公开(公告)号：US20210408355A1

公开(公告)日：2021-12-30

申请号：US17472821

申请日：2021-09-13

Applicant: SeeQC, Inc.

Inventor： Daniel Yohannes ,  Denis Amparo ,  Oleksandr Chernyashevskyy ,  Oleg Mukhanov ,  Mario Renzullo ,  Andrei Talalaeskii ,  Igor Vernik ,  John Vivalda ,  Jason Walter

IPC: H01L39/04 ,  H01L23/00 ,  H01L39/22 ,  H01L39/24

Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.