Vertical-type memory device
    12.
    发明授权

    公开(公告)号:US11239249B2

    公开(公告)日:2022-02-01

    申请号:US16533193

    申请日:2019-08-06

    Abstract: A vertical-type memory device includes: a first gate structure including first gate electrodes spaced apart from each other and stacked on a substrate; first channel structures penetrating through the first gate structure and being in contact with the substrate; a second gate structure including second gate electrodes spaced apart from each other and stacked on the first gate structure; and second channel structures penetrating through the second gate structure and being in contact with the first channel structures. The first channel structures each may include a first channel layer penetrating the first gate structure, and a first channel pad disposed on the first channel layer and including a first pad region including n-type impurities and a second pad region including p-type impurities.

    Refrigerator
    15.
    发明授权
    Refrigerator 有权
    冰箱

    公开(公告)号:US08752919B2

    公开(公告)日:2014-06-17

    申请号:US13926371

    申请日:2013-06-25

    Abstract: Disclosed is a refrigerator including a main body provided with a storage chamber; a door to respectively open and close the storage chamber; a control unit installed the door to select an operation; a reception part provided in the door to receive the control unit; and an installation hole provided on a side end of the door to cause the control unit to be inserted into the reception part. The control unit is installed through the side end of the door, which is deviated from a user's line of sight.

    Abstract translation: 公开了一种冰箱,其包括设置有储存室的主体; 分别打开和关闭储藏室的门; 控制单元安装门以选择操作; 接收部,设置在所述门中以接收所述控制单元; 以及设置在门的侧端的安装孔,以使控制单元插入接收部。 控制单元通过门的侧端安装,其偏离用户的视线。

    REFRIGERATOR
    16.
    发明申请
    REFRIGERATOR 有权
    冰箱

    公开(公告)号:US20130285528A1

    公开(公告)日:2013-10-31

    申请号:US13926371

    申请日:2013-06-25

    Abstract: Disclosed is a refrigerator including a main body provided with a storage chamber; a door to respectively open and close the storage chamber; a control unit installed the door to select an operation; a reception part provided in the door to receive the control unit; and an installation hole provided on a side end of the door to cause the control unit to be inserted into the reception part. The control unit is installed through the side end of the door, which is deviated from a user's line of sight.

    Abstract translation: 公开了一种冰箱,其包括设置有储存室的主体; 分别打开和关闭储藏室的门; 控制单元安装门以选择操作; 接收部,设置在所述门中以接收所述控制单元; 以及设置在门的侧端的安装孔,以使控制单元插入接收部。 控制单元通过门的侧端安装,其偏离用户的视线。

    Semiconductor memory device comprising magnetic tunnel junctions

    公开(公告)号:US12213322B2

    公开(公告)日:2025-01-28

    申请号:US17380331

    申请日:2021-07-20

    Abstract: A three-dimensional semiconductor memory device is provided. The semiconductor memory device includes first horizontal conductive lines on a substrate in a first direction, each of the first horizontal conductive lines extending in a second direction different from the first direction, second horizontal conductive lines stacked on the substrate in the first direction, each of the second horizontal conductive lines extending in the second direction, a vertical conductive line between the first horizontal conductive line and the second horizontal conductive line and extending in the first direction, a plurality of first magnetic tunnel junction patterns between the vertical conductive line and each of the first horizontal conductive lines, and a plurality of second magnetic tunnel junction patterns between the vertical conductive lines and each of the second horizontal conductive lines. The first horizontal conductive lines and the second horizontal conductive lines are spaced apart from each other in a third direction.

    Semiconductor memory device
    18.
    发明授权

    公开(公告)号:US12048150B2

    公开(公告)日:2024-07-23

    申请号:US17377848

    申请日:2021-07-16

    CPC classification number: H10B43/20 H10B43/10

    Abstract: A semiconductor memory device having improved electrical characteristics is provided. The semiconductor memory device comprises a first semiconductor pattern separated from a substrate in a first direction, a first gate structure extending in the first direction and penetrating the first semiconductor pattern, a first conductive connecting line connected to the first semiconductor pattern and extending in a second direction different from the first direction, and a second conductive connecting line connected to the first semiconductor pattern. The first gate structure is between the first conductive connecting line and the second conductive connecting line, the first gate structure includes a first gate electrode and a first gate insulating film, and the first gate insulating film includes a first charge holding film contacting with the first semiconductor pattern.

    Vertical memory device
    19.
    发明授权

    公开(公告)号:US11024642B2

    公开(公告)日:2021-06-01

    申请号:US16508727

    申请日:2019-07-11

    Abstract: A vertical memory device includes a stacked structure including a plurality of gate electrode layers stacked on a substrate, a plurality of channel layers extending in a direction perpendicular to an upper surface of the substrate on a first side surface of the stacked structure and spaced apart from each other in a direction parallel to the upper surface of the substrate, and a common source layer disposed between the stacked structure and the substrate and contacting the channel layers.

    Memory device with memory cell structure including ferroelectric data storage layer, and a first gate and a second gate

    公开(公告)号:US10896711B2

    公开(公告)日:2021-01-19

    申请号:US16522121

    申请日:2019-07-25

    Abstract: A memory device includes memory cells, the memory cells each including a first gate, a second gate electrically isolated from the first gate, a first gate insulating layer including a data storage layer having a ferroelectric material and disposed between the first gate and a channel region, a second gate insulating layer disposed between the second gate and the channel region, a first switching cell connected between the memory cells and a source line, and a second switching cell connected between the memory cells and a bit line. The second switching cell includes a third gate, a fourth gate, a third gate insulating layer not including a data storage layer having the ferroelectric material and the third gate disposed between the third gate and the channel region, and a fourth gate insulating layer disposed between the fourth gate and the channel region.

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