公开(公告)号：US20150340336A1

公开(公告)日：2015-11-26

申请号：US14814781

申请日：2015-07-31

Applicant: TESSERA, INC.

Inventor： Ilyas Mohammed ,  Belgacem Haba ,  Wael Zohni ,  Philip R. Osborn

IPC: H01L23/00 ,  H01L23/522 ,  H01L25/065 ,  H01L23/498

CPC classification number: H01L24/46 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/5226 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48105 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.

Abstract translation: 提供封装的微电子元件，其包括电介质元件，空腔，多个芯片触点和多个封装触点，以及具有连接到芯片触点的多个键合焊盘的微电子元件。

公开(公告)号：US20150243631A1

公开(公告)日：2015-08-27

申请号：US14679735

申请日：2015-04-06

Applicant: Tessera, Inc.

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H01L25/065 ,  H01L23/04 ,  H01L23/31 ,  H01L23/00 ,  H01L23/482

CPC classification number: H01L25/0652 ,  H01L23/04 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4822 ,  H01L23/4952 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/48265 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/386 ,  H01L2924/00 ,  H01L2224/7826 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements.

Abstract translation: 微电子封装包括包括第一基板和第一和第二微电子元件的子组件，所述第一和第二微电子元件具有面向第一基板的相对面向的第一和第二表面的接触轴承面，并且每个具有与第一基板电连接的触点。 第一和第二微电子元件的接触面至少部分地彼此覆盖。 引线将子组件与第二衬底电连接，引线的至少部分与第二衬底中的孔对齐。 引线可以包括延伸穿过第一基板中的孔并且连接到与第一基板孔对准的第一微电子元件的触点的引线键合。 在一个示例中，子组件可以使用导电间隔元件与第二衬底电连接。

公开(公告)号：US09105612B2

公开(公告)日：2015-08-11

申请号：US14034265

申请日：2013-09-23

Applicant: Tessera, Inc.

Inventor： Ilyas Mohammed ,  Belgacem Haba ,  Wael Zohni ,  Philip R. Osborn

IPC: H01L23/522 ,  H01L23/498 ,  H01L23/00 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L24/46 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/5226 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48105 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.

Abstract translation: 提供封装的微电子元件，其包括电介质元件，空腔，多个芯片触点和多个封装触点，以及具有连接到芯片触点的多个键合焊盘的微电子元件。

公开(公告)号：US20150221617A1

公开(公告)日：2015-08-06

申请号：US14689346

申请日：2015-04-17

Applicant: Tessera, Inc.

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp ,  Ilyas Mohammed ,  Frank Lambrecht

IPC: H01L25/065 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/492 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/09 ,  H01L24/32 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/0912 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/50 ,  H01L2224/73215 ,  H01L2224/73219 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic assembly can include a substrate having first and second surfaces each extending in first and second transverse directions, a peripheral edge extending in the second direction, first and second openings extending between the first and second surfaces, and a peripheral region of the second surface extending between the peripheral edge and one of the openings. The assembly can also include a first microelectronic element having a front surface facing the first surface, a rear surface opposite therefrom, and an edge extending between the front and rear surfaces. The assembly can also include a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond the edge of the first microelectronic element. The assembly can also include a plurality of terminals exposed at the second surface, at least one of the terminals being disposed at least partially within the peripheral region.

Abstract translation: 微电子组件可以包括具有第一和第二表面的基底，每个第一表面和第二表面各自沿第一和第二横向方向延伸，沿第二方向延伸的周边边缘，在第一和第二表面之间延伸的第一和第二开口以及第二表面的周边区域 在周边边缘和其中一个开口之间延伸。 组件还可以包括具有面向第一表面的前表面的第一微电子元件，与其相对的后表面以及在前表面和后表面之间延伸的边缘。 组件还可以包括具有面向第一微电子元件的后表面的前表面并突出超过第一微电子元件的边缘的第二微电子元件。 组件还可以包括在第二表面处暴露的多个端子，至少一个端子至少部分地设置在周边区域内。

公开(公告)号：US09013033B2

公开(公告)日：2015-04-21

申请号：US13741890

申请日：2013-01-15

Applicant: Tessera, Inc.

