , Guofeng Chen
Abstract: Electronic acoustic devices and methods of operating the same include a microphone having a frequency response including a resonance frequency, a reference microphone having a frequency response including a resonance frequency, the microphone and the reference microphone configured to substantially simultaneously receive a common acoustic signal to produce a transduced signal of the microphone and a transduced signal of the reference microphone, the resonance frequency of the reference microphone being different than the resonance frequency of the microphone, and an equalization module configured to equalize the frequency response of the microphone based on the transduced signal of the microphone and the transduced signal of the reference microphone.
-
公开(公告)号：US20220272459A1
公开(公告)日：2022-08-25
申请号：US17674203
申请日：2022-02-17
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： Guofeng Chen , You Qian , Rakesh Kumar , Michael Jon Wurtz , Humberto Campanella-Pineda
IPC: H04R17/02 , H01L41/083 , H04R7/18 , H04R7/08
Abstract: A piezoelectric microelectromechanical system microphone comprises a piezoelectric element configured to deform and generate an electrical potential responsive to impingement of sound waves on the piezoelectric element, a sensing electrode disposed on the piezoelectric element and configured to sense the electrical potential, and a dummy electrode electrically unconnected to the sensing electrode and disposed on a portion of the piezoelectric element that is free of the sensing electrode, the dummy electrode configured to reduce static deformation of the piezoelectric element caused by residual stresses in the piezoelectric element.
-
公开(公告)号：US12101601B2
公开(公告)日：2024-09-24
申请号：US17929071
申请日：2022-09-01
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： Guofeng Chen , You Qian , Rakesh Kumar , Michael Jon Wurtz , Humberto Campanella-Pineda
IPC: H04R17/02
CPC classification number: H04R17/02 , H04R2201/003
Abstract: A microelectromechanical system microphone includes a piezoelectric diaphragm, upper inner electrodes and upper outer electrodes disposed on an upper surface of the diaphragm, and lower inner electrodes and lower outer electrodes disposed on a lower surface of the diaphragm. The diaphragm is divided into a plurality of sectors, a first of the sectors including an inner and an outer upper electrode physically disconnected from an inner and an outer upper electrode on a second sector adjacent to the first sector, and an inner and an outer lower electrode physically disconnected from an inner and an outer lower electrode on the second sector. A first via extends between and electrically couples the upper and lower inner electrodes of the first sector and a first bond pad. A second via extends between and electrically couples the upper and lower outer electrodes of the second sector and a second bond pad.
-
公开(公告)号：US11979712B2
公开(公告)日：2024-05-07
申请号：US17810359
申请日：2022-07-01
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： You Qian , Rakesh Kumar , Guofeng Chen
IPC: H04R17/02
CPC classification number: H04R17/02 , H04R2201/003
Abstract: A piezoelectric microelectromechanical system microphone comprises a frame, a film of piezoelectric material including slits defining a plurality of independently displaceable piezoelectric elements within an area defined by a perimeter of the frame, bases of the plurality of piezoelectric elements mechanically secured to the frame, tips of the plurality of piezoelectric elements being free to be displaced in a direction perpendicular to a plane defined by the frame responsive to impingement of sound waves on the plurality of piezoelectric elements, and edge extensions extending from edges of the plurality of piezoelectric elements in the direction perpendicular to the plane defined by the frame to reduce a 3 dB roll-off frequency of the piezoelectric microelectromechanical system microphone.
