公开(公告)号：US20210219430A1

公开(公告)日：2021-07-15

申请号：US17134316

申请日：2020-12-26

Applicant: TDK CORPORATION

Inventor： Yuichiro OKUYAMA ,  Takeshi OOHASHI ,  Hajime KUWAJIMA ,  Takashi OHTSUKA ,  Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA

IPC: H05K1/16 ,  H05K1/02

Abstract: Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

公开(公告)号：US20210204406A1

公开(公告)日：2021-07-01

申请号：US17132626

申请日：2020-12-23

Applicant: TDK Corporation

Inventor： Takeshi OOHASHI ,  Shinichiro TODA ,  Daiki KUSUNOKI ,  Takashi OHTSUKA ,  Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA

IPC: H05K1/16 ,  H01G4/228 ,  H01G4/33 ,  H01G4/40 ,  H01L49/02

Abstract: Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.