公开(公告)号：US20210335702A1

公开(公告)日：2021-10-28

申请号：US17368244

申请日：2021-07-06

Applicant: TactoTek Oy

Inventor： Jarmo SÄÄSKI ,  Mikko HEIKKINEN ,  Tero HEIKKINEN ,  Mika PAANI ,  Jan TILLONEN ,  Ronald HAAG

IPC: H01L23/522 ,  H01L23/50 ,  H05K3/46 ,  H01L23/14 ,  H01L25/065 ,  H05K3/28

Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.

公开(公告)号：US20190287892A1

公开(公告)日：2019-09-19

申请号：US15924697

申请日：2018-03-19

Applicant: TactoTek Oy

Inventor： Jarmo SÄÄSKI ,  Mikko HEIKKINEN ,  Tero HEIKKINEN ,  Mika PAANI ,  Jan TILLONEN ,  Ronald HAAG

IPC: H01L23/522 ,  H01L23/50 ,  H01L25/065 ,  H01L23/14 ,  H05K3/46

Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.

公开(公告)号：US20210368630A1

公开(公告)日：2021-11-25

申请号：US17072474

申请日：2020-10-16

Applicant: TactoTek Oy

Inventor： Tomi SIMULA ,  Mika PAANI ,  Miikka KÄRNÄ ,  Outi RUSANEN ,  Johanna JUVANI ,  Tapio RAUTIO ,  Marko SUO-ANTTILA ,  Mikko HEIKKINEN

IPC: H05K3/28 ,  H05K1/18 ,  H05K5/03 ,  B29C45/14 ,  H05K5/06

Abstract: A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.