-
Patent Agency Ranking
6.发明公开公开(公告)号：US20230328426A1
公开(公告)日：2023-10-12
申请号：US18045888
申请日：2022-10-12
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： Humberto Campanella-Pineda , Michael Jon Wurtz , You Qian , Guofeng Chen , Rakesh Kumar
CPC classification number: H04R1/245 , G01H3/12 , H04R1/04 , H04R19/04 , H04R31/006 , H04R2201/003
Abstract: An electronic device package comprises a primary microphone having a frequency response having a first resonance frequency, and a reference microphone having a frequency response including a second resonance frequency, the primary microphone and the reference microphone configured to substantially simultaneously receive a same acoustic signal to produce a transduced signal of the primary microphone and a transduced signal of the reference microphone, the second resonance frequency of the reference microphone being different than the first resonance frequency of the primary microphone, the package having dimensions that cause the primary microphone and reference microphone to be acoustically isolated from one another at the resonance frequency of the primary microphone, there being less than 3 dB of acoustic coupling between the primary microphone and reference microphone at the first resonance frequency.
-
公开(公告)号：US20230269525A1
公开(公告)日：2023-08-24
申请号：US18170598
申请日：2023-02-17
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： Guofeng Chen , Michael Jon Wurtz , Rakesh Kumar , You Qian , Humberto Campanella-Pineda
CPC classification number: H04R1/2807 , H04R1/04 , H04R1/222 , H04R3/00 , H04R17/02 , H04R2201/003 , H04R2499/11
Abstract: A side-port piezoelectric microelectromechanical system microphone package includes a microelectromechanical system die disposed on the microphone substrate and including a microphone membrane and a membrane support substrate, the microphone membrane being disposed on a wall of a membrane support substrate, and an acoustic port defined by an aperture passing through a portion of the wall of the membrane support substrate.
-
8.发明申请公开(公告)号：US20230130082A1
公开(公告)日：2023-04-27
申请号：US18047430
申请日：2022-10-18
Applicant: Skyworks Solutions, Inc.
Inventor： You Qian , Humberto Campanella-Pineda , Guofeng Chen , Rakesh Kumar
Abstract: A method of making a piezoelectric sensor includes forming piezoelectric layer(s) to define a beam extending between a proximal portion and a distal end. The method also includes modeling a strain distribution on the beam based on a force applied to the beam, and defining an outer boundary with a shape substantially corresponding to a contour line of the strain distribution on the beam. The method also includes forming an electrode having said outer boundary shape, and attaching the electrode to the beam. The method also includes attaching the beam to a substrate in cantilever form so that the proximal portion of the beam is anchored to the substrate and the distal end of the beam is unsupported.
-
公开(公告)号：US20230072672A1
公开(公告)日：2023-03-09
申请号：US17929071
申请日：2022-09-01
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： Guofeng Chen , You Qian , Rakesh Kumar , Michael Jon Wurtz , Humberto Campanella-Pineda
IPC: H04R17/02
Abstract: A microelectromechanical system microphone includes a piezoelectric diaphragm, upper inner electrodes and upper outer electrodes disposed on an upper surface of the diaphragm, and lower inner electrodes and lower outer electrodes disposed on a lower surface of the diaphragm. The diaphragm is divided into a plurality of sectors, a first of the sectors including an inner and an outer upper electrode physically disconnected from an inner and an outer upper electrode on a second sector adjacent to the first sector, and an inner and an outer lower electrode physically disconnected from an inner and an outer lower electrode on the second sector. A first via extends between and electrically couples the upper and lower inner electrodes of the first sector and a first bond pad. A second via extends between and electrically couples the upper and lower outer electrodes of the second sector and a second bond pad.
-
公开(公告)号：US12302063B2
公开(公告)日：2025-05-13
申请号：US17943816
申请日：2022-09-13
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： You Qian , Rakesh Kumar , Guofeng Chen
Abstract: A piezoelectric microelectromechanical systems (MEMS) microphone is provided comprising a substrate including walls defining a cavity and at least two of the walls defining a respective anchor region each, a piezoelectric film layer defining at least two beams, each respective beam supported by the substrate at each anchor region, the beams being free along a portion of their respective lengths and also connected at a connecting region away from the respective anchor regions; and an electrode disposed over the piezoelectric film layer. A method of manufacturing such a MEMS microphone is also provided.
-
-
-
-
-
-
-
-
-
Search Results
28
records
(took 0.017 seconds)
