公开(公告)号：US11106110B2

公开(公告)日：2021-08-31

申请号：US15518932

申请日：2015-09-17

Applicant: Sony Corporation

Inventor： Tomomasa Watanabe ,  Masayuki Tanaka ,  Hisayoshi Motobayashi ,  Shiro Uchida

IPC: B29C64/00 ,  G02F1/31 ,  G02B26/10 ,  B33Y30/00 ,  B29C67/00 ,  A45D29/00 ,  B29C64/135 ,  B33Y10/00 ,  G02F1/29

Abstract: An optical shaping apparatus includes: a light source unit that outputs collimated light; an optical function unit that is disposed on an optical path of the collimated light and modulates the optical path or a phase of the collimated light; and a control unit that controls operation of the optical function unit, to irradiate a target surface with modulated light produced in the optical function unit.

公开(公告)号：US20180301499A1

公开(公告)日：2018-10-18

申请号：US16014129

申请日：2018-06-21

Applicant: Sony Corporation

Inventor： Keiji Mabuchi ,  Hideshi Abe ,  Hideo Kanbe ,  Shiro Uchida

IPC: H01L27/146 ,  G01J5/20 ,  G01J3/36 ,  G01J3/28 ,  H01L27/30

Abstract: A solid-state imaging device includes an Si substrate in which a photoelectric conversion unit that photoelectrically converts visible light incident from a back surface side is formed, and a lower substrate provided under the Si substrate and configured to photoelectrically convert infrared light incident from the back surface side.

公开(公告)号：US09831284B2

公开(公告)日：2017-11-28

申请号：US15054677

申请日：2016-02-26

Applicant: Sony Corporation

Inventor： Keiji Mabuchi ,  Hideshi Abe ,  Hideo Kanbe ,  Shiro Uchida

IPC: H01L27/146 ,  G01J5/20 ,  G01J3/28 ,  G01J3/36

CPC classification number: H01L27/14652 ,  G01J3/2803 ,  G01J3/36 ,  G01J5/20 ,  H01L27/14609 ,  H01L27/14612 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14647 ,  H01L27/14649 ,  H01L27/14683 ,  H01L27/14687 ,  H01L27/1469 ,  H01L27/30 ,  H01L27/307

Abstract: A solid-state imaging device includes an Si substrate in which a photoelectric conversion unit that photoelectrically converts visible light incident from a back surface side is formed, and a lower substrate provided under the Si substrate and configured to photoelectrically convert infrared light incident from the back surface side.

公开(公告)号：US20170232669A1

公开(公告)日：2017-08-17

申请号：US15518932

申请日：2015-09-17

Applicant: Sony Corporation

Inventor： Tomomasa Watanabe ,  Masayuki Tanaka ,  Hisayoshi Motobayashi ,  Shiro Uchida

IPC: B29C67/00 ,  G02F1/31 ,  G02B26/10 ,  B33Y30/00 ,  B33Y10/00

CPC classification number: G02F1/31 ,  A45D29/00 ,  A45D2029/005 ,  B29C64/135 ,  B29C67/00 ,  B33Y10/00 ,  B33Y30/00 ,  G02B26/10 ,  G02F2001/291 ,  G05B2219/49013

Abstract: An optical shaping apparatus includes: a light source unit that outputs collimated light; an optical function unit that is disposed on an optical path of the collimated light and modulates the optical path or a phase of the collimated light; and a control unit that controls operation of the optical function unit, to irradiate a target surface with modulated light produced in the optical function unit.