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1.发明公开公开(公告)号：US20230260697A1
公开(公告)日：2023-08-17
申请号：US18012126
申请日：2020-12-24
Applicant: TDK Corporation
Inventor： Yuki YAMASHITA , Kenichi YOSHIDA , Yoshihiko YANO , Daiki ISHII
Abstract: To provide a thin film capacitor in which a pair of terminal electrodes can be disposed on the same plane. A thin film capacitor includes a metal foil having a roughened upper surface, a dielectric film covering the upper surface of the metal foil and having an opening for partly exposing the metal foil therethrough, a first electrode layer contacting the metal foil through the opening, and a second electrode layer contacting the dielectric film without contacting the metal foil. With this configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, since the metal foil is surface-roughened, a larger capacitance can be obtained.
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公开(公告)号：US20190304701A1
公开(公告)日：2019-10-03
申请号：US16360405
申请日：2019-03-21
Applicant: TDK CORPORATION
Inventor： Daiki ISHII , Kazuhiro YOSHIKAWA , Koichi TSUNODA , Mitsuhiro TOMIKAWA , Junki NAKAMOTO , Kenichi YOSHIDA
Abstract: A thin-film capacitor satisfies a relationship of CTE1>CTE2>CTE3 regarding a linear expansion coefficient CTE1 of a base, a linear expansion coefficient CTE2 of a capacitance unit, and a linear expansion coefficient CTE3 of a barrier layer. The inventors have newly found that in a case in which such a relationship is satisfied, when a temperature falls from a deposition temperature, cracking occurring in the capacitance unit of the thin-film capacitor is prevented, and cracking occurring in the barrier layer is also prevented.
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公开(公告)号：US20170373009A1
公开(公告)日：2017-12-28
申请号：US15633013
申请日：2017-06-26
Applicant: TDK CORPORATION
Inventor： Kenichi YOSHIDA , Mitsuhiro TOMIKAWA , Eiko WAKATA
IPC: H01L23/538 , H01G4/228 , H01G4/005
CPC classification number: H01L23/5385 , H01G4/005 , H01G4/228 , H01G4/232 , H01G4/33 , H01G4/40 , H05K1/162 , H05K2201/0195 , H05K2201/09063 , H05K2201/09072 , H05K2201/10015 , H05K2201/10537 , H05K2201/10545
Abstract: An electronic component includes a first electronic component and a second electronic component that is stacked on the first electronic component. A second electrode layer of the first electronic component includes a plurality of divided electrode layers, and a pair of electrodes of the second electronic component are electrically connected to different electrode layers included in the plurality of electrode layers of the second electrode layer, and a first electrode layer of the first electronic component is divided into a plurality of electrode layers to correspond to the electrode layers which are included in the second electrode layer and which are electrically connected to the pair of electrodes of the second electronic component.
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公开(公告)号：US20170130337A1
公开(公告)日：2017-05-11
申请号：US15415493
申请日：2017-01-25
Applicant: TDK CORPORATION
Inventor： Kenichi YOSHIDA , Yuhei HORIKAWA , Atsushi SATO , Hisayuki ABE
CPC classification number: C23C18/1655 , C23C18/1637 , C23C18/1651 , C23C18/32 , C23C18/42 , C23C18/54 , C23C28/02 , H01L24/03 , H01L24/05 , H01L2224/03464 , H01L2224/0401 , H01L2224/04042 , H01L2224/05083 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05164 , H01L2224/05644 , H01L2924/01015 , H01L2924/14 , H01L2924/00
Abstract: A method of providing a coating on a conductor. The coating has a first layer containing palladium and a second layer containing gold from the conductor side. The first layer has an inner layer on the conductor side and an outer layer arranged nearer to the second layer than the inner layer, and the outer layer has a higher phosphorus concentration than the inner layer.
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公开(公告)号：US20150380796A1
公开(公告)日：2015-12-31
申请号：US14750528
申请日：2015-06-25
Applicant: TDK CORPORATION
Inventor： Makoto YOSHIDA , Kenichi YOSHIDA , Tohru INOUE , Takaaki DOMON , Takashi OTA , Katsunori OSANAI
CPC classification number: H01P3/10 , B82Y30/00 , B82Y99/00 , H01P3/122 , H01P9/006 , H01Q1/368 , H01Q1/38 , H01Q1/40 , Y10S977/742
Abstract: A high-frequency transmission line in which the alternating-current resistance is low is provided. A high-frequency transmission line 2 is a high-frequency transmission line 2 to transmit an alternating-current electric signal, and contains metal and carbon nanotube, and the carbon nanotube is unevenly distributed at a peripheral part 8 of a cross-section that is of the high-frequency transmission line 2 and that is perpendicular to a transmission direction of the alternating-current electric signal.
