公开(公告)号：US20180025967A1

公开(公告)日：2018-01-25

申请号：US15715725

申请日：2017-09-26

Applicant: Tessera, Inc.

Inventor： Belgacem Haba ,  Richard Dewitt Crisp ,  Wael Zohni

IPC: H01L23/50 ,  H01L25/10 ,  H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L25/16 ,  H01L23/13 ,  H01L25/18

CPC classification number: H01L23/50 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/29101 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48472 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1047 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1435 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/14511 ,  H01L2924/15151 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15172 ,  H01L2924/15182 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microelectronic assembly can include a substrate having first and second surfaces and an aperture extending therebetween, the substrate having terminals. The assembly can also include a first microelectronic element having a front surface facing the first surface of the substrate, a second microelectronic element having a front surface facing the first microelectronic element and projecting beyond an edge of the first microelectronic element, first and second leads electrically connecting contacts of the respective first and second microelectronic elements to the terminals, and third leads electrically interconnecting the contacts of the first and second microelectronic elements. The contacts of the first microelectronic element can be exposed at the front surface thereof adjacent the edge thereof. The contacts of the second microelectronic element can be disposed in a central region of the front surface thereof. The first, second, and third leads can have portions aligned with the aperture.

公开(公告)号：US09461015B2

公开(公告)日：2016-10-04

申请号：US14270885

申请日：2014-05-06

Applicant: Tessera, Inc.

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H05K1/11 ,  H01L25/065 ,  H01L23/13 ,  H01L23/498 ,  H01L25/10 ,  H01L23/31 ,  H01L23/00 ,  H01L27/146

CPC classification number: H01L25/065 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L25/105 ,  H01L27/14618 ,  H01L2223/6611 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48096 ,  H01L2224/4824 ,  H01L2224/48477 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49174 ,  H01L2224/4945 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A microelectronic assembly includes a dielectric element having first and second surfaces, first and second apertures extending between the first and second surfaces and defining a central region of the first surface between the first and second apertures, first and second microelectronic elements, and leads extending from contacts exposed at respective front surfaces of the first and second microelectronic elements to central terminals exposed at the central region. The front surface of the first microelectronic element can face the second surface of the dielectric element. The front surface of the second microelectronic element can face a rear surface of the first microelectronic element. The contacts of the second microelectronic element can project beyond an edge of the first microelectronic element. At least first and second ones of the leads can electrically interconnect a first central terminal of the central terminals with each of the first and second microelectronic elements.

Abstract translation: 微电子组件包括具有第一和第二表面的电介质元件，第一和第二孔在第一和第二表面之间延伸并且限定第一和第二孔之间的第一表面的中心区域，第一和第二微电子元件以及从 在第一和第二微电子元件的相应前表面处暴露在中央区域的中心端子的触点。 第一微电子元件的前表面可面向电介质元件的第二表面。 第二微电子元件的前表面可面对第一微电子元件的后表面。 第二微电子元件的触点可突出超过第一微电子元件的边缘。 至少第一和第二引线可以将中心端子的第一中心端子与第一和第二微电子元件中的每一个电互连。

公开(公告)号：US20160225746A1

公开(公告)日：2016-08-04

申请号：US15094087

申请日：2016-04-08

Applicant: Tessera, Inc.

Inventor： Wael Zohni ,  Belgacem Haba

IPC: H01L25/065

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49575 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/29034 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/206 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package can include a substrate having first and second opposed surfaces, and first and second microelectronic elements having front surfaces facing the first surface. The substrate can have a plurality of substrate contacts at the first surface and a plurality of terminals at the second surface. Each microelectronic element can have a plurality of element contacts at the front surface thereof. The element contacts can be joined with corresponding ones of the substrate contacts. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto. The element contacts of the first microelectronic element can be arranged in an area array and are flip-chip bonded with a first set of the substrate contacts. The element contacts of the second microelectronic element can be joined with a second set of the substrate contacts by conductive masses.

公开(公告)号：US20160190048A1

公开(公告)日：2016-06-30

申请号：US15061149

申请日：2016-03-04

Applicant: Tessera, Inc.