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp ,  Ilyas Mohammed ,  Frank Lambrecht

IPC: H01L23/498 ,  H01L23/492 ,  H01L23/00 ,  H01L25/065 ,  H01L23/13 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/492 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/09 ,  H01L24/32 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/0912 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/50 ,  H01L2224/73215 ,  H01L2224/73219 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic assembly can include a substrate having first and second surfaces each extending in first and second transverse directions, a peripheral edge extending in the second direction, first and second openings extending between the first and second surfaces, and a peripheral region of the second surface extending between the peripheral edge and one of the openings. The assembly can also include a first microelectronic element having a front surface facing the first surface, a rear surface opposite therefrom, and an edge extending between the front and rear surfaces. The assembly can also include a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond the edge of the first microelectronic element. The assembly can also include a plurality of terminals exposed at the second surface, at least one of the terminals being disposed at least partially within the peripheral region.

Abstract translation: 微电子组件可以包括具有第一和第二表面的基底，每个第一表面和第二表面各自沿第一和第二横向方向延伸，沿第二方向延伸的周边边缘，在第一和第二表面之间延伸的第一和第二开口以及第二表面的周边区域 在周边边缘和其中一个开口之间延伸。 组件还可以包括具有面向第一表面的前表面的第一微电子元件，与其相对的后表面以及在前表面和后表面之间延伸的边缘。 组件还可以包括具有面向第一微电子元件的后表面的前表面并突出超过第一微电子元件的边缘的第二微电子元件。 组件还可以包括在第二表面处暴露的多个端子，至少一个端子至少部分地设置在周边区域内。

公开(公告)号：US08952516B2

公开(公告)日：2015-02-10

申请号：US13658401

申请日：2012-10-23

Applicant: Tessera, Inc.

Inventor： Wael Zohni ,  Belgacem Haba

IPC: H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L29/40 ,  H01L23/52 ,  H05K7/00 ,  H01L25/065 ,  H01L23/13 ,  H01L25/10 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49575 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/29034 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/206 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package can include a substrate having first and second opposed surfaces, and first and second microelectronic elements having front surfaces facing the first surface. The substrate can have a plurality of substrate contacts at the first surface and a plurality of terminals at the second surface. Each microelectronic element can have a plurality of element contacts at the front surface thereof. The element contacts can be joined with corresponding ones of the substrate contacts. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto. The element contacts of the first microelectronic element can be arranged in an area array and are flip-chip bonded with a first set of the substrate contacts. The element contacts of the second microelectronic element can be joined with a second set of the substrate contacts by conductive masses.

Abstract translation: 微电子封装可以包括具有第一和第二相对表面的衬底，以及具有面向第一表面的前表面的第一和第二微电子元件。 基板可以在第一表面具有多个基板触点，在第二表面可以具有多个端子。 每个微电子元件可以在其前表面具有多个元件触点。 元件触点可以与相应的基板触点连接。 第二微电子元件的前表面可以部分地覆盖在第一微电子元件的后表面上并且可以附接到第一微电子元件的后表面。 第一微电子元件的元件触点可以布置在区域阵列中，并且与第一组基板触点倒装芯片接合。 第二微电子元件的元件触点可以通过导电块与第二组基板触点接合。

公开(公告)号：US20140239513A1

公开(公告)日：2014-08-28

申请号：US14270885

申请日：2014-05-06

Applicant: Tessera, Inc.

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H01L25/065

CPC classification number: H01L25/065 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L25/105 ,  H01L27/14618 ,  H01L2223/6611 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48096 ,  H01L2224/4824 ,  H01L2224/48477 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49174 ,  H01L2224/4945 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A microelectronic assembly includes a dielectric element having first and second surfaces, first and second apertures extending between the first and second surfaces and defining a central region of the first surface between the first and second apertures, first and second microelectronic elements, and leads extending from contacts exposed at respective front surfaces of the first and second microelectronic elements to central terminals exposed at the central region. The front surface of the first microelectronic element can face the second surface of the dielectric element. The front surface of the second microelectronic element can face a rear surface of the first microelectronic element. The contacts of the second microelectronic element can project beyond an edge of the first microelectronic element. At least first and second ones of the leads can electrically interconnect a first central terminal of the central terminals with each of the first and second microelectronic elements.

Abstract translation: 微电子组件包括具有第一和第二表面的电介质元件，第一和第二孔在第一和第二表面之间延伸并且限定第一和第二孔之间的第一表面的中心区域，第一和第二微电子元件以及从 在第一和第二微电子元件的相应前表面处暴露在中央区域的中心端子的触点。 第一微电子元件的前表面可面向电介质元件的第二表面。 第二微电子元件的前表面可面对第一微电子元件的后表面。 第二微电子元件的触点可突出超过第一微电子元件的边缘。 至少第一和第二引线可以将中心端子的第一中心端子与第一和第二微电子元件中的每一个电互连。

公开(公告)号：US20140042644A1

公开(公告)日：2014-02-13

申请号：US14058908

申请日：2013-10-21

Applicant: Tessera, Inc.