Abstract translation: 提供了交流电阻低的高频传输线。 高频传输线2是传输交流电信号的高频传输线2，并且包含金属和碳纳米管，并且碳纳米管不均匀地分布在横截面的外围部分8 并且垂直于交流电信号的传输方向。
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Patent Agency Ranking
公开(公告)号：US20130257682A1
公开(公告)日：2013-10-03
申请号：US13790803
申请日：2013-03-08
Applicant: TDK CORPORATION
Inventor： Kenichi YOSHIDA , Yuhei HORIKAWA
CPC classification number: H01P3/08 , H01P11/003 , H01Q1/36 , H01Q1/50
Abstract: A high-frequency transmission line having low alternate current (AC) resistance is provided. One aspect of the present invention is a high-frequency transmission line disposed along a surface of an insulating support, wherein, letting F [Hz] be the frequency of an AC electric signal transmitted by the high-frequency transmission line and Ms [Wb/m] be the saturation magnetization per unit area, the frequency value F and the saturation magnification value per unit area Ms satisfy the following expression (1): Ms≦(1.5×102)/F+5.7×10−8. (1)
Abstract translation: 提供具有低交流（AC）电阻的高频传输线。 本发明的一个方面是沿着绝缘支撑体的表面布置的高频传输线，其中，使F [Hz]为由高频传输线发送的AC电信号的频率，Ms [Wb / m]为每单位面积的饱和磁化强度，每单位面积Ms的频率值F和饱和倍率值满足下式（1）：Ms @（1.5×102）/F +5.7×10-8。（1）
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公开(公告)号：US20230268133A1
公开(公告)日：2023-08-24
申请号：US18012135
申请日：2020-12-24
Applicant: TDK Corporation
Inventor： Daiki ISHII , Yoshihiko YANO , Kenichi YOSHIDA , Tetsuhiro TAKAHASHI , Yuki YAMASHITA
Abstract: To provide a thin film capacitor in which peeling-off of an electrode layer is less likely to occur. A thin film capacitor includes a metal foil having a roughened upper surface, a dielectric film covering the upper surface of the metal foil and having an opening for partly exposing the metal foil therethrough, a first electrode layer contacting the metal foil through the opening and further contacting the dielectric film, and a second electrode layer contacting the dielectric film without contacting the metal foil. With this configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, the first electrode layer contacts not only the metal foil but also the dielectric film, making peeling of the first electrode layer less likely to occur.
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公开(公告)号：US20210225593A1
公开(公告)日：2021-07-22
申请号：US17143581
申请日：2021-01-07
Applicant: TDK CORPORATION
Inventor： Kazuhiro YOSHIKAWA , Kenichi YOSHIDA , Takashi OHTSUKA , Yuichiro OKUYAMA , Takeshi OOHASHI , Hajime KUWAJIMA
Abstract: Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.
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公开(公告)号：US20180240599A1
公开(公告)日：2018-08-23
申请号：US15899403
申请日：2018-02-20
Applicant: TDK CORPORATION
Inventor： Koichi TSUNODA , Mitsuhiro TOMIKAWA , Kazuhiro YOSHIKAWA , Kenichi YOSHIDA
CPC classification number: H01G4/33 , H01G2/02 , H01G4/224 , H01G4/228 , H01G9/012 , H01G9/04 , H01G9/07 , H05K2201/0179 , H05K2201/0195
Abstract: In a thin-film capacitor, an electrode terminal layer is divided into a plurality of parts by a penetration portion, and includes a frame portion as one divided part. The frame portion is disposed along an outer edge of the electrode terminal layer when viewed from the bottom surface side of the electrode terminal layer, and the frame portion can hinder deformation of the electrode terminal layer stretching or warping in a thickness direction or an in-plane direction, whereby such deformation can be prevented. Accordingly, in the thin-film capacitor, the electrode terminal layer is not likely to be deformed and an improvement in strength thereof is achieved.
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公开(公告)号：US20180235086A1
公开(公告)日：2018-08-16
申请号：US15892722
申请日：2018-02-09
Applicant: TDK CORPORATION
Inventor： Mitsuhiro TOMIKAWA , Koichi TSUNODA , Kazuhiro YOSHIKAWA , Kenichi YOSHIDA
Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface; an electronic component that is embedded in the substrate and has at least one first terminal, at least one second terminal, and a capacity part; at least one via conductor that are formed in the insulating layer and electrically connected to the second terminal; and an adhesion layer that is in contact with the second terminal on an end face of the second terminal which are close to the second principal surface. The electronic component is laminated with the insulating layer, and adhesion strength between the adhesion layer and the insulating layer is higher than that between the second terminal and the insulating layer.
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