公开(公告)号：US20240237218A1

公开(公告)日：2024-07-11

申请号：US18609232

申请日：2024-03-19

Applicant: TactoTek Oy

Inventor： Vinski BRÄYSY ,  Ilpo HÄNNINEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Topi WUORI ,  Mikko SIPPARI ,  Heikki ALAMÄKI

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/12 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K1/181 ,  H05K1/111 ,  H05K3/12 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/0129

Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.

公开(公告)号：US20240004119A1

公开(公告)日：2024-01-04

申请号：US18326110

申请日：2023-05-31

Applicant: TactoTek Oy

Inventor： Antti KERÄNEN ,  Tero HEIKKINEN ,  Pasi KORHONEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Paavo NISKALA ,  Ville WALLENIUS ,  Heikki TUOVINEN ,  Janne ASIKKALA ,  Taneli SALMI ,  Suvi KELA ,  Outi RUSANEN ,  Johanna JUVANI ,  Mikko SIPPARI ,  Tomi SIMULA ,  Tapio RAUTIO ,  Samuli YRJÄNÄ ,  Tero RAJANIEMI ,  Simo KOIVIKKO ,  Juha-Matti HINTIKKA ,  Hasse SINIVAARA ,  Vinski BRÄYSY ,  Olimpia MIGLIORE ,  Juha SEPPONEN

IPC: F21V8/00

CPC classification number: G02B6/0031 ,  G02B6/0021 ,  G02B6/0065 ,  G02B6/0041 ,  G02B6/0043 ,  G02B6/0036 ,  G02B6/0061 ,  G02B6/0068 ,  G02B6/0055 ,  G02B6/0073 ,  G02B6/004 ,  G02B6/0051 ,  G02B6/0083 ,  G02B5/0883

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.

公开(公告)号：US20210368630A1

公开(公告)日：2021-11-25

申请号：US17072474

申请日：2020-10-16

Applicant: TactoTek Oy

Inventor： Tomi SIMULA ,  Mika PAANI ,  Miikka KÄRNÄ ,  Outi RUSANEN ,  Johanna JUVANI ,  Tapio RAUTIO ,  Marko SUO-ANTTILA ,  Mikko HEIKKINEN

IPC: H05K3/28 ,  H05K1/18 ,  H05K5/03 ,  B29C45/14 ,  H05K5/06

Abstract: A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.

公开(公告)号：US20190090353A1

公开(公告)日：2019-03-21

申请号：US16195179

申请日：2018-11-19

Applicant: TACTOTEK OY

Inventor： Paavo NISKALA ,  Pasi RAAPPANA ,  Mikko HEIKKINEN ,  Mikko SIPPARI ,  Jarkko TORVINEN

IPC: H05K3/12 ,  H05K1/18 ,  H05K3/28 ,  H05K3/00 ,  H05K3/30 ,  H05K1/09 ,  H05K1/02

Abstract: A method for manufacturing an electronic product, comprising providing a flexible, optionally optically substantially transparent or translucent, substrate film, printing a number of conductive traces of conductive ink on the substrate film, said traces defining a number of conductors and conductive contact areas for the contacts of at least one electronic surface-mountable component, disposing the at least one electronic surface-mountable component, such as an integrated circuit, on the substrate film so that the contacts meet the predefined contact areas when they are still wet to establish the electrical connection therebetween, and further securing, optionally overmoulding, the component. Related arrangement and electronic product are presented.

公开(公告)号：US20190021168A1

公开(公告)日：2019-01-17

申请号：US16123479

申请日：2018-09-06

Applicant: TACTOTEK OY

Inventor： Mikko HEIKKINEN ,  Jarmo SAASKI

IPC: H05K1/18 ,  H05K3/32 ,  H05K1/02 ,  H05K3/12 ,  H05K3/28

Abstract: A method for manufacturing a multilayer structure for an electronic device includes obtaining a flexible substrate film; printing a number of conductor traces on the flexible substrate film; providing a number of electronic components on a first surface area of the flexible substrate film, wherein the flexible substrate film further includes a second surface area adjacent to the first surface area; molding first thermoplastic material on the number of electronic components and the related first surface area of the flexible substrate film accommodating the components; and molding second thermoplastic material on the adjacent second surface area and on at least part of the first surface area, wherein the first thermoplastic material exhibits a first elasticity and the second thermoplastic material exhibits a second, different elasticity.

