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公开(公告)号：US20180016387A1
公开(公告)日：2018-01-18
申请号：US15305759
申请日：2016-03-29
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Haosheng Xu , Xianping Zeng , Liexiang He
IPC: C08G59/26 , C08K7/18 , C08G59/68 , C08G59/42 , C08K3/36 , C08K5/00 , C08L63/00 , H05K1/03 , C08J5/24
Abstract: The present invention relates to an epoxy resin composition, comprising the following components: (A) an epoxy resin containing oxazolidinone structure having the structure of the formula (1), (B) an active ester curing agent, and (C) a curing accelerator. The epoxy composition, prepreg, laminate and printed circuit board prepared from such epoxy composition have the following features of low coefficient of thermal expansion, low dielectric loss factor Df less than or equal to 0.0084, low water absorption and excellent moisture and heat resistance.
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公开(公告)号：US10723875B2
公开(公告)日：2020-07-28
申请号：US15744686
申请日：2017-08-14
Applicant: Shengyi Technology Co., Ltd.
Inventor： Xianping Zeng , Liexiang He
Abstract: The present disclosure relates to a halogen-free epoxy resin composition and a prepreg and a laminate using the same. The halogen-free epoxy resin composition comprises: (A) a halogen-free epoxy resin; (B) an active ester resin; and (C) a reactive phosphorous-containing flame retardant. The prepreg and laminate made from the halogen-free epoxy resin composition have the advantages of high inter-laminar adhesive force, low coefficient of thermal expansion and high heat-humidity resistance, and can achieve the halogen-free flame retardant purpose.
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公开(公告)号：US09873789B2
公开(公告)日：2018-01-23
申请号：US15118204
申请日：2015-06-01
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Xianping Zeng , Liexiang He
IPC: C08L63/00 , C08L63/04 , C08G59/62 , C08G59/42 , C08J5/24 , C08J5/04 , C08J5/10 , C08G59/68 , H05K1/03
CPC classification number: C08L63/04 , C08G59/4071 , C08G59/4215 , C08G59/4238 , C08G59/4284 , C08G59/621 , C08G59/685 , C08G59/686 , C08J5/043 , C08J5/10 , C08J5/24 , C08J2363/04 , C08J2425/08 , C08J2461/14 , C08L63/00 , C08L2201/02 , C08L2201/22 , C08L2203/20 , C08L2205/05 , H05K1/0373 , C08L61/14 , C08L61/12 , C08L61/32
Abstract: Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.
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Patent Agency Ranking
公开(公告)号：US10208156B2
公开(公告)日：2019-02-19
申请号：US15113618
申请日：2015-06-01
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Xianping Zeng , Liexiang He , Yongjing Xu
IPC: C08G59/06 , C08G59/42 , C08G59/32 , C08G73/10 , C08L63/00 , C08L79/00 , C08K3/013 , C08K3/36 , C08K5/00 , C08K5/11 , C08J5/24 , H05K1/03 , B32B27/04
Abstract: Provided in the present invention are an epoxy resin composition, prepreg and laminate using the same, the epoxy resin composition comprising the following components: (A) an imide modified epoxy resin; and (B) a crosslinking agent, the imide modified epoxy resin being an epoxy resin having a structure of formula (1) and/or formula (2). The prepreg and laminate prepared from the epoxy resin composition have a high glass-transition temperature, a low dielectric constant, a low dielectric loss factor, a high heat and humidity resistance, a high toughness and a good processability.
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公开(公告)号：US20170283609A1
公开(公告)日：2017-10-05
申请号：US15118204
申请日：2015-06-01
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Xianping Zeng , Liexiang He
CPC classification number: C08L63/04 , C08G59/4071 , C08G59/4215 , C08G59/4238 , C08G59/4284 , C08G59/621 , C08G59/685 , C08G59/686 , C08J5/043 , C08J5/10 , C08J5/24 , C08J2363/04 , C08J2425/08 , C08J2461/14 , C08L63/00 , C08L2201/02 , C08L2201/22 , C08L2203/20 , C08L2205/05 , H05K1/0373 , C08L61/14 , C08L61/12 , C08L61/32
Abstract: Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.
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公开(公告)号：US12104054B2
公开(公告)日：2024-10-01
申请号：US17437555
申请日：2019-04-08
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Liexiang He , Yongnian Qi , Xianping Zeng , Zhongqiang Yang , Hualin Pan
CPC classification number: C08L63/04 , C08J5/244 , C08J5/249 , C08K3/013 , C08K5/0066 , C08J2363/04 , C08L2201/02 , C08L2203/20
Abstract: The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.
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公开(公告)号：US10544255B2
公开(公告)日：2020-01-28
申请号：US15305759
申请日：2016-03-29
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Haosheng Xu , Xianping Zeng , Liexiang He
IPC: C08G59/26 , C08L63/00 , B32B38/08 , B32B37/10 , B32B17/04 , C08L79/04 , C08G59/42 , C08G59/68 , C08J5/24 , C08K3/36 , C08K5/00 , H05K1/03 , C08K7/18
Abstract: The present invention relates to an epoxy resin composition, comprising the following components: (A) an epoxy resin containing oxazolidinone structure having the structure of the formula (1), (B) an active ester curing agent, and (C) a curing accelerator. The epoxy composition, prepreg, laminate and printed circuit board prepared from such epoxy composition have the following features of low coefficient of thermal expansion, low dielectric loss factor Df less than or equal to 0.0084, low water absorption and excellent moisture and heat resistance.
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公开(公告)号：US20170002131A1
公开(公告)日：2017-01-05
申请号：US15113618
申请日：2015-06-01
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Xianping Zeng , Liexiang He , Yongjing Xu
CPC classification number: C08G59/063 , B32B27/04 , C08G59/3236 , C08G59/4215 , C08G73/1071 , C08J5/24 , C08J2363/02 , C08K3/013 , C08K3/36 , C08K5/0025 , C08K5/0066 , C08K5/11 , C08L63/00 , C08L79/00 , H05K1/0326 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , H05K2201/0212
Abstract: Provided in the present invention are an epoxy resin composition, prepreg and laminate using the same, the epoxy resin composition comprising the following components: (A) an imide modified epoxy resin; and (B) a crosslinking agent, the imide modified epoxy resin being an epoxy resin having a structure of formula (1) and/or formula (2). The prepreg and laminate prepared from the epoxy resin composition have a high glass-transition temperature, a low dielectric constant, a low dielectric loss factor, a high heat and humidity resistance, a high toughness and a good processability.
Abstract translation: 在本发明中，提供了环氧树脂组合物，预浸料和使用该环氧树脂的叠层体，所述环氧树脂组合物包含以下组分：（A）酰亚胺改性环氧树脂; 和（B）交联剂，所述酰亚胺改性环氧树脂是具有式（1）和/或式（2）结构的环氧树脂。 由环氧树脂组合物制备的预浸料和层压板具有高玻璃化转变温度，低介电常数，低介电损耗因子，高耐热和耐湿性，高韧性和良好的加工性能。
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