Inventor： Wael Zohni ,  Belgacem Haba

IPC: H01L23/495 ,  H01L25/00 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49575 ,  G11C5/04 ,  G11C5/06 ,  H01L23/13 ,  H01L23/4951 ,  H01L23/49541 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06156 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/207 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/014

Abstract: A module can include a module card and first and second microelectronic elements having front surfaces facing a first surface of the module card. The module card can also have a second surface and a plurality of parallel exposed edge contacts adjacent an edge of at least one of the first and second surfaces for mating with corresponding contacts of a socket when the module is inserted in the socket. Each microelectronic element can be electrically connected to the module card. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto.

Abstract translation: 模块可以包括模块卡和具有面向模块卡的第一表面的前表面的第一和第二微电子元件。 模块卡还可以具有邻近第一和第二表面中的至少一个表面的边缘的第二表面和多个平行的暴露的边缘接触件，用于当模块插入插座时与插座的相应接触件配合。 每个微电子元件可以电连接到模块卡。 第二微电子元件的前表面可以部分地覆盖在第一微电子元件的后表面上并且可以附接到第一微电子元件的后表面。

公开(公告)号：US09281266B2

公开(公告)日：2016-03-08

申请号：US14156967

申请日：2014-01-16

Applicant: Tessera, Inc.

Inventor： Wael Zohni ,  Belgacem Haba

IPC: H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/495 ,  H01L25/065 ,  H01L25/10 ,  G11C5/04 ,  G11C5/06 ,  H01L25/00 ,  H01L23/13 ,  H01L23/00

CPC classification number: H01L23/49575 ,  G11C5/04 ,  G11C5/06 ,  H01L23/13 ,  H01L23/4951 ,  H01L23/49541 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06156 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/207 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/014

Abstract: A module can include a module card and first and second microelectronic elements having front surfaces facing a first surface of the module card. The module card can also have a second surface and a plurality of parallel exposed edge contacts adjacent an edge of at least one of the first and second surfaces for mating with corresponding contacts of a socket when the module is inserted in the socket. Each microelectronic element can be electrically connected to the module card. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto.

Abstract translation: 模块可以包括模块卡和具有面向模块卡的第一表面的前表面的第一和第二微电子元件。 模块卡还可以具有邻近第一和第二表面中的至少一个表面的边缘的第二表面和多个平行的暴露的边缘接触件，用于当模块插入插座时与插座的相应接触件配合。 每个微电子元件可以电连接到模块卡。 第二微电子元件的前表面可以部分地覆盖在第一微电子元件的后表面上并且可以附接到第一微电子元件的后表面。

公开(公告)号：US08759982B2

公开(公告)日：2014-06-24

申请号：US13950912

申请日：2013-07-25

Applicant: Tessera, Inc.

Inventor： Richard Dewitt Crisp ,  Belgacem Haba ,  Wael Zohni

IPC: H01L23/52

CPC classification number: H01L23/48 ,  G11C5/06 ,  H01L23/3128 ,  H01L24/06 ,  H01L24/13 ,  H01L24/29 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/1203 ,  H01L2924/1205 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/15786 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package may have a plurality of terminals disposed at a face thereof which are configured for connection to at least one external component. e.g., a circuit panel. First and second microelectronic elements can be affixed with packaging structure therein. A first electrical connection can extend from a respective terminal of the package to a corresponding contact on the first microelectronic element, and a second electrical connection can extend from the respective terminal to a corresponding contact on the second microelectronic element, the first and second connections being configured such that a respective signal carried by the first and second connections in each group is subject to propagation delay of the same duration between the respective terminal and each of the corresponding contacts coupled thereto.

Abstract translation: 微电子封装可以具有设置在其面上的多个端子，其被配置为连接到至少一个外部部件。 例如电路板。 第一和第二微电子元件可以用其中的包装结构固定。 第一电连接可以从封装的相应端子延伸到第一微电子元件上的相应触点，并且第二电连接可以从相应端子延伸到第二微电子元件上的相应触点，第一和第二连接是 被配置为使得由每个组中的第一和第二连接承载的相应信号在相应的终端和与其耦合的每个对应的触点之间经历相同持续时间的传播延迟。

公开(公告)号：US20130127062A1

公开(公告)日：2013-05-23

申请号：US13741890

申请日：2013-01-15

Applicant: Tessera, Inc.