公开(公告)号：US20180290356A1

公开(公告)日：2018-10-11

申请号：US15481976

申请日：2017-04-07

Applicant: TactoTek Oy

Inventor： Anne Isohätälä ,  Hasse Sinivaara ,  Mikko HEIKKINEN

IPC: B29C45/14 ,  B29B11/06 ,  H01F27/28 ,  H01F38/14 ,  H01F41/04 ,  H01Q9/04 ,  G01D5/24

Abstract: A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.

公开(公告)号：US20170094776A1

公开(公告)日：2017-03-30

申请号：US15279131

申请日：2016-09-28

Applicant: TactoTek Oy

Inventor： Mikko HEIKKINEN ,  Pasi RAAPPANA ,  Jarmo SAASKI

IPC: H05K1/02 ,  H05K3/28 ,  H05K3/12 ,  H05K3/30 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K3/4015 ,  H05K1/189 ,  H05K3/4046 ,  H05K2201/10287 ,  H05K2203/1327

Abstract: A multilayer structure, includes a flexible substrate film having a first side and opposite second side, a number of conductive traces, optionally defining contact pads and/or conductors, preferably printed on the first side for establishing a desired predetermined circuit design, plastic layer molded onto the first side so as to enclose the circuit between the plastic layer and the first side, and a preferably flexible connector for providing external electrical connection to the embedded circuit on the first side from the second, opposite side, one end of the connector being attached to a predetermined contact area on the first side, the other end being located on the second side for coupling with an external element, the intermediate portion connecting the two ends being fed through an opening in the substrate, wherein the opening extending through the thickness of the film is dimensioned to accommodate the connector without substantial additional clearance.

公开(公告)号：US20240021764A1

公开(公告)日：2024-01-18

申请号：US18476676

申请日：2023-09-28

Applicant: TactoTek Oy

Inventor： Antti KERÄNEN ,  Sami TORVINEN ,  Tero HEIKKINEN ,  Pasi KORHONEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Paavo NISKALA ,  Ville WALLENIUS ,  Heikki TUOVINEN ,  Janne ASIKKALA ,  Taneli SALMI ,  Suvi KELA ,  Outi RUSANEN ,  Johanna JUVANI ,  Mikko SIPPARI ,  Tomi SIMULA ,  Tapio RAUTIO ,  Samuli YRJÄNÄ ,  Tero RAJANIEMI ,  Simo KOIVIKKO ,  Juha-Matti HINTIKKA ,  Hasse SINIVAARA ,  Vinski BRÄYSY ,  Olimpia MIGLIORE ,  Juha SEPPONEN

IPC: H01L33/60 ,  H01L33/00 ,  H01L33/62 ,  H01L25/075

CPC classification number: H01L33/60 ,  H01L33/005 ,  H01L33/62 ,  H01L25/0753 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.

公开(公告)号：US20240004120A1

公开(公告)日：2024-01-04

申请号：US18339467

申请日：2023-06-22

Applicant: TactoTek Oy

Inventor： Antti KERÄNEN ,  Tero HEIKKINEN ,  Pasi KORHONEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Paavo NISKALA ,  Ville WALLENIUS ,  Heikki TUOVINEN ,  Janne ASIKKALA ,  Taneli SALMI ,  Suvi KELA ,  Outi RUSANEN ,  Johanna JUVANI ,  Mikko SIPPARI ,  Tomi SIMULA ,  Tapio RAUTIO ,  Samuli YRJÄNÄ ,  Tero RAJANIEMI ,  Simo KOIVIKKO ,  Juha-Matti HINTIKKA ,  Hasse SINIVAARA ,  Vinski BRÄYSY ,  Olimpia MIGLIORE ,  Juha SEPPONEN

IPC: F21V8/00

CPC classification number: G02B6/0031 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0065 ,  G02B6/0051 ,  G02B6/0036 ,  G02B6/0083 ,  G02B6/0061 ,  G02B6/0021 ,  G02B6/004 ,  G02B6/0043 ,  G02B6/0055 ,  G02B6/0041 ,  G02B5/0883

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective laver towards the plastic layer.

公开(公告)号：US20230389184A1

公开(公告)日：2023-11-30

申请号：US18353143

申请日：2023-07-17

Applicant: TactoTek Oy

Inventor： Vinski BRÄYSY ,  Ilpo HÄNNINEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Topi WUORI ,  Mikko SIPPARI ,  Heikki ALAMÄKI

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K3/12 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K3/305 ,  H05K3/321 ,  H05K3/12 ,  H05K1/111 ,  H05K2201/0129

Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate, and arranging electrically conductive joint material onto the first and the second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.