Inventor： Belgacem Haba ,  Richard Dewitt Crisp ,  Wael Zohni

IPC: H01L25/07

CPC classification number: H01L25/071 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32245

Abstract: A microelectronic assembly can include a substrate having an aperture extending between first and second surfaces thereof, the substrate having substrate contacts at the first surface and terminals at the second surface. The microelectronic assembly can include a first microelectronic element having a front surface facing the first surface, a second microelectronic element having a front surface facing the first microelectronic element, and leads electrically connecting the contacts of the second microelectronic element with the terminals. The second microelectronic element can have contacts exposed at the front surface thereof beyond an edge of the first microelectronic element. The first microelectronic element can be configured to regenerate at least some signals received by the microelectronic assembly at the terminals and to transmit said signals to the second microelectronic element. The second microelectronic element can embody a greater number of active devices to provide memory storage array function than any other function.

Abstract translation: 微电子组件可以包括具有在其第一和第二表面之间延伸的孔的衬底，衬底在第一表面具有衬底触点，在第二表面具有端子。 微电子组件可以包括具有面向第一表面的前表面的第一微电子元件，具有面向第一微电子元件的前表面的第二微电子元件，以及将第二微电子元件的触点与端子电连接的引线。 第二微电子元件可以具有在其前表面处暴露于第一微电子元件的边缘之外的触点。 第一微电子元件可以被配置为在端子处再生由微电子组件接收的至少一些信号，并将所述信号传输到第二微电子元件。 第二微电子元件可以体现更多数量的有源器件以提供比任何其他功能的存储器阵列功能。

公开(公告)号：US09640515B2

公开(公告)日：2017-05-02

申请号：US15094087

申请日：2016-04-08

Applicant: Tessera, Inc.

Inventor： Wael Zohni ,  Belgacem Haba

IPC: H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L25/065 ,  H01L23/13 ,  H01L23/495 ,  H01L25/10 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49575 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/29034 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/206 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package can include a substrate having first and second opposed surfaces, and first and second microelectronic elements having front surfaces facing the first surface. The substrate can have a plurality of substrate contacts at the first surface and a plurality of terminals at the second surface. Each microelectronic element can have a plurality of element contacts at the front surface thereof. The element contacts can be joined with corresponding ones of the substrate contacts. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto. The element contacts of the first microelectronic element can be arranged in an area array and are flip-chip bonded with a first set of the substrate contacts. The element contacts of the second microelectronic element can be joined with a second set of the substrate contacts by conductive masses.

公开(公告)号：US09312239B2

公开(公告)日：2016-04-12

申请号：US14605208

申请日：2015-01-26

Applicant: Tessera, Inc.

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H05K7/00 ,  H05K1/11 ,  H05K1/14 ,  H01L25/065 ,  H01L23/13 ,  H01L23/367 ,  H01L23/433 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10 ,  H01L23/373 ,  H01L23/31

CPC classification number: H01L25/0652 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/14 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/06136 ,  H01L2224/13014 ,  H01L2224/14519 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/49111 ,  H01L2224/731 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A microelectronic assembly includes a first unit and a second unit overlying the first unit. Each of the units include a dielectric element that includes first and second apertures, first and second microelectronic elements, first leads extending from contacts of the first microelectronic element through the first aperture, and second leads extending from contacts of the second microelectronic element through the second aperture. The microelectronic assembly further includes a heat spreader that is thermally coupled to at least one of the first microelectronic element or the second microelectronic element of the first unit. The heat spreader may be a monolithic structure having apertures substantially aligned with the contacts of the first and second microelectronic elements of the first unit.

Abstract translation: 微电子组件包括第一单元和覆盖第一单元的第二单元。 每个单元包括包括第一和第二孔的电介质元件，第一和第二微电子元件，从第一微电子元件的触点延伸穿过第一孔的第一引线和从第二微电子元件的触点延伸穿过第二微电子元件的第二引线 光圈。 微电子组件还包括热耦合到第一单元的第一微电子元件或第二微电子元件中的至少一个的散热器。 散热器可以是具有与第一单元的第一和第二微电子元件的触点基本对准的孔的整体结构。