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp ,  Ilyas Mohammed ,  Frank Lambrecht

IPC: H01L23/492

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/492 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/09 ,  H01L24/32 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/0912 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/50 ,  H01L2224/73215 ,  H01L2224/73219 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic assembly can include a substrate having first and second surfaces each extending in first and second transverse directions, a peripheral edge extending in the second direction, first and second openings extending between the first and second surfaces, and a peripheral region of the second surface extending between the peripheral edge and one of the openings. The assembly can also include a first microelectronic element having a front surface facing the first surface, a rear surface opposite therefrom, and an edge extending between the front and rear surfaces. The assembly can also include a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond the edge of the first microelectronic element. The assembly can also include a plurality of terminals exposed at the second surface, at least one of the terminals being disposed at least partially within the peripheral region.

公开(公告)号：US20130100616A1

公开(公告)日：2013-04-25

申请号：US13658401

申请日：2012-10-23

Applicant: Tessera, Inc.

Inventor： Wael Zohni ,  Belgacem Haba

IPC: H01L23/48 ,  H05K7/06

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49575 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/29034 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/206 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package can include a substrate having first and second opposed surfaces, and first and second microelectronic elements having front surfaces facing the first surface. The substrate can have a plurality of substrate contacts at the first surface and a plurality of terminals at the second surface. Each microelectronic element can have a plurality of element contacts at the front surface thereof. The element contacts can be joined with corresponding ones of the substrate contacts. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto. The element contacts of the first microelectronic element can be arranged in an area array and are flip-chip bonded with a first set of the substrate contacts. The element contacts of the second microelectronic element can be joined with a second set of the substrate contacts by conductive masses.

公开(公告)号：US20130056870A1

公开(公告)日：2013-03-07

申请号：US13668974

申请日：2012-11-05

Applicant: TESSERA, INC.

Inventor： Belgacem Haba ,  Richard Dewitt Crisp ,  Wael Zohni

IPC: H01L23/498

CPC classification number: H01L25/071 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32245

Abstract: A microelectronic assembly can include a substrate having oppositely-facing first and second surfaces and a first aperture extending between the first and second surfaces, a first microelectronic element having a surface facing the first surface, a second microelectronic element having a front surface facing the first microelectronic element, signal leads connected to contacts of the second microelectronic element and extending through the first aperture to at least some of a plurality of electrically conductive elements on the substrate, and at least one power regulation component having active circuit elements therein disposed between the first surface of the substrate and the front surface of the second microelectronic element. The first microelectronic element can have another surface remote from the surface of the first microelectronic element, and an edge extending between the surfaces thereof. The contacts of the second microelectronic element can project beyond the edge of the first microelectronic element.

Abstract translation: 微电子组件可以包括具有相对面对的第一和第二表面的基板和在第一和第二表面之间延伸的第一孔，第一微电子元件具有面向第一表面的表面，第二微电子元件具有面向第一和第二表面的前表面 微电子元件，信号引线连接到第二微电子元件的触点并且延伸穿过第一孔至衬底上的多个导电元件中的至少一些，并且至少一个功率调节元件具有其中的有源电路元件， 基板的表面和第二微电子元件的前表面。 第一微电子元件可以具有远离第一微电子元件的表面的另一表面，以及在其表面之间延伸的边缘。 第二微电子元件的触点可突出超过第一微电子元件的边缘。

公开(公告)号：US09905502B2

公开(公告)日：2018-02-27

申请号：US15263058

申请日：2016-09-12

Applicant: Tessera, Inc.

Inventor： Wael Zohni

IPC: H01L23/48 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/49811 ,  H01L21/4846 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/84 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11003 ,  H01L2224/11332 ,  H01L2224/1134 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/13566 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/16111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/1624 ,  H01L2224/32225 ,  H01L2224/40106 ,  H01L2224/4024 ,  H01L2224/40475 ,  H01L2224/41176 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4813 ,  H01L2224/48225 ,  H01L2224/484 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/73204 ,  H01L2224/73213 ,  H01L2224/81192 ,  H01L2224/8184 ,  H01L2224/84 ,  H01L2224/8502 ,  H01L2224/85355 ,  H01L2224/8584 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/37099

Abstract: A method is disclosed of fabricating a microelectronic package comprising a substrate overlying the front face of a microelectronic element. A plurality of metal bumps project from conductive elements of the substrate towards the microelectronic element, the metal bumps having first ends extending from the conductive elements, second ends remote from the conductive elements, and lateral surfaces extending between the first and second ends. The metal bumps can be wire bonds having first and second ends attached to a same conductive pad of the substrate. A conductive matrix material contacts at least portions of the lateral surfaces of respective ones of the metal bumps and joins the metal bumps with contacts of the microelectronic element.