公开(公告)号：US11732123B2

公开(公告)日：2023-08-22

申请号：US17788966

申请日：2020-03-31

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Zengbiao Huang ,  Huayong Fan ,  Yongjing Xu ,  Jianlong Huang ,  Naidong She

IPC: B32B3/10 ,  C08L51/06 ,  C08J5/24 ,  B32B5/02 ,  B32B5/26 ,  H05K1/03 ,  H05K3/02

CPC classification number: C08L51/06 ,  B32B5/02 ,  B32B5/26 ,  C08J5/244 ,  H05K1/034 ,  B32B2250/20 ,  B32B2255/02 ,  B32B2255/205 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/204 ,  B32B2307/308 ,  B32B2307/3065 ,  B32B2307/748 ,  B32B2457/08 ,  C08J2351/06 ,  H05K3/02

Abstract: Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.

公开(公告)号：US10400173B2

公开(公告)日：2019-09-03

申请号：US15475471

申请日：2017-03-31

Applicant: Shengyi Technology Co., Ltd.

Inventor： Yongzhen Wang ,  Yueshan He ,  Zhongqiang Yang ,  Yongjing Xu

IPC: C08K5/544 ,  C09K21/12 ,  B32B15/092 ,  B32B27/20 ,  B32B37/06 ,  C08J5/24 ,  C08K3/22 ,  C08K3/36 ,  C07F9/659 ,  C08K5/5399 ,  C08K5/54 ,  C08L27/02 ,  D06M15/673

Abstract: The present invention provides a siloxane-modified cyclotriphosphazene halogen-free flame retardant, and a preparation method and a use thereof. The siloxane-modified cyclotriphosphazene halogen-free flame retardant has the structural formula as shown in Formula I. In the siloxane-modified cyclotriphosphazene halogen-free flame retardant of the present invention, three kinds of structures of siloxane, aryl phosphorus oxygen compound and cyclotriphosphazene are built in one molecular formula, which combines the advantages of three structures, improves the compatibility between the flame retardant and resins, has a high flame retardant efficiency and a better char formation and can greatly increase the flame retardancy and stability of resin cured products.

公开(公告)号：US10208156B2

公开(公告)日：2019-02-19

申请号：US15113618

申请日：2015-06-01

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Xianping Zeng ,  Liexiang He ,  Yongjing Xu

IPC: C08G59/06 ,  C08G59/42 ,  C08G59/32 ,  C08G73/10 ,  C08L63/00 ,  C08L79/00 ,  C08K3/013 ,  C08K3/36 ,  C08K5/00 ,  C08K5/11 ,  C08J5/24 ,  H05K1/03 ,  B32B27/04

Abstract: Provided in the present invention are an epoxy resin composition, prepreg and laminate using the same, the epoxy resin composition comprising the following components: (A) an imide modified epoxy resin; and (B) a crosslinking agent, the imide modified epoxy resin being an epoxy resin having a structure of formula (1) and/or formula (2). The prepreg and laminate prepared from the epoxy resin composition have a high glass-transition temperature, a low dielectric constant, a low dielectric loss factor, a high heat and humidity resistance, a high toughness and a good processability.